Patents by Inventor Steven C. Bird

Steven C. Bird has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080245556
    Abstract: Techniques for optimizing application specific integrated circuit (ASIC) and other IC pin assignment corresponding to a high density interconnect (HDI) printed circuit board (PCB) layout are provided. Applying the techniques described herein, pin assignments may be systematically and strategically planned, for example, in an effort to reduce the PCB layer count and associated cost, increase signal integrity and speed, reduce the surface area used by an ASIC and its support circuitry, reduce plane perforations, and reduce via crosstalk when compared to conventional designs with an ASIC mounted on a multilayered PCB.
    Type: Application
    Filed: April 4, 2007
    Publication date: October 9, 2008
    Inventors: STEVEN C. BIRD, Linda M. Mazaheri, Bob Needham, Phuong Rosalynn Duong
  • Publication number: 20080245557
    Abstract: Techniques for optimizing application specific integrated circuit (ASIC) and other IC pin assignment corresponding to a high density interconnect (HDI) printed circuit board (PCB) layout are provided. Applying the techniques described herein, pin assignments may be systematically and strategically planned, for example, in an effort to reduce the PCB layer count and associated cost, increase signal integrity and speed, reduce the surface area used by an ASIC and its support circuitry, reduce plane perforations, and reduce via crosstalk when compared to conventional designs with an ASIC mounted on a multilayered PCB.
    Type: Application
    Filed: August 10, 2007
    Publication date: October 9, 2008
    Inventors: Steven C. Bird, Linda M. Mazaheri, Bob Needham, Phuong Rosalynn Duong
  • Publication number: 20080250377
    Abstract: Methods and apparatus for accessing a high speed signal routed on a conductive trace on an internal layer of a printed circuit board (PCB) using high density interconnect (HDI technology) are provided. The conductive trace may be coupled to a microvia (?Via) having a conductive dome disposed above the outer layer pad of the ?Via. In-circuit test (ICT) fixtures or high speed test probes may interface with the conductive dome to test the high speed signal with decreased reflection loss and other parasitic effects when compared to conventional test points utilizing plated through-hole (PTH) technology.
    Type: Application
    Filed: April 4, 2007
    Publication date: October 9, 2008
    Inventors: Steven C. Bird, Varoujan Malian, Mudasir Ahmad, Charles H. Casale, Danlu Tang
  • Patent number: 4755887
    Abstract: A drop out trigger captures waveform data when a normally continuous input signal is disrupted or interrupted. In the preferred embodiment, a conventional trigger detects a parameter periodically satisfied by the continuous signal and resets a timer whenever a trigger event occurs. The alarm count of the timer is set for an interval slightly larger than the periodic interval. If the timer reaches the alarm count, a measurement signal is generated.
    Type: Grant
    Filed: October 31, 1986
    Date of Patent: July 5, 1988
    Assignee: Hewlett-Packard Company
    Inventors: Phillip E. Deaver, Stephen K. Will, Steven C. Bird, Mark S. Allen