Abstract: A light emitting diode (LED) assembly and a method of making the assembly, in which a container having an open top is provided with a two sets of holes through a bottom of the container, an electrically conductive heat sink is attached to the container bottom beneath the first set of holes, and in which an electrically conductive sheet is attached to the container bottom beneath the second set of holes, where the heat sink and sheet are isolated from each other. LEDs are placed in the first set of holes so that each has a first LED terminal on and adhered to an exposed part of the heat sink through the respective one of the first holes and in which a second LED terminal is connected via a wire lead to the sheet through a respective one of the second holes.

Abstract: A high-density LED array (10) capable of presenting a density of X LEDs/unit area has a first printed circuit board (12) having X/2 LEDs/area and X/2 apertures arrayed therewith. A second printed circuit board (22) is spaced from the first printed circuit board (12) and has X/2 LEDs 28/unit area. The LEDs (28) on the second printed circuit board are aligned with the apertures (20) in the first printed circuit board. Each of the LEDs (28) on the second printed circuit board (22) has an optical fiber (30) associated therewith and each of the light guides (30) extends through one of the apterures (20). Each of the mounted LEDs on the first printed circuit board can have an optical fiber associated therewith and the light guides can be bundled to direct light to a remote source.

Abstract: A solid-state light source 10 compatible with existing sockets normally reserved for filamented lamps may be formed with a hollow base 12 formed to mechanically and electrically adapt to a socket. A sub-assembly 14 adapted to cooperate with and fit into the hollow base 12 comprises a metal core 16 having a bulbous body 18 and a narrow, depending foot 20. A circuit board 22 substantially surrounds the metal core 16 on two sides. The board 22 is preferably formed from a flexible printed circuit board material capable of sustaining a bend radius of at least 0.25 inches (6 mm). Solid-state light sources 30, for example, light emitting diodes (LEDs) are mechanically and electrically connected to one side of the circuit board by suitable electrically conductive traces. A glass dome 34 covers the sub-assembly 14 after it is inserted into the hollow base 12 and is sealed thereto.

Abstract: A solid-state lamp has a base formed to be received into a socket, and the base has a retainer receptacle formed therein. An axially extending support is fitted into the base. The support is formed of an electrically conductive, heat-sinking material and has a retainer engaging the retainer receptacle. An electrically insulating coating is formed on the support and electrically conductive traces are formed on the insulating coating. A plurality of solid-state light sources are formed on the support and are electrically connected to the traces, at least two of the traces providing electrical connection to the base whereby electrical connection can be made to the socket. The plurality of solid-state light sources are formed in a selected area of the support and in a preferred embodiment mimic the dual filaments of a prior art lamp.

Abstract: A solid-state lamp has a base formed to be received into a socket, and the base has a retainer receptacle formed therein. An axially extending support is fitted into the base. The support is formed of an electrically conductive, heat-sinking material and has a retainer engaging the retainer receptacle. An electrically insulating coating is formed on the support and electrically conductive traces are formed on the insulating coating. A plurality of solid-state light sources are formed on the support and are electrically connected to the traces, at least two of the traces providing electrical connection to the base whereby electrical connection can be made to the socket. The plurality of solid-state light sources are formed in a selected area of the support and in a preferred embodiment mimic the dual filaments of a prior art lamp.

Abstract: A discharge lamp, such as a neon lamp or a subminiature fluorescent lamp, includes an elongated tubular lamp envelope containing a fill material for supporting a light-emitting discharge and electrodes mounted at opposite ends of the lamp envelope. A light-transmissive conductive coating on the lamp envelope substantially attenuates emission of RF energy. A conductor in electrical contact with the conductive coating couples the conductive coating to a reference potential, such as ground. The conductor may be a metal or conductive silicone strip in electrical contact with the conductive coating along the length of the lamp envelope. The discharge lamp may be connected to a ballast circuit by coaxial cables. The outer conductor of each coaxial cable is connected to the conductive coating to form a continuous RF shield. The conductive coating and/or the metal strip may be used for heating of the discharge lamp.