Abstract: A method of reworking a printed circuit board having a surface including areas needing to be reworked including the steps of covering the surface with a dielectric leaving uncovered at least the areas of the surface to be reworked, and selectively providing corrective circuitry on the dielectric interconnected to the uncovered areas of the surface needing to be reworked. In addition, a printed circuit board having a surface including reworked areas including a dielectric covering the surface leaving uncovered at least the reworked areas, and corrective circuitry on the dielectric interconnected to the uncovered reworked areas.

Abstract: A multi-pin probe including a printed circuit board with multiple electrically conductive vias, multiple probes, each probe inserted into one of the electrically conductive vias, and a housing having multiple cavities inserted over the multiple probes, each cavity having a first and a second aperture around one of the probes, the first aperture being smaller than the second aperture. In addition, a method of manufacturing a multi-pin probe including the steps of manufacturing a printed circuit board with multiple electrically conductive vias, inserting multiple probes into the electrically conductive vias, and inserting a housing having multiple cavities over the multiple probes, each cavity having a first and a second aperture around one of the probes, the first aperture being smaller than the second aperture.

Abstract: Disclosed is a method of reworking a circuit panel, and a reworked circuit panel structure. The method includes providing a conformal, polymeric, dielectric coating or coatings on the surface of the panel, providing conductive circuitization atop the conformal, polymeric, dielectric coating or coatings on the surface of the panel, and providing a top conformal, polymeric, dielectric coating atop the conductive circuitization layer. Also disclosed is a rerouted circuit panel having at least two surface features that are connected by a rerouted current lead. The current lead is formed of a dielectric encapsulated conductor electrically joining the two surface features. The dielectric encapsulated conductor structure includes a conformal, polymeric dielectric bottom layer adherent to a surface of the circuit board, with a provided conductor on the conformal, polymeric dielectric layer, and a conformal, polymeric dielectric layer provided atop the provided conductor.

Abstract: An apparatus for eliminating sidestream smoke from a cigarette or other smoking article includes a smoke collecting chamber adapted to collect sidestream smoke from the lit end of the smoking article along with air for combustion of the sidestream smoke and to direct the mixture of sidestream smoke and air to a combustion area associated with the smoke collecting chamber. An ignition device is included in the apparatus for igniting at least a portion of the sidestream smoke received in the combustion area by heating the smoke in the combustion area to an ignition temperature. The preferred ignition device includes a heat source for constantly producing a flame in the combustion area. The apparatus may also include a smoke particle capturing arrangement in a capture chamber connected to the smoke collecting chamber.