Abstract: A structure, comprising: a semiconductor structure having an electrically and thermally conductive layer disposed on one surface of the semiconductor structure; an electrically and thermally conductive heat sink; a electrically and thermally conductive carrier layer; a plurality of electrically and thermally nano-tubes, a first portion of the plurality of nano-tubes having proximal ends disposed on a first surface of the carrier layer and a second portion of the plurality of nano-tubes having proximal ends disposed on an opposite surface of the carrier layer; and a plurality of electrically and thermally conductive heat conductive tips disposed on distal ends of the plurality of nano-tubes, the plurality of heat conductive tips on the first portion of the plurality of nano-tubes being attached to the conductive layer, the plurality of heat conductive tips on the second portion of the plurality of nano-tubes being attached to the heat sink.

Abstract: A structure, comprising: a semiconductor structure having an electrically and thermally conductive layer disposed on one surface of the semiconductor structure; an electrically and thermally conductive heat sink; a electrically and thermally conductive carrier layer; a plurality of electrically and thermally nano-tubes, a first portion of the plurality of nano-tubes having proximal ends disposed on a first surface of the carrier layer and a second portion of the plurality of nano-tubes having proximal ends disposed on an opposite surface of the carrier layer; and a plurality of electrically and thermally conductive heat conductive tips disposed on distal ends of the plurality of nano-tubes, the plurality of heat conductive tips on the first portion of the plurality of nano-tubes being attached to the conductive layer, the plurality of heat conductive tips on the second portion of the plurality of nano-tubes being attached to the heat sink.

Abstract: A semiconductor structure having: an electrically and thermally conductive layer disposed on one surface of the semiconductor structure; an electrically and thermally conductive heat sink; a electrically and thermally conductive carrier layer; a plurality of electrically and thermally nano-tubes, a first portion of the plurality of nano-tubes having proximal ends disposed on a first surface of the carrier layer and a second portion of the plurality of nano-tubes having proximal ends disposed on an opposite surface of the carrier layer; and a plurality of electrically and thermally conductive heat conductive tips disposed on distal ends of the plurality of nano-tubes, the plurality of heat conductive tips on the first portion of the plurality of nano-tubes being attached to the conductive layer, the plurality of heat conductive tips on the second portion of the plurality of nano-tubes being attached to the heat sink.

Abstract: A structure, comprising: a semiconductor structure having an electrically and thermally conductive layer disposed on one surface of the semiconductor structure; an electrically and thermally conductive heat sink; a electrically and thermally conductive carrier layer; a plurality of electrically and thermally nano-tubes, a first portion of the plurality of nano-tubes having proximal ends disposed on a first surface of the carrier layer and a second portion of the plurality of nano-tubes having proximal ends disposed on an opposite surface of the carrier layer; and a plurality of electrically and thermally conductive heat conductive tips disposed on distal ends of the plurality of nano-tubes, the plurality of heat conductive tips on the first portion of the plurality of nano-tubes being attached to the conductive layer, the plurality of heat conductive tips on the second portion of the plurality of nano-tubes being attached to the heat sink.

Abstract: An electrical interconnect system is provided including a substrate and an array of electrical contacts held in the substrate. Each of the electrical contacts includes a nonconductive elastomeric element and an associated conductive element. The nonconductive element has opposite ends that are disposed beyond respective opposite sides of the substrate. The conductive element includes a body having opposite ends that are disposed exteriorly of the respective opposite ends of the nonconductive elastomeric element. The opposite ends of the nonconductive elastomeric element resiliently press against the respective opposite ends of the conductive element when a force is applied to the electrical contact.

Abstract: A connector for board-to-board or board-to-socket interconnect applications includes a plurality of conductive elastomeric columnar contacts surrounded by an insulative body. In one embodiment employed in board-to-board applications, the columnar contacts are substantially longer than wide to facilitate mounting of components between opposed boards. The conductive columnar contacts extend slightly beyond the surfaces of the insulative body. The body may include integral raised collars that surround opposing ends of the conductive columnar contacts and at least one stop flange integral with the body that limits overstress on tips of the conductive columnar contacts.

Abstract: A connector for board-to-board or board-to-socket interconnect applications includes a plurality of conductive elastomeric columnar contacts surrounded by an insulative body. In one embodiment employed in board-to-board applications, the columnar contacts are substantially longer than wide to facilitate mounting of components between opposed boards. The conductive columnar contacts extend slightly beyond the surfaces of the insulative body. The body may include integral raised collars that surround opposing ends of the conductive columnar contacts and at least one stop flange integral with the body that limits overstress on tips of the conductive columnar contacts.