Patents by Inventor Steve V. Drehobl

Steve V. Drehobl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit package having interchip bonding and method therefor
    Patent number: 6333549
    Abstract: An integrated circuit package that has the ability for interdevice communication. The integrated circuit package has a first device mounted within the integrated circuit package. A second device is also mounted within the integrated circuit package. The second device is directly coupled to the first device through interdevice bonding for allowing the first device and the second device to communicate and control one another.
    Type: Grant
    Filed: December 8, 2000
    Date of Patent: December 25, 2001
    Assignee: Microchip Technology Incorporated
    Inventors: Steve V. Drehobl, Joseph D. Fernandez, Mike Charles
  • Integrated circuit package having interchip bonding and method therefor
    Publication number: 20010002065
    Abstract: An integrated circuit package that has the ability for interdevice communication. The integrated circuit package has a first device mounted within the integrated circuit package. A second device is also mounted within the integrated circuit package. The second device is directly coupled to the first device through interdevice bonding for allowing the first device and the second device to communicate and control one another.
    Type: Application
    Filed: December 8, 2000
    Publication date: May 31, 2001
    Inventors: Steve V. Drehobl, Joseph D. Fernandez, Mike Charles
  • Integrated circuit package having interchip bonding and method therefor
    Patent number: 6159765
    Abstract: An integrated circuit package that has the ability for interdevice communication. The integrated circuit package has a first device mounted within the integrated circuit package. A second device is also mounted within the integrated circuit package. The second device is directly coupled to the first device through interdevice bonding for allowing the first device and the second device to communicate and control one another.
    Type: Grant
    Filed: March 6, 1998
    Date of Patent: December 12, 2000
    Assignee: Microchip Technology, Incorporated
    Inventors: Steve V. Drehobl, Joseph D. Fernandez, Mike Charles