Abstract: A heater comprising a conduit made of corundum (e.g. synthetic sapphire) and having a wall forming a closed cross-section with an interior surface, and an exterior surface. At least one of the interior and exterior surfaces may have a roughened portion comprising inclusions and corresponding protrusions formed substantially continuously therethroughout. An electrically resistive coating may extend substantially continuously over, in, and around the inclusions and protrusions of at least a part of the roughened portion to form a conformal cross-section having a thickness selected to promote bending thereof to accommodate annular expansion and contraction occurring in response to a differential in the coefficients of expansion between the electrically resistive coating and the conduit.

Abstract: A method, computer program product, and apparatus for presenting data about security-related events that puts the data into a concise form is disclosed. Events are abstracted into a set data-type. Sets with common elements are grouped together, and summaries of the groups—“situations” are established from groups whose severity exceeds a threshold value. These groups and situations are then propagated up a hierarchical arrangement of systems and further aggregated so as to provide summary information over a larger group of systems. This hierarchical scheme allows for scalability of the event correlation process across larger networks of systems.

Abstract: An index tab adapter, suitable for retrofitting an existing file folder for use with a particular index tab style. The adapter has adhesive portions, located on either side of a non-adhesive portion. The non-adhesive portion is slotted and is spaced apart from the file folder. The slots are shaped to engage a particular style of index tab, so that when a given index tab is inserted into the slots in the adapter, the given index tab becomes attached to the file folder, and the file folder may be identified by the given index tab as if it were originally configured to accept the style of the given index tab. Put another way, an index tab removably engages slots in the adapter, rather than slots in the file folder itself.

Abstract: An apparatus for operably connecting an electrical source to a conductive coating or film. The apparatus may include a substrate made of a structural material. A conductive coating or thin film may be applied to the substrate. An interface layer may be applied over the conductive coating and conduct electricity thereto while transferring insufficient force to separate the conductive coating from the substrate. A conductor, for providing electricity to the interface layer comprising strands configured to be separable and electrically conductive, may be positioned in contact with the interface layer. A clamping mechanism may apply a clamping load urging the conductor toward the conductive coating. The strands of the conductor may be formed to distribute mechanical stress and strain induced by thermal expansion and the clamping load sufficiently to substantially reduce damage to the mechanical and electrical integrity of the conductive coating.

Abstract: An event handler is provided that associates events from heterogeneous data sources. In a first phase, incoming events are translated to vectors of event attributes. Based on the data source, implicit information about the event and its attributes may be available. This information is used to normalize the information provided by the event. Normalization actions may include renaming the attributes, deriving new attributes from given attributes, and transforming attribute value ranges. In a second phase, a determination is made as to whether two or more events are considered to be associated based on the vectors. Different vectors of core attributes may be created in order to create associations with different semantics.

Abstract: An apparatus for operably connecting an electrical source to a conductive coating or film. The apparatus may include a substrate made of a structural material. A conductive coating or thin film may be applied to the substrate. An interface layer may be applied over the conductive coating and conduct electricity thereto while transferring insufficient force to separate the conductive coating from the substrate. A conductor, for providing electricity to the interface layer comprising strands configured to be separable and electrically conductive, may be positioned in contact with the interface layer. A clamping mechanism may apply a clamping load urging the conductor toward the conductive coating. The strands of the conductor may be formed to distribute mechanical stress and strain induced by thermal expansion and the clamping load sufficiently to substantially reduce damage to the mechanical and electrical integrity of the conductive coating.

Abstract: A method for adhering a resistive coating to a substrate for use in process fluids employed in the semiconductor processing industry in clean, particle-free, nonreactive, non-trapping, ultra-pure, thermally tolerant, sealed systems. In one arrangement, the method may include the steps of selecting a substrate having a wall, modifying a surface of the wall to provide a roughened texture suitable for mechanically securing a coating thereto, and applying a conductive coating that is configured to be electrically resistive, to extend over at least a portion of the roughened texture, and to adhere thereto throughout variations in operational temperatures thereof.

