Patents by Inventor Steven A. Klein

Steven A. Klein has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10455685
    Abstract: An electronic device may include a circuit board, and the circuit board may include a dielectric material. A socket may be coupled to a first side of the circuit board, and the socket may be configured to receive a semiconductor package. A backing plate may be positioned on a second side of the circuit board. A spacer may be positioned between the backing plate and the circuit board. The spacer may alter the profile of the socket to provide a curved profile to the socket. The spacer may displace a portion of the socket in a first direction, for instance when the spacer is coupled between the backing plate and the circuit board.
    Type: Grant
    Filed: October 15, 2018
    Date of Patent: October 22, 2019
    Assignee: Intel Corporation
    Inventors: Steven A. Klein, Kuang Liu, Thomas A. Boyd, Luis Gil Rangel, Muffadal Mukadem, Shelby A. Ferguson, Francis Toth, Jr., Eric Buddrius, Ralph V. Miele, Sriram Srinivasan, Jeffory L. Smalley
  • Publication number: 20180089984
    Abstract: Techniques and mechanisms for determining a level of degradation of flexible circuitry. In an embodiment, a flexible substrate has disposed therein first circuitry and one or more components coupled thereto, the one or more components to monitor a physical property of the first circuitry. Further disposed in or on the flexible substrate are memory resources to store predefined reference information which corresponds amounts of the physical property each with a different respective level of degradation. Evaluation logic accesses the reference information to determine, based on a detected amount of the physical property, a level of degradation of second circuitry. In another embodiment, the second circuitry is more flexible, as compared to the first circuitry.
    Type: Application
    Filed: September 27, 2016
    Publication date: March 29, 2018
    Inventors: Vijay Krishnan Subramanian, Steven A. Klein, Pramod Malatkar, Rajendra C. Dias, Aleksandar Aleksov, Jason P. Glumbik, Nadine L. Dabby
  • Publication number: 20170287799
    Abstract: A stiffener, an IC package and methods of fabrication of an IC package including a removable stiffener are shown. A removable stiffener for use with an integrated circuit (IC), including a plurality of adhesive portions disposed between a surface of the stiffener and a surface of a substrate of the IC is shown. Such a removable stiffener including at least one removal tab is shown. An IC package including a removable stiffener including a plurality of adhesive portions disposed between a surface of the stiffener and a surface of a substrate of the IC is shown. Methods of fabrication of an IC package including a removable stiffener are shown.
    Type: Application
    Filed: April 1, 2016
    Publication date: October 5, 2017
    Inventors: Steven A. Klein, Aditya S. Vaidya, Vijay Krishnan Subramanian, Santosh Sankarasubramanian, Pramod Malatkar, Suriyakala Suriya Ramalingam, Ashish Dhall
  • Publication number: 20170287873
    Abstract: An IC package, an electronic assembly, and methods of preventing warpage of components of an electronic assembly during fabrication of the electronic assembly are shown. An IC package including an adhesive disposed at or near at least one of four corners of a die of the IC package is shown. An electronic assembly including an IC package that includes an adhesive disposed at or near at least one of four corners of a second surface of a first substrate is shown. Methods of preventing warpage of components of an electronic assembly during fabrication of the electronic assembly that include applying an adhesive to at least one of four corners of a first surface of a first component are shown.
    Type: Application
    Filed: March 29, 2016
    Publication date: October 5, 2017
    Inventors: Santosh Sankarasubramanian, Hong Xie, Nachiket R. Raravikar, Steven A. Klein, Pramod Malatkar
  • Publication number: 20170268972
    Abstract: Embodiments are generally directed to a lateral expansion apparatus for mechanical testing of stretchable electronics. An embodiment of a system includes a compressible cylinder to apply mechanical forces to a stretchable electronics device by the compression and release of the compressible cylinder; a compression unit to compress to the compressible cylinder, wherein the compression unit is to apply a compression force in a direction along an axis of the compressible cylinder to generate lateral expansion of the compressible cylinder; and a testing logic to control compression and release of the compressible cylinder.
    Type: Application
    Filed: March 18, 2016
    Publication date: September 21, 2017
    Inventors: Vijay Krishnan SUBRAMANIAN, Steven A. KLEIN, Rajendra C. DIAS, Pramod MALATKAR, Aleksandar ALEKSOV, Ravindranath V. MAHAJAN, Robert L. SANKMAN
  • Publication number: 20170268971
    Abstract: Embodiments are generally directed to membrane test for mechanical testing of wearable devices. A mechanical testing system includes an actuation mechanism including a clamp to hold a membrane including stretchable electronics over an opening in the actuation mechanism, wherein the actuation mechanism is to apply pressure to the membrane through the opening; and a testing logic to control the application and release of pressure on the membrane by the actuation mechanism.
    Type: Application
    Filed: March 18, 2016
    Publication date: September 21, 2017
    Inventors: Ravindranth V. MAHAJAN, Rajendra C. DIAS, Pramod MALATKAR, Steven A. KLEIN, Vijay SUBRAMANIA, Aleksandar ALEKSOV, Robert L. SANKMAN
  • Publication number: 20170269017
    Abstract: Embodiments are generally directed to air bladder based mechanical testing for stretchable electronics. An embodiment of a system includes an inflatable bladder to apply mechanical force to a stretchable electronics device by the inflation and deflation of the inflatable bladder; a valve unit to control fluid pressure applied to the inflatable bladder; and a control unit to control inflation and deflation of the inflatable bladder.
    Type: Application
    Filed: March 18, 2016
    Publication date: September 21, 2017
    Inventors: Steven A. KLEIN, Rajendra C. DIAS, David C. MCCOY, Lars D. SKOGLUND, Vijay SUBRAMANIAN, Aleksander ALEKSOV, Pramod MALATKAR, Ravindranath V. MAHAJAN, Robert L. SANKMAN
  • Patent number: 6212641
    Abstract: A method and apparatus for improving power consumption characteristics of a system having an active mode and a low power mode. A signal source, such as a system clock, switches when the system is in active mode and does not switch when the system is in low power mode. An activity monitor is coupled to the signal source to detect if the signal source is switching. Based on the detection, the activity monitor drives switching control logic. The switching control logic disconnects nonessential auxiliary circuits from the power supply in response to a detection of a non-switching condition. When switching resumes, the switching control logic is driven by the activity monitor to restore power to the auxiliary circuit fast enough that power up does not delay system operation.
    Type: Grant
    Filed: July 23, 1998
    Date of Patent: April 3, 2001
    Assignee: Inside Out Networks
    Inventors: Andrew Frank, Steven A. Klein