Patents by Inventor Steve Zhijian Chen

Steve Zhijian Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-column interleaved DIMM placement and routing topology
    Patent number: 11004476
    Abstract: In one embodiment, a printed circuit board (PCB) has a first central processing unit (CPU) socket and a second CPU socket substantially in line with the first CPU socket, and also has a first plurality of dual in-line memory module (DIMM) sockets interconnected with the first CPU socket and a second plurality of DIMM sockets interconnected with the second CPU socket (in a direction parallel to the first plurality of DIMM sockets). The first plurality of DIMM sockets are arranged on the PCB in at least a first column and a second column of DIMM sockets, and the second plurality of DIMM sockets are arranged on the PCB in at least the second column and a third column of DIMM sockets, such that the second column of DIMM sockets contains interleaved DIMM sockets from each of the first plurality of DIMM sockets and the second plurality of DIMM sockets.
    Type: Grant
    Filed: April 30, 2019
    Date of Patent: May 11, 2021
    Assignee: Cisco Technology, Inc.
    Inventors: Hoi San Leung, Steve Zhijian Chen, Richard Jiang Li, Minh-Thanh T. Vo, Shameem Ahmed, Kenny Lieu
  • MULTI-COLUMN INTERLEAVED DIMM PLACEMENT AND ROUTING TOPOLOGY
    Publication number: 20200349983
    Abstract: In one embodiment, a printed circuit board (PCB) has a first central processing unit (CPU) socket and a second CPU socket substantially in line with the first CPU socket, and also has a first plurality of dual in-line memory module (DIMM) sockets interconnected with the first CPU socket and a second plurality of DIMM sockets interconnected with the second CPU socket (in a direction parallel to the first plurality of DIMM sockets). The first plurality of DIMM sockets are arranged on the PCB in at least a first column and a second column of DIMM sockets, and the second plurality of DIMM sockets are arranged on the PCB in at least the second column and a third column of DIMM sockets, such that the second column of DIMM sockets contains interleaved DIMM sockets from each of the first plurality of DIMM sockets and the second plurality of DIMM sockets.
    Type: Application
    Filed: April 30, 2019
    Publication date: November 5, 2020
    Inventors: Hoi San Leung, Steve Zhijian Chen, Richard Jiang Li, Minh-Thanh T. Vo, Shameem Ahmed, Kenny Lieu