Patents by Inventor Steven Baier

Steven Baier has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated capacitor with alternating layered segments
    Patent number: 7944732
    Abstract: A capacitor in an integrated circuit (“IC”) has a first node plate link formed in a first metal layer of the IC electrically connected to and forming a portion of a first node of the capacitor extending along a first axis (y) and a second node plate link formed in a second metal layer of the IC extending along the axis and connected to the first node plate with a via. A third node plate link formed in the first metal layer is electrically connected to and forming a portion of a second node of the capacitor and extends along a second axis (x) of the node plate array transverse to the first node plate link, proximate to an end of the first node plate link and overlying a portion of the second node plate link.
    Type: Grant
    Filed: November 21, 2008
    Date of Patent: May 17, 2011
    Assignee: Xilinx, Inc.
    Inventors: Jan Lodewijk de Jong, Steven Baier
  • INTEGRATED CAPACITOR WITH ALTERNATING LAYERED SEGMENTS
    Publication number: 20100127309
    Abstract: A capacitor in an integrated circuit (“IC”) has a first node plate link formed in a first metal layer of the IC electrically connected to and forming a portion of a first node of the capacitor extending along a first axis (y) and a second node plate link formed in a second metal layer of the IC extending along the axis and connected to the first node plate with a via. A third node plate link formed in the first metal layer is electrically connected to and forming a portion of a second node of the capacitor and extends along a second axis (x) of the node plate array transverse to the first node plate link, proximate to an end of the first node plate link and overlying a portion of the second node plate link.
    Type: Application
    Filed: November 21, 2008
    Publication date: May 27, 2010
    Applicant: Xilinx, Inc.
    Inventors: Jan Lodewijk de Jong, Steven Baier