Abstract: A method of focused ion beam milling of a copper on a sample, and a focused ion beam apparatus. The method comprises the steps of exposing an area of copper on the sample; and forming a given feature in the copper area by using the focused ion beam to draw a mill box in the copper area, scanning the focused ion beam across the mill box for an extended period of time to remove a portion of the copper in the copper area and thereby to form the given feature, and introducing tetramethylcyclotetrasiloxane (TMCTS) in said area during the scanning step. After the copper feature is formed, a very light dose of XeF2 may be introduced to clean up any residue that may have formed.

Abstract: A micro-tool and corresponding method are disclosed herein for working a very small surface of a substrate. The micro-tool has a tip of diameter on the order of 1 mm or less for placement in close proximity to a location on a substrate to be worked, and at least two open electrodes located near an end of the tip, such that the gap between the open electrodes is on the order of a few microns or less. The micro-tool further includes a housing which holds the tip and wiring extending from the open electrodes to permit connection to a voltage source. When the electrodes of the micro-tool are connected by such wiring to a voltage, an electric field and electron emission arises between the open electrodes such that electron emission currents are established. In the corresponding method, a localized electric field is generated in close proximity to a substrate using a tool having at least two open electrodes with a gap between them on the order of a few microns or less, by applying a voltage to the open electrodes.