Patents by Inventor Steve W. Greathouse

Steve W. Greathouse has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MEMS packaging using a non-silicon substrate for encapsulation and interconnection
    Patent number: 7368808
    Abstract: A MEMS die is bonded to a cap to form a MEMS device. The cap is non-silicon and has an electrical via extending from one side of the cap to another side of the cap. In one embodiment, a plurality of caps is wafer bonded to a plurality of MEMS dice.
    Type: Grant
    Filed: June 30, 2003
    Date of Patent: May 6, 2008
    Assignee: Intel Corporation
    Inventors: John Heck, Joseph S. Hayden, III, Steve W. Greathouse, Daniel M. Wong
  • Paper substrates for use in integrated circuit packaging molding processes
    Patent number: 6436318
    Abstract: An apparatus and method for collecting compounds from a mold press is described herein. A paper substrate is loaded into a mold press in the same manner as a conventional substrate to collect compounds during set-up, cleaning and/or conditioning cycles. The used paper substrate with the cured compound is then discarded after use. Use of a paper substrate provides significant cost savings over the currently used metal-based substrate.
    Type: Grant
    Filed: March 30, 2000
    Date of Patent: August 20, 2002
    Assignee: Intel Corporation
    Inventors: Jonathan L. McFarland, Steve W. Greathouse, Eric Gelvin