Abstract: A mounting system for a storage drive includes a mounting bracket and a plurality of fasteners. The mounting bracket includes a first sidewall and a second sidewall, parallel to and spaced apart from the first sidewall. Each of the first and second sidewalls defines a plurality of apertures therein, spaced apart from one another and configured to align with corresponding threaded mounting apertures defined within the storage drive. The fasteners are positioned within apertures of the first and sidewalls. Each fastener has a head end and a distal end separated by a shaft having a first diameter. The distal end of each fastener is formed as a pin of a second diameter smaller than the first diameter and sized for linear, axial insertion within the corresponding threaded mounting apertures for an interference fit.

Abstract: Various electronic device enclosures, methods for securing an enclosure and methods for unsecuring an enclosure are described. An enclosure includes a first panel assembly, a second panel assembly, a plurality of first fasteners, and a plurality of second fasteners. A first fastener is provided with one of the first panel assembly and the second panel assembly. A second fastener corresponds to and is couplable with the first fastener and is provided with another of the first panel assembly and the second panel assembly. An interior location for the first fastener and/or the second fastener is not readily apparent when the enclosure is in a secured configuration. Coupling the first fastener with the second fastener secures the enclosure. The enclosure may be a cover flex window enclosure, a cover flex clip enclosure, a cover slide & hook clip enclosure, or a hinged cover with flex clip enclosure.

Abstract: An assembly, devices and processes for protecting electrical equipment may include a first sleeve hemisphere, a first sleeve proximal gasket positioned within the first sleeve hemisphere, a second sleeve hemisphere which mates with the first sleeve hemisphere to form a full sleeve and a second sleeve proximal gasket positioned within the second sleeve hemisphere. A cable protector may be formed by the mating of the first sleeve hemisphere with the second sleeve hemisphere and around at least a cable center section of a cable. The cable center section may be coupled to a cable proximal portion which is further coupled to a cable external proximal portion. When the cable protector is formed, the first sleeve proximal gasket combined with the second sleeve proximal gasket contact and surround the cable proximal portion and inhibit a proximal water inflow from the cable external proximal portion into the cable center section.

Abstract: A heat transfer assembly includes a heat plate coupled to a spring and to a graphite sheet. The spring is at first location corresponding to a heat source in an assembled device. The graphite sheet extends over at least a middle portion of the spring and over portions of the heat plate. The graphite sheet is coupled to a thermal pad positioned above a given surface of the heat source. The spring provides a compressive force on the thermal pad when the device is in an assembled state. The compressive force enhances thermal conductivity between the heat source and the heat transfer assembly. The heat plate may be positioned within and thermally coupled to a cover of the device. Principally by use of the thermal pad, graphite sheet, and thermal plate, heat generated by the heat source is transferred to the cover and then to the external environment.

Abstract: A heat transfer assembly includes a heat plate coupled to a spring and to a graphite sheet. The spring is at first location corresponding to a heat source in an assembled device. The graphite sheet extends over at least a middle portion of the spring and over portions of the heat plate. The graphite sheet is coupled to a thermal pad positioned above a given surface of the heat source. The spring provides a compressive force on the thermal pad when the device is in an assembled state. The compressive force enhances thermal conductivity between the heat source and the heat transfer assembly. The heat plate may be positioned within and thermally coupled to a cover of the device. Principally by use of the thermal pad, graphite sheet, and thermal plate, heat generated by the heat source is transferred to the cover and then to the external environment.