Abstract: A heat sink mounting configuration is provided that is configured to prevent the heat sink from damaging ball grid arrays (BGA) of an application specific integrated circuit (ASIC) mounted on a printed circuit board (PCB) when the line card is subjected to vibrations and shocks. The heat sink mounting configuration may include a set of screws configured to be at least partially disposed within the apertures of the heat sink to secure the heat sink to the PCB. The mounting configuration includes a resilient member and a spacer disposed around the screws proximate to the apertures. The resilient members are configured to bias the heat sink against the ASIC to maintain the heat sink in contact with the ASIC. The spacers are configured to prevent the heat sink from impacting the ASIC with forces large enough to damage the BGA when the line card is subjected to vibrations and shocks.

Abstract: A heat sink mounting configuration is provided that is configured to prevent the heat sink from damaging ball grid arrays (BGA) of an application specific integrated circuit (ASIC) mounted on a printed circuit board (PCB) when the line card is subjected to vibrations and shocks. The heat sink mounting configuration may include a set of screws configured to be at least partially disposed within the apertures of the heat sink to secure the heat sink to the PCB. The mounting configuration includes a resilient member and a spacer disposed around the screws proximate to the apertures. The resilient members are configured to bias the heat sink against the ASIC to maintain the heat sink in contact with the ASIC. The spacers are configured to prevent the heat sink from impacting the ASIC with forces large enough to damage the BGA when the line card is subjected to vibrations and shocks.

Abstract: A heat sink mounting configuration is provided that is configured to prevent the heat sink from damaging ball grid arrays (BGA) of an application specific integrated circuit (ASIC) mounted on a printed circuit board (PCB) when the line card is subjected to vibrations and shocks. The heat sink mounting configuration may include a set of screws configured to be at least partially disposed within the apertures of the heat sink to secure the heat sink to the PCB. The mounting configuration includes a resilient member and a spacer disposed around the screws proximate to the apertures. The resilient members are configured to bias the heat sink against the ASIC to maintain the heat sink in contact with the ASIC. The spacers are configured to prevent the heat sink from impacting the ASIC with forces large enough to damage the BGA when the line card is subjected to vibrations and shocks.

Abstract: A heat sink mounting configuration is provided that is configured to prevent the heat sink from damaging ball grid arrays (BGA) of an application specific integrated circuit (ASIC) mounted on a printed circuit board (PCB) when the line card is subjected to vibrations and shocks. The heat sink mounting configuration may include a set of screws configured to be at least partially disposed within the apertures of the heat sink to secure the heat sink to the PCB. The mounting configuration includes a resilient member and a spacer disposed around the screws proximate to the apertures. The resilient members are configured to bias the heat sink against the ASIC to maintain the heat sink in contact with the ASIC. The spacers are configured to prevent the heat sink from impacting the ASIC with forces large enough to damage the BGA when the line card is subjected to vibrations and shocks.

Abstract: A heat sink mounting configuration is provided that is configured to prevent the heat sink from damaging ball grid arrays (BGA) of an application specific integrated circuit (ASIC) mounted on a printed circuit board (PCB) when the line card is subjected to vibrations and shocks. The heat sink mounting configuration may include a set of screws configured to be at least partially disposed within the apertures of the heat sink to secure the heat sink to the PCB. The mounting configuration includes a resilient member and a spacer disposed around the screws proximate to the apertures. The resilient members are configured to bias the heat sink against the ASIC to maintain the heat sink in contact with the ASIC. The spacers are configured to prevent the heat sink from impacting the ASIC with forces large enough to damage the BGA when the line card is subjected to vibrations and shocks.

Abstract: A heat sink mounting configuration is provided that is configured to prevent the heat sink from damaging ball grid arrays (BGA) of an application specific integrated circuit (ASIC) mounted on a printed circuit board (PCB) when the line card is subjected to vibrations and shocks. The heat sink mounting configuration may include a set of screws configured to be at least partially disposed within the apertures of the heat sink to secure the heat sink to the PCB. The mounting configuration includes a resilient member and a spacer disposed around the screws proximate to the apertures. The resilient members are configured to bias the heat sink against the ASIC to maintain the heat sink in contact with the ASIC. The spacers are configured to prevent the heat sink from impacting the ASIC with forces large enough to damage the BGA when the line card is subjected to vibrations and shocks.

Abstract: Various implementations disclosed herein include apparatuses, systems, and methods for providing pull tabs for pluggable transceiver modules and/or adaptor modules. A pluggable transceiver module may include a pull tab that may have a visual indicator portion to provide a visual indication of the status of a pluggable transceiver module and/or the status of a network connection. The pluggable transceiver module may also include one or more LEDs, one or more wires, one or more light pipes, one or more latching components, and/or one or more tension components. An adaptor module may include a pull tab that may have a visual indicator portion to provide a visual indication of whether a pluggable transceiver module is compatible with the adaptor module. The adaptor module may also include one or more LEDs, one or more wires, one or more light pipes, one or more latching components, and/or one or more tension components.

Abstract: Techniques are provided for sending and receiving data communications between an enhanced Quad Small Form-Factor Pluggable (QSFP+) transceiver module and an enhanced Small Form-Factor Pluggable (SFP+) transceiver module. An adapter device is provided that has a first set of signal pins configured to interface with an SFP+ transceiver module and a second set of signal pins is provided that is configured to interface with a QSFP+ host port. A retimer unit is also provided that is configured to modify a 10G signal of a first electrical signal standard associated with the SFP+ transceiver module to a 10G signal of a second electrical standard associated with a QSFP+ transceiver module and to enhance a 10G signal of the second electrical signal standard to a 10G signal of the first electrical signal standard.

