Abstract: An apparatus being connectable as a latch stage into a asynchronous latch chain comprises a reception interface, wherein upon receipt of the first signal at the reception interface, the apparatus switches to one of the first power saving mode and a second power saving mode, depending on the second signal at the reception interface and wherein the apparatus offers a first power consumption and a first wake-up time in the first power saving mode, and a second power consumption and a second wake-up time in the second power saving mode.

Abstract: A method of non-destructive testing of a wood piece using a multiplicity of sensors. The method may include the steps of sensing the wood piece; collecting information from the sensors; and integrating the information into a physical model providing for strength and stiffness prediction. The collected information relate to material characteristics of the wood piece and to fiber quality characteristics of the wood piece. The material characteristics may include one or more of the following material characteristics of the wood piece: growth ring thickness; grain angle deviation; clear wood density; knot location; knot density; knot type; knot size; location in the tree from which the wood piece was cut.

Abstract: A semiconductor device having a stacked arrangement of a substrate and a first chip and a second chip is disclosed. In one embodiment, the first chip is arranged with a lower face on an upper face of the substrate; the second chip with a lower face on an upper face of the first chip, whereby a partial area of the upper face of the first chip that is adjacent to an edge of the first chip is uncovered by the second chip; a fifth wire contact pad is arranged on the uncovered area of the upper face of the first chip; a first bonding wire is arranged that is connected with a first wire contact pad of the substrate and the fifth wire contact pad of the first chip.

Abstract: A system including an electronic module with a heat spreader. One embodiment provides a plate including a thermally conductive material and a guiding member arranged along an edge of the plate. The plate and the guiding member of the heat spreader are configured to form, when attached to a first memory module, together with another heat spreader attached to a second memory module or together with a wall of another device, a duct channeling a flow of a coolant.

Abstract: Clip for attaching two outer panels to an intermediate panel, the clip comprising two arm portions each arm portion being configured to apply pressure to one of the outer panels in order to force the panel against a surface of the intermediate panel, and a bridge portion connecting the two arm portions, the bridge portion comprising a central section configured to provide mechanical coupling to the intermediate panel.

Abstract: A device can be used for applying a cooling element onto a module. The cooling element has a first side part and a second side part opposite the first side part. The first and second side parts are connected by a region. The device includes a spreader, which is adapted to spread apart the first and second side parts by mechanical pressure action on mutually opposite sides of the first and second side parts, so as to be able to guide a predetermined region of the module between the first and second side parts.

Abstract: A heat transfer apparatus for a memory module with a heat spreader that includes a channel being attachable on top of the memory module, and further includes attachment parts that are in thermal communication with the channel to engage with the heat spreader.

Abstract: The invention relates to a memory module heat sink, in particular for FB-DIMM memory modules, for dissipating heat generated in the memory module to the outside, having an essentially planar metal plate (100, 150) to which the memory module can be fixed, wherein the metal plate (100, 150) has on its outer edge a stiffening element (110, 160) that runs at least partially along the outer edge.

Abstract: A system including a heat transfer apparatus is disclosed. One embodiment provides for an electronic device and a heat transfer apparatus including a heat distribution plate with a first surface being at least in part in thermal communication with the electronic device. The thermal conductivity of the heat distribution plate is higher in a direction substantially parallel to the first surface than in a direction perpendicular to the first surface.

Abstract: A semiconductor device having a stacked arrangement of a substrate and a first chip and a second chip is disclosed. In one embodiment, the first chip is arranged with a lower face on an upper face of the substrate; the second chip with a lower face on an upper face of the first chip, whereby a partial area of the upper face of the first chip that is adjacent to an edge of the first chip is uncovered by the second chip; a fifth wire contact pad is arranged on the uncovered area of the upper face of the first chip; a first bonding wire is arranged that is connected with a first wire contact pad of the substrate and the fifth wire contact pad of the first chip.

