Abstract: The systems, methods, and devices disclosed herein relate to a multi-layer structures arranged in a vertically orientation. In some embodiments, a computing assembly can include a first cooling system, a first electronics layer, a second cooling system, and a second electronics layer. The first cooling system can be disposed on top of and can be in thermal communication with the first electronics layer. The first electronics layer array includes an array of integrated circuit dies that are in electronic communication with each other in a plane that is orthogonal to power delivery. The first electronics layer can be disposed on top of and can be in thermal communication with the second cooling system, and the second cooling system can be disposed on top of and can be in thermal communication with the second electronics layer. The second electronics layer includes an array of power delivery modules. In some embodiments, at least one layer can use system on wafer packaging.

Abstract: An electronic assembly includes a substrate having a first surface and a second surface opposite to the first surface and a plurality of stiffening members coupled to the substrate. The substrate further includes a plurality of substrate interconnects. The electronic assembly further includes a plurality of semiconductor dies mounted on the first surface of the substrate. The plurality of semiconductor dies are electrically connected to each other via the plurality of substrate interconnects. The electronic assembly further includes a plurality of power supply modules mounted on the second surface of the substrate. Each power supply module is disposed opposite to a respective semiconductor die.

Abstract: An electronic assembly includes a substrate having a first surface and a second surface opposite to the first surface and a plurality of stiffening members coupled to the substrate. The substrate further includes a plurality of substrate interconnects. The electronic assembly further includes a plurality of semiconductor dies mounted on the first surface of the substrate. The plurality of semiconductor dies are electrically connected to each other via the plurality of substrate interconnects. The electronic assembly further includes a plurality of power supply modules mounted on the second surface of the substrate. Each power supply module is disposed opposite to a respective semiconductor die.

Abstract: A method of real-time oil consumption is disclosed. A method of real-time oil consumption detection may include capturing a raw oil quantity, calculating a corrected oil quantity, calculating a predicted oil quantity, calculating a prediction error, and calculating an estimated oil consumption rate. Raw oil quantity may be captured from an oil quantity sensor in an engine. Corrected oil quantity may be calculated by taking raw oil quantity and applying environmental and engine operational conditions. Prediction error may be calculated by finding the difference between corrected oil quantity and predicted oil quantity. Oil consumption rate may be calculated by applying a regression algorithm to prediction error.

Abstract: A method of real-time oil consumption is disclosed. A method of real-time oil consumption detection may comprise capturing a raw oil quantity, calculating a corrected oil quantity, calculating a predicted oil quantity, calculating a prediction error, and calculating an estimated oil consumption rate. Raw oil quantity may be captured from an oil quantity sensor in an engine. Corrected oil quantity may be calculated by taking raw oil quantity and applying environmental and engine operational conditions. Prediction error may be calculated by finding the difference between corrected oil quantity and predicted oil quantity. Oil consumption rate may be calculated by applying a regression algorithm to prediction error.

Abstract: A method and server for facilitating the transmission of content to a mobile communication device connected to a host computer are provided. The method comprises: sending a content queue request to the mobile communication device from a web application running within a web browser; in response to sending the content queue request, receiving at the host computer a content queue from the mobile communication device, the content queue identifying one or more locations of remote servers associated with content; retrieving content, by the web application, in accordance with the one or more locations identified in the content queue; and sending the content from the host computer to the mobile communication device.

Abstract: A method and server for facilitating the transmission of content to a mobile communication device connected to a host computer are provided. The method comprises: sending a content queue request to the mobile communication device from a web application running within a web browser; in response to sending the content queue request, receiving at the host computer a content queue from the mobile communication device, the content queue identifying one or more locations of remote servers associated with content; retrieving content, by the web application, in accordance with the one or more locations identified in the content queue; and sending the content from the host computer to the mobile communication device.

Abstract: A memory device is provided for performing writing operations on memory cells while maintaining a stability thereof. A memory array is provided including a plurality of memory cells. Additionally, segmented write bitlines are provided for performing writing operations on the memory cells while maintaining a stability thereof.

Abstract: The present invention relates to an article of headwear having a material representing a sport ball, including stitching resembling the sport ball, covering all or a portion of the brim or head-covering portion of the headwear.

Abstract: A continuous process for manufacturing a sound absorbing tile made from a slurry including, quick setting cement, water, fibers and foaming agent, the process including the steps of (i) mixing cementitious material, water, foaming agent but without incorporation of prefabricated foam with fibers into a slurry; subsequently; (ii) injecting and distributing air into the slurry of step (i) to form a cellular slurry; subsequently; (iii) forming tiles or precursor products of tiles from the cellular slurry; and finally; (iv) allowing the cellular slurry to set into the desired tile or a precursor thereof.

Abstract: The invention relates to a new plasterboard having a facer comprising two plies, and uses of such plasterboards in EIS or EFS.

Abstract: A process for manufacturing set cellular cement, including the steps of: (i) mixing cementitious material, water, foaming agent and optionally additives into a free flowing slurry having a slump of at least 100 mm; subsequently (ii) injecting and distributing air into the slurry of step (i) to form a cellular slurry; subsequently (iii) casting the cellular slurry of step (ii); and finally allowing the cellular slurry to set. And, an apparatus for carrying out the process.

Abstract: A wallboard includes a set cementitious core, and (ii) at least a composite facing material on at least one of the faces of the core, the facing material including: (a) a synthetic scrim, and adhered thereto, (b) a synthetic non-woven; the scrim being completely embedded in the core while the synthetic non-woven is at most partially embedded in the core. A process for making such a wall board, in which the viscosity of the cementitious slurry is controlled on the facing material such that the scrim is completely embedded in the core while the synthetic non-woven is at most partially embedded in the core.

Abstract: A sealing system includes a gate (2) which is pivotably mounted to a crank (3) which is mounted for rotation with shaft (1). A spring (5) is disposed between gate (2) and crank (3). The gate (2) includes an O-ring (6) which compresses and slides during closure.

Abstract: An ESD protection device is provided which includes a self referencing modulation circuit for controlling its operation. The modulation circuit includes a diode stack coupled to a resistor and further coupled to an inverter powered by the signal pad voltage in one embodiment, or an odd plurality of series connected inverters powered by the signal pad voltage in an alternate embodiment. The inverter chain is coupled to the ESD clamp. The modulation circuit requires no reference supply voltage to operate. The ESD protection circuit shunts currents associated with ESD events away from ICs as well as clamping I/O pad voltages to acceptable levels during an ESD event.

Abstract: A self-timed logic device which produces internal control and timing signals in response to an external signal is described. The circuit includes means responsive to a pulse signal for providing control and timing signals and means responsive to a change in state of a signal fed to said device for providing said pulse signal. The means for providing said pulse further includes means for selectively changing timing characteristics of said device in response to external tuning signals fed to the device. In a preferred embodiment the logic device is a static random access memory.