Patents by Inventor STEVEN BOLEN

STEVEN BOLEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-channel MCM with test circuitry for inter-die bond wire checking
    Patent number: 9978712
    Abstract: A multichip module (MCM) device include a first die including functional circuitry bonded by a plurality of inter-die bond wires (bond wires) to a second die having functional circuitry. A first channel (Channel A) and second channel (Channel B) each have separate top and bottom signal paths (signal paths) including one of the bond wires. A failure of any of the signal paths does not affect functionality of the device. The first die includes input pins including a first input pin (P1), a second input pin (P2), and coupling circuitry including cross-channel test circuitry positioned between the input pins and the functional circuitry. The coupling circuitry provides for Channel A and Channel B a first configuration for normal mode operation and a second configuration for test mode operation for single bond wire testing for checking continuity of any of the bond wires.
    Type: Grant
    Filed: May 25, 2016
    Date of Patent: May 22, 2018
    Assignee: Texas Instruments Incorporated
    Inventors: Danyang Zhu, Zhuang Ma, Xinyu Yin, Michael Dean Shilhanek, Steven Bolen, Albert Eardley, Abha Singh Kasper
  • MULTI-CHANNEL MCM WITH TEST CIRCUITRY FOR INTER-DIE BOND WIRE CHECKING
    Publication number: 20170194285
    Abstract: A multichip module (MCM) device include a first die including functional circuitry bonded by a plurality of inter-die bond wires (bond wires) to a second die having functional circuitry. A first channel (Channel A) and second channel (Channel B) each have separate top and bottom signal paths (signal paths) including one of the bond wires. A failure of any of the signal paths does not affect functionality of the device. The first die includes input pins including a first input pin (P1), a second input pin (P2), and coupling circuitry including cross-channel test circuitry positioned between the input pins and the functional circuitry. The coupling circuitry provides for Channel A and Channel B a first configuration for normal mode operation and a second configuration for test mode operation for single bond wire testing for checking continuity of any of the bond wires.
    Type: Application
    Filed: May 25, 2016
    Publication date: July 6, 2017
    Inventors: DANYANG ZHU, ZHUANG MA, XINYU YIN, MICHAEL DEAN SHILHANEK, STEVEN BOLEN, ALBERT EARDLEY, ABHA SINGH KASPER