Abstract: A heater for fluids, the heater comprising a conduit having a wall and a surface, the conduit being configured to convey a fluid. In one arrangement, the conduit surface is roughened to mechanically secure a coating thereto. A conductor, configured to be electrically resistive and to extend over at least a portion of a roughened surface, and to adhere thereto throughout variations in operational temperatures thereof. The heater provides a clean, particle-free, non-reactive, non-trapping, ultra-pure, thermally tolerant, sealed system. The system maintains process fluids clean, even upon system failure, at contaminant levels below parts per billion, or even parts per trillion. In one arrangement, the heater comprises a quartz conduit with an electroless nickel plating of an engineered thickness on an external surface forming a resistive heater. The resistive heater conducts thermal energy through the wall of the conduit.

Abstract: A method for adjusting resistivity of a film heater on a substrate for use in process fluids employed in the semiconductor-processing industry as part of a clean, particle-free, nonreactive, non-trapping, ultra-pure, thermally tolerant, sealed system. In one arrangement, the method includes the steps of selecting a heating rate, selecting an electrical resistance value in accordance with the heating rate, selecting a resistive material for coating a substrate to produce resistance heating consistent with the electrical resistance value, selecting dimensions for a film of the resistive material selected to balance effects of conductivity, resistivity, length, and area against effects of the heating rate, and forming the film by conformally coating a surface of the substrate with the film at the selected dimensions.

Abstract: A method, computer program product, and apparatus for presenting data about security-related events that puts the data into a concise form is disclosed. Events are abstracted into a set data-type. Sets with common elements are grouped together, and summaries of the groups—“situations” are established from groups whose severity exceeds a threshold value. These groups and situations are then propagated up a hierarchical arrangement of systems and further aggregated so as to provide summary information over a larger group of systems. This hierarchical scheme allows for scalability of the event correlation process across larger networks of systems.

Abstract: A method, computer program product, and apparatus for presenting data about security-related events that puts the data into a concise form is disclosed. Events are abstracted into a set data-type. Sets with common elements are grouped together, and summaries of the groups—“situations”—are presented to a user or administrator.

Abstract: An apparatus for operably connecting an electrical source to a conductive coating or film. The apparatus may include a substrate made of a structural material. A conductive coating or thin film may be applied to the substrate. An interface layer may be applied over the conductive coating and conduct electricity thereto while transferring insufficient force to separate the conductive coating from the substrate. A conductor, for providing electricity to the interface layer comprising strands configured to be separable and electrically conductive, may be positioned in contact with the interface layer. A clamping mechanism may apply a clamping load urging the conductor toward the conductive coating. The strands of the conductor may be formed to distribute mechanical stress and strain induced by thermal expansion and the clamping load sufficiently to substantially reduce damage to the mechanical and electrical integrity of the conductive coating.

Abstract: A method for adhering a resistive coating to a substrate for use in process fluids employed in the semiconductor processing industry in clean, particle-free, nonreactive, non-trapping, ultra-pure, thermally tolerant, sealed systems. In one arrangement, the method may include the steps of selecting a substrate having a wall, modifying a surface of the wall to provide a roughened texture suitable for mechanically securing a coating thereto, and applying a conductive coating that is configured to be electrically resistive, to extend over at least a portion of the roughened texture, and to adhere thereto throughout variations in operational temperatures thereof.

Abstract: A method for forming a resistor on a roughened surface for use in process fluids employed in the semiconductor-processing industry as part of a clean, particle-free, nonreactive, non-trapping, ultra-pure, thermally tolerant, sealed system. In one arrangement, the method for forming the resistor includes the steps of selecting a coating for the roughened surface from among the group of resistive materials, roughening a surface to promote mechanical adherence of the coating to the selection of a coating comprising resistive material, roughening a surface for promoting mechanical adherence of the resistive material thereto, and electroplating the resistive material onto the roughened surface to provide a uniformly controllable resistance in the coating.

