Patents by Inventor Steven Boettcher

Steven Boettcher has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060065830
    Abstract: A method for preparing a transmission electron microscopy (TEM) sample for electron holography includes forming a sacrificial material over an area of interest on the sample, and polishing the sample to a desired thickness, wherein the area of interest is protected from rounding during the polishing. The sacrificial material is removed from the sample following the polishing.
    Type: Application
    Filed: September 30, 2004
    Publication date: March 30, 2006
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Thomas Bauer, Steven Boettcher, Anthony Domenicucci, John Gaudiello, Leon Kimball, Jeffrey McMurray, Yun-Yu Wang
  • Publication number: 20050269708
    Abstract: An interconnection structure is provided wherein comprises a substrate having a dielectric layer with a via opening therein; wherein the opening has a barrier layer; and electrodeposited copper.
    Type: Application
    Filed: July 5, 2005
    Publication date: December 8, 2005
    Inventors: Panayotis Andricacos, Steven Boettcher, Fenton McFeely, Milan Paunovic
  • Publication number: 20050006777
    Abstract: An interconnection structure comprising a substrate having a dielectric layer with a via opening therein; a barrier layer located in the via opening; an interlayer of palladium and/or platinum on the barrier layer; and a layer of copper or copper alloy on the interlayer is provided.
    Type: Application
    Filed: August 6, 2004
    Publication date: January 13, 2005
    Applicant: International Business Machines Corporation
    Inventors: Panayotis Andricacos, Steven Boettcher, Fenton McFeely, Milan Paunovic