Abstract: A switch comprises a first wafer having a thin-film structure defined thereon, a second wafer having a plurality of features defined therein, and a seal between the first wafer and the second wafer forming a two-wafer structure having a liquid metal microswitch defined therebetween.

Abstract: A three-stage liquid metal switch employing electrowetting on dielectric (EWOD), including a common EWOD switch 1310 having an input port 1302, a first shared-EWOD-switch output 1336, and a second shared-EWOD-switch output 1338; a first EWOD switch 1340 having a first-EWOD-switch input 1343, a first output port 1304, and a first-EWOD-switch output 1368; and a second EWOD switch 1370 having a second-EWOD-switch input 1373, a second output port 1306, and a second-EWOD-switch output 1398; wherein the first shared-EWOD-switch output 1336 is operably connected to the first-EWOD-switch input 1343, and the second shared-EWOD-switch output 1338 is operably connected to the second-EWOD-switch input 1373.

Abstract: An electrical component, such as a trace, signal line, or contact pad connected to the trace or signal line, is covered by one or more layers. The electrical component is connected directly to an electrical device by forming an opening through the one or more layers. The opening exposes a portion of the electrical component. A connector, such as a solder ball, a pin contact, or a wire bond, is then attached to the exposed portion of the electrical component. The connector connects directly to another electrical device to create an electrical connection between the electrical component and the electrical device. The electrical device may be configured, for example, as a second signal line or contact pad in another stripline circuit, a microstrip circuit, an integrated circuit, or an electrical component.

Abstract: A single channel optical interconnect for a fiber optic system includes a penetrator made of optically transmissive material and configured for insertion along the length of a plastic optical fiber for transferring light between the optical fiber and an optoelectronic device. A multiple channel optical interconnect uses a linear array of optoelectronic devices and corresponding optically transmissive penetrators. The penetrators may be pyramidal or conical bodies made of plastic or glass that are positioned above corresponding vertical cavity surface emitting lasers (VCSELs). The penetrators may also be etched directly into the substrates of bottom emitting VCSELs. The penetrators may have specially tailored side wall angles, or coatings, to facilitate coupling into the optical fibers and minimize back reflections into the VCSELs.

Abstract: A miniaturized relay with an integrated electromagnetic actuator allows scaling a reed relay to a small size to reduce the power needed to actuate it while retaining a high quality liquid metal contact. A dragged liquid metal contact is used. Coplanar waveguides may be used for the switched signal instead of microstrip transmission lines to reduce transmission line discontinuities that occur due to impedance changes.

Abstract: Liquid metal microrelays may be made where a contact is formed by constraining a quantity of liquid metal at the end of a contact support suspended over a substrate. Movement of the contact support typically drags the liquid metal along the surface of the substrate and allows the liquid metal to bridge contacts located on the substrate. Coplanar waveguides may be used for the switched signal instead of microstrip transmission lines to reduce transmission line discontinuities due to impedance changes.

Abstract: A folded flex circuit interconnect increases a number of interconnection pads of a grid array interface available to accommodate high count outputs from distinct circuit elements. The circuit interconnect includes a substrate capable of being folded, a conductor layer adjacent to a surface of the substrate, and a pad array having an interconnection pad connected to the conductor layer at a first end of the circuit interconnect. The pad array is part of the grid array interface. An optics module includes the folded flex circuit interconnect and an optical unit. The folded flex circuit interconnect further includes an electrical interface at a second end that is connected to the conductor layer. The folded flex circuit interconnect connects to the optical unit using the electrical interface. The circuit interconnect connects the optical unit to a motherboard using the pad array at the first end.