Abstract: A system for laser ashing of polyimide for a semiconductor manufacturing process is provided. The system includes: a semiconductor chip, a top chip attached to the semiconductor chip by a connection layer, a supporting material, a polyimide glue layer disposed between the supporting material and semiconductor chip, a plasma asher, and an ashing laser configured to ash the polyimide glue on the semiconductor chip.

Abstract: An assembly including a liquid thermal interface material for surface tension adhesion and thermal control used during electrical/thermal test of a 3D wafer and methods of use. The method includes temporarily attaching a thinned wafer to a carrier wafer by applying a non-adhesive material therebetween and pressing the thinned wafer and the blank silicon-based carrier wafer together.

Abstract: A system for laser ashing of polyimide for a semiconductor manufacturing process is provided. The system includes: a semiconductor chip, a top chip attached to the semiconductor chip by a connection layer, a supporting material, a polyimide glue layer disposed between the supporting material and semiconductor chip, a plasma asher, and an ashing laser configured to ash the polyimide glue on the semiconductor chip.

Abstract: A method for laser ashing of polyimide for a semiconductor manufacturing process using a structure, the structure comprising a supporting material attached to a semiconductor chip by a polyimide glue, includes releasing the supporting material from the polyimide glue, such that the polyimide glue remains on the semiconductor chip; and ashing the polyimide glue on the semiconductor chip using an ablating laser.

Abstract: An assembly including a liquid thermal interface material for surface tension adhesion and thermal control used during electrical/thermal test of a 3D wafer and methods of use. The method includes temporarily attaching a thinned wafer to a carrier wafer by applying a non-adhesive material therebetween and pressing the thinned wafer and the blank silicon-based carrier wafer together.

Abstract: A portable patient cooling apparatus is provided that includes a self-contained refrigerator and on-board power storage supply for stand alone operation. The apparatus is interconnectable to one or more heat exchange devices (e.g. patient contact pads or intravascular catheters) through which a cooled fluid may be circulated for patient cooling. Such fluid may be liquid contained within a reservoir comprising the apparatus during periods of non-use. The apparatus preferably defines a total volume of less than about 0.04 m3, while having a total weight of less than about 15 kg to yield a total circulated fluid cooling capacity of at least 200 watts.

Abstract: A method for laser ashing of polyimide for a semiconductor manufacturing process using a structure, the structure comprising a supporting material attached to a semiconductor chip by a polyimide glue, includes releasing the supporting material from the polyimide glue, such that the polyimide glue remains on the semiconductor chip; and ashing the polyimide glue on the semiconductor chip using an ablating laser.

Abstract: A composite tank for a rinse system comprises a plate, a plurality of general planar fiberglass reinforced plastic walls, and a generally planar bottom wall. The plurality of general planar fiberglass reinforced plastic walls are attached to the plate and extend generally upwardly therefrom. The walls cooperate with the plate to define an interior region of the tank. The generally planar bottom wall is positioned to lie above the plate and is received in the interior region of the tank. The bottom wall is made from fiberglass reinforced plastic and is attached to the reinforced plastic walls to provide a sealed interior region of the tank between the walls and the bottom wall and above the plate.

Abstract: A housing is provided for use in an industrial finishing equipment station. The housing includes housing wall panels, each having a top edge, a bottom edge, and two spaced-apart sides therebetween and a flange that is appended to the top and side edges. In addition, a clamp having flange-engaging portions is mounted upon the flanges appended to the top edges of the housing wall panels to couple the housing wall panels together. The housing wall panels are positioned to lie in opposing rows and cooperate to define a tunnel-like passageway workspace therebetween through which work pieces can pass.