Abstract: A multi-layer backplane for processing radio frequency (RF) and other signals has alternating layers of conductive traces for RF signals and other types of signals, and ground plane layers of conductive material electrically insulated from each other. The backplane upper layer has a plurality of coaxial connectors for connection of cables and other devices which supply RF energy signals to and convey them from the backplane, with each connector having a center pin extending into the backplane to make electrical contact with a trace of a selected trace layer. A ground plane cap layer of electrically conductive material is provided below the last ground plane layer associated with a trace layer and beneath the coaxial connector center pins for preventing leakage of radio frequency energy between the center pins. A row of conductive vias can be provided along one or more sides of a trace carrying RF energy.

Abstract: A microwave arrangement, such as a splitter and combiner, is formed by sandwiching a conductive ground plane between two dielectric microstrip boards whose outer faces carry RF traces and extending the ground plane with a conductive plurality of distributed via holes that contact the ground plane and pass through the boards to their outer faces. Connections are made between the traces on the surfaces with additional conductive via holes that pass through the ground plane where the ground plane forms openings for passage of the via holes.