Abstract: An apparatus interfaces a first circuit using a first supply voltage and a second circuit using a second supply voltage different from the first supply voltage. The apparatus includes a driver circuit having a driver network comprising driver supply voltage terminals connected to controllable switches. The controllable switches include resistive elements or are separated from resistive elements. A receiver circuit has a receiving network comprising a resistive element and receiver supply voltage terminals and a connection line connecting the driver circuit and the receiving circuit. The controllable switches have two switch configurations, a first switch configuration resulting in a high voltage on the connection line and a second switch configuration resulting in a low voltage on the connection line.

Abstract: An apparatus for providing a signal for transmission via a signal line includes a controller circuit having an output for a signal indicating whether the signal line is or will be in an inactive state and a switching circuit coupled to the controller circuit and having an output coupled to the signal line. The output is switched between different signal levels, if the signal indicates that the signal line is in an inactive state.

Abstract: An apparatus interfaces a first circuit using a first supply voltage and a second circuit using a second supply voltage different from the first supply voltage. The apparatus includes a driver circuit having a driver network comprising driver supply voltage terminals connected to controllable switches. The controllable switches include resistive elements or are separated from resistive elements. A receiver circuit has a receiving network comprising a resistive element and receiver supply voltage terminals and a connection line connecting the driver circuit and the receiving circuit. The controllable switches have two switch configurations, a first switch configuration resulting in a high voltage on the connection line and a second switch configuration resulting in a low voltage on the connection line.

Abstract: A memory buffer comprises a first asynchronous latch chain interface connectable to at least one of a memory controller and a memory buffer, a second data interface connected to a memory device, and a circuit comprising a buffer and a processor, the circuit being coupled to the first and the second interfaces, so that data can be passed between the first interface and the buffer and between the second interface and the buffer and so that the processor is capable of processing at least one of the data from the first interface to the second interface and the data from the second interface according to a data processing functionality, wherein the data processing functionality of the processor is changeable by a programming signal received via an interface of a memory buffer.

Abstract: An apparatus for transmitting signals over a signal line includes a transmitter with an output connectable to the signal line, for a synchronization signal in a power saving mode and a wanted signal in a normal mode of operation, wherein the synchronization signal has a reduced amplitude as compared to an amplitude of the wanted signal and has a periodic data pattern so that the synchronization signal permits maintaining an alignment of the synchronization signal and a reference signal in the receiver.

Abstract: An apparatus being connectable as a latch stage into a asynchronous latch chain comprises a reception interface, wherein upon receipt of the first signal at the reception interface, the apparatus switches to one of the first power saving mode and a second power saving mode, depending on the second signal at the reception interface and wherein the apparatus offers a first power consumption and a first wake-up time in the first power saving mode, and a second power consumption and a second wake-up time in the second power saving mode.

Abstract: An integrated circuit assembly including an integrated circuit device electrically connected to a signal line, and method of making the same. The invention also includes a heat dissipation device thermally coupled to the integrated circuit device and a termination resistor electrically connected to the signal line and the heat dissipation device.

Abstract: A memory module includes a cooling element with a board. The board includes a surface on which at least one first electronic component and at least one second electronic component are arranged, a cooling element that is arranged on the surface of the board and includes first and second sections extending in a first direction. At least one stabilizing element that extends in the first direction is arranged at first and second ends of the first section of the cooling element. A surface of the first section of the cooling element is at a first distance from the surface of the board and a surface of the second section of the cooling element is at a second distance from the surface of the board, the first distance being different from the second distance.

Abstract: An integrated power converter and input/output (I/O) port configured to provide power for a portable electronic device, and also interface data communications to the portable electronic device.

Abstract: A method of estimating the displaced size of a knot in a lumber piece includes the steps of: translating the lumber piece downstream along a flow path between a radiation source and sensor while simultaneously irradiating the lumber piece with radiation from the first radiation source whereby the radiation is attenuated by the lumber piece; collecting a set of radiation intensity data from the radiation sensor as the lumber piece is irradiated; processing the set of radiation intensity data to sum the radiation intensity data and to provide radiation intensity profiles transversely of the flow path direction and corresponding density profiles transversely of the flow path direction; mapping the density profiles to model a set of three dimensional density profiles of the lumber piece; processing the radiation intensity data to determine a clear wood density threshold value for the lumber piece and a maximum density value of the density profiles; and, computing a ratio of the summed density profile values to th