Abstract: A cabin purification system for a vehicle includes an air inlet in communication with a fan, a light source emitting ultraviolet C light at a wavelength of from 100 nanometers to 280 nanometers, a photocatalytic oxidizer element, and an air outlet. The photocatalytic oxidizer element has a surface coating comprising anatase and rutile forms of TiO2. The surface coating is illuminated by the light source. The fan generates an air flow from outside the air inlet to the air outlet. The air flow passes the light source and the photocatalytic oxidizer where the surface coating converts H2O O3 and O2 in the air flow into H2O2 which is distributed into the vehicle cabin to purify it.

Abstract: A storage apparatus has first and second bins with configurations that match. The bins have movable supports that enable the bins to be stacked on each other and attached to each other when employing the bins to store items in the bins and move the items from one area to another by moving the attached bins. The first and second bins are also nestable together to store the bins in a minimum of storage space when the bins are not in use.

Abstract: A storage apparatus has first and second bins with configurations that match. The bins have movable supports that enable the bins to be stacked on each other and attached to each other when employing the bins to store items in the bins and move the items from one area to another by moving the attached bins. The first and second bins are also nestable together to store the bins in a minimum of storage space when the bins are not in use.

Abstract: A universal box top lid is adapted to be attached to the opened top of a variety of different sizes of food packaging boxes. The lid is designed to fit over the opened box top with an opened bag containing the food product inside the box being held open by an apron formed on an inner wall of the lid. The lid is provided with a cap closure that can be opened when it is desired to dispense the food product contained in the packaging box and bag, and can be closed to preserve the food product.

Abstract: A universal box top lid is adapted to be attached to the opened top of a variety of different sizes of food packaging boxes. The lid is designed to fit over the opened box top with an opened bag containing the food product inside the box being held open by an apron formed on an inner wall of the lid. The lid is provided with a cap closure that can be opened when it is desired to dispense the food product contained in the packaging box and bag, and can be closed to preserve the food product.

Abstract: A universal box top lid is adapted to be attached to the opened top of a variety of different sizes of food packaging boxes. The lid is designed to fit over the opened box top with an opened bag containing the food product inside the box being held open by an apron formed on an inner wall of the lid. The lid is provided with a cap closure that can be opened when it is desired to dispense the food product contained in the packaging box and bag, and can be closed to preserve the food product.

Abstract: A universal box top lid is adapted to be attached to the opened top of a variety of different sizes of food packaging boxes. The lid is designed to fit over the opened box top with an opened bag containing the food product inside the box being held open by an apron formed on an inner wall of the lid. The lid is provided with a cap closure that can be opened when it is desired to dispense the food product contained in the packaging box and bag, and can be closed to preserve the food product.

Abstract: A method is disclosed for removing oxide from the surface of a semiconductor body having a thick oxide and an adjoining nitride-covered thin oxide, without subjecting the surface to significant over-etching and thus avoiding degredation of the surface of the semiconductor body. The thick oxide is first etched for a period of time so that a portion of the thick oxide remains, and has a thickness comparable to that of the thin oxide. The nitride covering the thin oxide is next removed without appreciably etching either the remaining portion of the thick oxide or the thin oxide. Finally, the thin oxide and the remaining portion of the thick oxide are removed, without appreciably over-etching the surface of the semiconductor body.