Patents by Inventor Steve Whitehead

Steve Whitehead has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9865564
    Abstract: A system for laser ashing of polyimide for a semiconductor manufacturing process is provided. The system includes: a semiconductor chip, a top chip attached to the semiconductor chip by a connection layer, a supporting material, a polyimide glue layer disposed between the supporting material and semiconductor chip, a plasma asher, and an ashing laser configured to ash the polyimide glue on the semiconductor chip.
    Type: Grant
    Filed: February 18, 2015
    Date of Patent: January 9, 2018
    Assignee: GLOBALFOUNDRIES INC
    Inventors: Maxime Cadotte, Luc Guerin, Van Thanh Truong, Steve Whitehead
  • Patent number: 9269603
    Abstract: An assembly including a liquid thermal interface material for surface tension adhesion and thermal control used during electrical/thermal test of a 3D wafer and methods of use. The method includes temporarily attaching a thinned wafer to a carrier wafer by applying a non-adhesive material therebetween and pressing the thinned wafer and the blank silicon-based carrier wafer together.
    Type: Grant
    Filed: May 9, 2013
    Date of Patent: February 23, 2016
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Luc Guerin, Marc D. Knox, George J. Lawson, Van T. Truong, Steve Whitehead
  • Publication number: 20150162300
    Abstract: A system for laser ashing of polyimide for a semiconductor manufacturing process is provided. The system includes: a semiconductor chip, a top chip attached to the semiconductor chip by a connection layer, a supporting material, a polyimide glue layer disposed between the supporting material and semiconductor chip, a plasma asher, and an ashing laser configured to ash the polyimide glue on the semiconductor chip.
    Type: Application
    Filed: February 18, 2015
    Publication date: June 11, 2015
    Inventors: Maxime Cadotte, Luc Guerin, Van Thanh Truong, Steve Whitehead
  • Patent number: 8999107
    Abstract: A method for laser ashing of polyimide for a semiconductor manufacturing process using a structure, the structure comprising a supporting material attached to a semiconductor chip by a polyimide glue, includes releasing the supporting material from the polyimide glue, such that the polyimide glue remains on the semiconductor chip; and ashing the polyimide glue on the semiconductor chip using an ablating laser.
    Type: Grant
    Filed: October 31, 2011
    Date of Patent: April 7, 2015
    Assignee: International Business Machines Corporation
    Inventors: Maxime Cadotte, Luc Guerin, Van Thanh Truong, Steve Whitehead
  • Publication number: 20140332810
    Abstract: An assembly including a liquid thermal interface material for surface tension adhesion and thermal control used during electrical/thermal test of a 3D wafer and methods of use. The method includes temporarily attaching a thinned wafer to a carrier wafer by applying a non-adhesive material therebetween and pressing the thinned wafer and the blank silicon-based carrier wafer together.
    Type: Application
    Filed: May 9, 2013
    Publication date: November 13, 2014
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Luc GUERIN, Marc D. KNOX, George J. LAWSON, Van T. TRUONG, Steve WHITEHEAD
  • Patent number: 8491644
    Abstract: A portable patient cooling apparatus is provided that includes a self-contained refrigerator and on-board power storage supply for stand alone operation. The apparatus is interconnectable to one or more heat exchange devices (e.g. patient contact pads or intravascular catheters) through which a cooled fluid may be circulated for patient cooling. Such fluid may be liquid contained within a reservoir comprising the apparatus during periods of non-use. The apparatus preferably defines a total volume of less than about 0.04 m3, while having a total weight of less than about 15 kg to yield a total circulated fluid cooling capacity of at least 200 watts.
    Type: Grant
    Filed: February 21, 2006
    Date of Patent: July 23, 2013
    Assignee: Medivance Incorporated
    Inventors: Gary Carson, Gary Gruzecki, Steve Whitehead
  • Publication number: 20120111496
    Abstract: A method for laser ashing of polyimide for a semiconductor manufacturing process using a structure, the structure comprising a supporting material attached to a semiconductor chip by a polyimide glue, includes releasing the supporting material from the polyimide glue, such that the polyimide glue remains on the semiconductor chip; and ashing the polyimide glue on the semiconductor chip using an ablating laser.
    Type: Application
    Filed: October 31, 2011
    Publication date: May 10, 2012
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Maxime Cadotte, Luc Guerin, Van Thanh Truong, Steve Whitehead