Patents by Inventor Steven Adam Klein

Steven Adam Klein has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250024622
    Abstract: Protrusions of socket bodies having metal are disclosed. An example apparatus comprises a socket body, the socket body including a plastic material, an array of contacts distributed across a surface of the socket body, and a protrusion extending away from the surface of the socket body, the protrusion to facilitate alignment of an IC package with the array of contacts, the protrusion including metal.
    Type: Application
    Filed: September 26, 2024
    Publication date: January 16, 2025
    Applicant: Intel Corporation
    Inventors: Richard Canham, Eric W. Buddrius, Jeffory L. Smalley, Garrett Frans Pauwels, Emery Evon Frey, Steven Adam Klein, Daniel Neumann
  • Publication number: 20250014967
    Abstract: Systems, apparatus, articles of manufacture, and methods to improve thermal dissipation and mechanical loading of integrated circuit packages are disclosed. An example apparatus includes: a socket to receive an integrated circuit package; and a plate to apply a load on the integrated circuit package towards the socket. The plate includes an internal channel to carry a coolant through the plate. The liquid coolant is to facilitate cooling of the integrated circuit package.
    Type: Application
    Filed: September 23, 2024
    Publication date: January 9, 2025
    Applicant: Intel Corporation
    Inventors: Kyle Jordan Arrington, Prabhakar Subrahmanyam, Steven Adam Klein, Kelly Porter Lofgreen, Joseph Blane Petrini
  • Publication number: 20240355702
    Abstract: Integrated circuit packages with dampeners to reduce vibration effects are disclosed. An example apparatus comprises a substrate, a semiconductor die carried by the substrate, and a dampener carried by the substrate. Further, the example dampener is dimensioned to interface with a heatsink when the heatsink is thermally coupled to the semiconductor die.
    Type: Application
    Filed: June 27, 2024
    Publication date: October 24, 2024
    Inventors: Phil Geng, Donald Tiendung Tran, Srikant Nekkanty, Baris Bicen, James Trevor Goulding, Jeffory L. Smalley, Steven Adam Klein, Andres Ramirez Macias
  • Publication number: 20240357744
    Abstract: Integrated circuit packages including carriers with incorporated substrates and interfaces are disclosed herein. An integrated circuit package carrier disclosed herein includes a frame including an opening to receive an integrated circuit package and at least one of (1) a circuitry component on a substrate on a surface of the frame or (2) a cable interface directly coupled to the frame.
    Type: Application
    Filed: June 27, 2024
    Publication date: October 24, 2024
    Applicant: Intel Corporation
    Inventors: Rick Canham, Jeffory L. Smalley, Steven Adam Klein, Shelby Ann Ferguson
  • Publication number: 20240355758
    Abstract: Systems, apparatus, articles of manufacture, and methods to reduce stress between sockets and associated integrated circuit packages having glass cores are disclosed. An example integrated circuit package includes: a semiconductor die, and a substrate including a glass core. The substrate includes a first surface, a second surface opposite the first surface, and a third surface between the first surface and the second surfaces. The first surface supports the semiconductor die. The second surface includes first contacts to electrical couple with second contacts in a socket. At least a portion of the third surface separated and distinct from the glass core.
    Type: Application
    Filed: June 27, 2024
    Publication date: October 24, 2024
    Applicant: Intel Corporation
    Inventors: Steven Adam Klein, Jason Gamba, Matthew Thomas Guzy, Nicholas Steven Haehn, Tarek Adly Ibrahim, Brandon Christian Marin, Srinivas Venkata Ramanuja Pietambaram, Jacob John Schichtel
  • Publication number: 20240349457
    Abstract: Damping assemblies for heat sinks and related methods are disclosed. An example apparatus includes a chassis; a first heat sink associated with an electronic component in the chassis; a second heat sink coupled to the first heat sink, the second heat sink spaced apart from the first heat sink in the chassis; and damping material proximate to the second heat sink.
    Type: Application
    Filed: June 26, 2024
    Publication date: October 17, 2024
    Inventors: Phil Geng, David Shia, Donald Tiendung Tran, James Trevor Goulding, Jeffory L. Smalley, Ralph V. Miele, Sanjoy Kumar Saha, Jing-Hua He, Steven Adam Klein, Ethan Russell Long, Andres Ramirez Macias, Irving Joseph Castro Guzman