Abstract: An apparatus for operably connecting an electrical source to a conductive coating or film. The apparatus may include a substrate made of a structural material. A conductive coating or thin film may be applied to the substrate. An interface layer may be applied over the conductive coating and conduct electricity thereto while transferring insufficient force to separate the conductive coating from the substrate. A conductor, for providing electricity to the interface layer comprising strands configured to be separable and electrically conductive, may be positioned in contact with the interface layer. A clamping mechanism may apply a clamping load urging the conductor toward the conductive coating. The strands of the conductor may be formed to distribute mechanical stress and strain induced by thermal expansion and the clamping load sufficiently to substantially reduce damage to the mechanical and electrical integrity of the conductive coating.

Abstract: An apparatus for operably connecting an electrical source to a conductive coating or film. The apparatus may include a substrate made of a structural material. A conductive coating or thin film may be applied to the substrate. An interface layer may be applied over the conductive coating and conduct electricity thereto while transferring insufficient force to separate the conductive coating from the substrate. A conductor, for providing electricity to the interface layer comprising strands configured to be separable and electrically conductive, may be positioned in contact with the interface layer. A clamping mechanism may apply a clamping load urging the conductor toward the conductive coating. The strands of the conductor may be formed to distribute mechanical stress and strain induced by thermal expansion and the clamping load sufficiently to substantially reduce damage to the mechanical and electrical integrity of the conductive coating.

Abstract: A heater for fluids, the heater comprising a conduit having a wall and a surface, the conduit being configured to convey a fluid. In one arrangement, the conduit surface is roughened to mechanically secure a coating thereto. A conductor, configured to be electrically resistive and to extend over at least a portion of a roughened surface, and to adhere thereto throughout variations in operational temperatures thereof. The heater provides a clean, particle-free, non-reactive, non-trapping, ultra-pure, thermally tolerant, sealed system. The system maintains process fluids clean, even upon system failure, at contaminant levels below parts per billion, or even parts per trillion. In one arrangement, the heater comprises a quartz conduit with an electroless nickel plating of an engineered thickness on an external surface forming a resistive heater. The resistive heater conducts thermal energy through the wall of the conduit.

Abstract: A method for adjusting resistivity of a film heater on a substrate for use in process fluids employed in the semiconductor-processing industry as part of a clean, particle-free, nonreactive, non-rapping, ultra-pure, thermally tolerant, sealed system. In one arrangement, the method includes the steps of selecting a heating rate, selecting an electrical resistance value in accordance with the heating rate, selecting a resistive material for coating a substrate to produce resistance heating consistent with the electrical resistance value, selecting dimensions for a film of the resistive material selected to balance effects of conductivity, resistivity, length, and area against effects of the heating rate, and forming the film by conformally coating a surface of the substrate with the film at the selected dimensions.

Abstract: A method for forming a resistor on a roughened surface for use in process fluids employed in the semiconductor-processing industry as part of a clean, particle-free, nonreactive, non-trapping, ultra-pure, thermally tolerant, sealed system. In one arrangement, the method for forming the resistor includes the steps of selecting a coating for the roughened surface from among the group of resistive materials, roughening a surface to promote mechanical adherence of the coating to the selection of a coating comprising resistive material, roughening a surface for promoting mechanical adherence of the resistive material thereto, and electroplating the resistive material onto the roughened surface to provide a uniformly controllable resistance in the coating.

Abstract: A system for producing vertical lift has a substantially rigid upper rotating disk (44) of dense solidity ratio whose discharge air flow is centrally routed via a vertical vortex shaft (24) to coact with lower coaxially rotating airfoil (34) and duct fan (36) elements. The upper disk (44) includes a spirally configured array of curved wings (40A-40D) which rotate in a first direction to produce lift and a cyclonic air discharge into an upper end of the vertical shaft (24). The lower rotating airfoil (34)/fan (36) elements are positioned at the lower end of the vertical shaft (24) and rotate in a counter direction to neutralize torques, induce downward air flow through the vertical shaft (24), and further provide lift and vertical thrust.