Abstract: An upscaling transceiver module is provided that is configured to provide data connectivity between transceiver modules. The upscaling transceiver module comprises a first connector and a second connector. The first connector is configured to interface with a first port of a host device, and the second connector is configured to interface with a second port of a second host device. The connectors support exchange of 10G signals. The upscaling transceiver module also comprises a multiplexing unit and a demultiplexing unit. The multiplexing unit receives a first and second 10G transmission signals. The multiplexing unit combines the first and second 10G transmission signals into a twenty gigabit per second (20G) transmission signal. The demultiplexing unit obtains a 20G receive signal from a system device and splits the 20G receive signal into first and second 10G receive signals.

Abstract: A pluggable module for releasable engagement with a computing device includes a first end portion, a second end portion and a release tab structure. The release tab structure connects with the first end portion to facilitate removal of the module from the port of the computing device and has a generally U-shaped profile including two elongated arms spatially distanced from each other and extending transversely from the first end portion and terminating at a crossbar that connects between the elongated arms. Portions of the elongated arms and the crossbar extend within a plane that is separated a sufficient distance from the cable connector so as to facilitate 360° of access around the cable connector during connection and removal of the cable connector with the cable connection port.

Abstract: Techniques are provided for sending and receiving data communications between an enhanced Quad Small Form-Factor Pluggable (QSFP+) transceiver module and an enhanced Small Form-Factor Pluggable (SFP+) transceiver module. An adapter device is provided that has a first set of signal pins configured to interface with an SFP+ transceiver module and a second set of signal pins is provided that is configured to interface with a QSFP+ host port. A retimer unit is also provided that is configured to modify a 10G signal of a first electrical signal standard associated with the SFP+ transceiver module to a 10G signal of a second electrical standard associated with a QSFP+ transceiver module and to enhance a 10G signal of the second electrical signal standard to a 10G signal of the first electrical signal standard.

Abstract: A pluggable module for releasable engagement with a computing device includes a first end portion, a second end portion and a release tab structure. The release tab structure connects with the first end portion to facilitate removal of the module from the port of the computing device and has a generally U-shaped profile including two elongated arms spatially distanced from each other and extending transversely from the first end portion and terminating at a crossbar that connects between the elongated arms. Portions of the elongated arms and the crossbar extend within a plane that is separated a sufficient distance from the cable connector so as to facilitate 360° of access around the cable connector during connection and removal of the cable connector with the cable connection port.

Abstract: In an embodiment of the present invention, at least one mechanical fastener is used to mount a voice coil magnet assembly of a hard disk drive on a housing of the hard disk drive. A layer of a material having a low friction coefficient is disposed between the housing and the voice coil magnet assembly.

Abstract: A card-through-connector fastener for reducing connector distortion is disclosed. One embodiment provides circuit card coupled with electronics associated with an actuator. A connector assembly is also coupled with the circuit card, the connector assembly for conveying data with respect to the circuit card. In addition, a fastener connectively couples the connector assembly with a portion of the housing, the fastener passing through the circuit card and providing fixed support between the connector assembly and the hard disk drive housing to reduce distortion transfer from the circuit card to the connector.

Abstract: An automated system for setting the linear distance from a mounting surface of a pivot cartridge to critical features on actuator arms is disclosed. This distance is set to eliminate the tolerance incurred via normal manufacturing of these components. The system adjusts for every component to customize each actuator and/or pivot assembly to meet the functionality requirements for disk drives.

Abstract: A card-through-connector fastener for reducing connector distortion is disclosed. One embodiment provides circuit card coupled with electronics associated with an actuator. A connector assembly is also coupled with the circuit card, the connector assembly for conveying data with respect to the circuit card. In addition, a fastener connectively couples the connector assembly with a portion of the housing, the fastener passing through the circuit card and providing fixed support between the connector assembly and the hard disk drive housing to reduce distortion transfer from the circuit card to the connector.

Abstract: In an embodiment of the present invention, at least one mechanical fastener is used to mount a voice coil magnet assembly of a hard disk drive on a housing of the hard disk drive. A layer of a material having a low friction coefficient is disposed between the housing and the voice coil magnet assembly.

Abstract: An apparatus for securing the internal rotational components of a disk drive utilizes an annular clamp retention device. The clamp retention device has a rigid, metallic, main ring body from which protrudes a plurality of compliant tabs having a generally L-shaped cross-section. The compliant tabs extend radially inward from the body to form an inner circular array of the tabs. In addition, a plurality of rigid planar flanges, which are larger than the compliant tabs, extend radially outward from the body. The compliant tabs are designed to engage the hub and cartridge of the disk drive rotational components at the upper end of the disk stack.

Abstract: A disk clamp for securing data storage disks to the hub of a spindle motor in a hard disk drive has a circumferential rib protruding from a lower surface of the disk clamp. A complementary recess is formed in the hub of the spindle motor for closely receiving the rib on the disk clamp. The inner diameter of the rib and the outer diameter of the recess are closely toleranced to provide a very precise centering feature for mounting and aligning the disk clamp with respect to the hub and spindle motor. This design reduces the complexity of the tooling and fixtures required to complete the assembly and the overall part cost is reduced.

Abstract: An automated system for setting the linear distance from a mounting surface of a pivot cartridge to critical features on actuator arms is disclosed. This distance is set to eliminate the tolerance incurred via normal manufacturing of these components. The system adjusts for every component to customize each actuator and/or pivot assembly to meet the functionality requirements for disk drives.