Patents by Inventor Steven Callender
Steven Callender has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20250150103Abstract: Various aspects provide a transceiver and a communication device including the transceiver. In an example, the transceiver includes an amplifier circuit including an amplifier stage with an adjustable degeneration component, the amplifier stage configured to amplify a received input signal with an adjustable gain, an adjustable feedback component coupled to the amplifier stage; and a controller coupled to the amplifier stage and to the adjustable feedback component and configured to adjust the adjustable feedback component based on an adjustment of the adjustable degeneration component.Type: ApplicationFiled: December 19, 2024Publication date: May 8, 2025Inventors: Abhishek AGRAWAL, Ritesh A. BHAT, Steven CALLENDER, Brent R. CARLTON, Christopher D. HULL, Stefano PELLERANO, Mustafijur RAHMAN, Peter SAGAZIO, Woorim SHIN
-
Patent number: 12212351Abstract: Various aspects provide a transceiver and a communication device including the transceiver. In an example, the transceiver includes an amplifier circuit including an amplifier stage with an adjustable degeneration component, the amplifier stage configured to amplify a received input signal with an adjustable gain, an adjustable feedback component coupled to the amplifier stage; and a controller coupled to the amplifier stage and to the adjustable feedback component and configured to adjust the adjustable feedback component based on an adjustment of the adjustable degeneration component.Type: GrantFiled: December 23, 2020Date of Patent: January 28, 2025Assignee: Intel CorporationInventors: Abhishek Agrawal, Ritesh A. Bhat, Steven Callender, Brent R. Carlton, Christopher D. Hull, Stefano Pellerano, Mustafijur Rahman, Peter Sagazio, Woorim Shin
-
Publication number: 20250006667Abstract: Embodiments herein relate to systems, apparatuses, or processes directed to a package for wideband sub-terahertz communication, where the package includes a mixer and an amplifier, such as a power amplifier or a low noise amplifier, that are implemented within a layer of III-V material. Other embodiments may be described and/or claimed.Type: ApplicationFiled: June 27, 2023Publication date: January 2, 2025Inventors: Georgios PANAGOPOULOS, Steven CALLENDER, Richard GEIGER, Georgios C. DOGIAMIS, Manisha DUTTA, Stefano PELLERANO
-
Publication number: 20250007145Abstract: Embodiments disclosed herein include communication dies for mm-wave and/or sub-terahertz wavelength communications. In an embodiment, a communications die comprises a substrate with a first face and a second face. In an embodiment, edge surfaces connect the first face to the second face. In an embodiment, a circuitry element is on the first face, and an antenna on at least one of the edge surfaces.Type: ApplicationFiled: June 29, 2023Publication date: January 2, 2025Inventors: Peter BAUMGARTNER, Richard GEIGER, Georgios C. DOGIAMIS, Steven CALLENDER, Telesphor KAMGAING, Jonathan C. JENSEN, Harald GOSSNER
-
Publication number: 20250004121Abstract: Disclosed herein is a lens antenna system that includes a reconfigurable aperture configured to receive a source beam. The reconfigurable aperture also provides an output beam based on a surface impedance distribution of the reconfigurable aperture and the received source beam. The control device is operatively coupled to the reconfigurable aperture, wherein the control device is configured to control the surface impedance distribution of the reconfigurable aperture to configure and reconfigure a beam pattern of the output beam. A plurality of antenna elements may be physically positioned proximate the reconfigurable aperture, wherein the plurality of antennas may be configured to generate the source beam.Type: ApplicationFiled: September 16, 2024Publication date: January 2, 2025Inventors: Arnaud AMADJIKPE, Timo Sakari HUUSARI, Tae Young YANG, Hossein ALAVI, Steven CALLENDER, Bradley JACKSON, Ofer MARKISH, Woorim SHIN, Shengbo XU, Zhen ZHOU, Wei QIAN, Mengyuan HUANG
-
Publication number: 20250006719Abstract: Example antenna module includes antenna units provided over an antenna unit support, and ICs communicatively coupled to various antenna units. The ICs are arranged in two or more subsets of one or more ICs in each subset, where an individual IC belongs to only one subset, different subsets are in different layers with respect to the antenna unit support, and an average pitch of projections of all of the ICs onto a plane parallel to the antenna unit support is substantially equal to, or smaller, than an average pitch of the antenna units. When an average width of the ICs is larger than the average pitch of the antenna units, arranging the ICs in two or more subsets in different layers means that at least one of the ICs of one subset partially overlaps with at least one of the ICs of another subset.Type: ApplicationFiled: June 27, 2023Publication date: January 2, 2025Applicant: Intel CorporationInventors: Georgios Panagopoulos, Richard Geiger, Steven Callender, Georgios Dogiamis, Manisha Dutta, Stefano Pellerano
-
Publication number: 20240429888Abstract: An integrated circuit device includes a variable gain amplifier with multiple gain circuits coupled in parallel, where one or more of the multiple gain circuits comprises a first differential pair of transistors, and a complementarily switched second differential pair of transistors cross-connected to the first differential pair of transistors with a sign inversion relative to the first differential pair of transistors. Other examples are disclosed and claimed.Type: ApplicationFiled: June 21, 2023Publication date: December 26, 2024Applicant: Intel CorporationInventors: Ritesh Bhat, Steven Callender, Peter Baumgartner
-
Publication number: 20240322775Abstract: Disclosed herein are electronic assemblies, integrated circuit (IC) packages, and communication devices implementing three-dimensional power combiners. An electronic assembly may include a first die, comprising a first transmission line, and a second die, comprising a second transmission line. Each die includes a first face and an opposing second face, and the second die is stacked above the first die so that the first face of the second die is coupled to the second face of the first die. The electronic assembly further includes a first conductive pathway between one end of the first transmission line and a first connection point at the first face of the first die, a second conductive pathway between one end of the second transmission line and a second connection point at the first face of the first die, and a third conductive pathway between the other ends of the first and second transmission lines.Type: ApplicationFiled: March 21, 2023Publication date: September 26, 2024Applicant: Intel CorporationInventors: Telesphor Kamgaing, Peter Baumgartner, Steven Callender, Richard Geiger, Harald Gossner, Jonathan Jensen
-
Publication number: 20240223235Abstract: Disclosed herein is a radio frequency (RF) circuit for a transmit/receive switch that includes an antenna coupled to a receive path through a first coupled transmission line. The antenna is also coupled to a transmit path through a second coupled transmission line. The RF circuit includes a receiver switch configured to selectively present to the receive path a high impedance or a low impedance to ground and a transmitter switch configured to selectively present to the transmit path a high impedance or a low impedance to ground. The receiver switch and/or transmitter switch may be independently supplied with a bias voltage that depends on whether the circuit is operating in a transmit mode or receive mode. The RF circuit may have improved insertion loss, bandwidth, and linearity, while also providing robustness to electrostatic discharge (ESD).Type: ApplicationFiled: December 29, 2022Publication date: July 4, 2024Inventors: Ritesh A. BHAT, Steven CALLENDER
-
Publication number: 20230208380Abstract: An impedance matching network for a radio frequency (RF) transmission system can include first port for coupling to a first transistor differential pair. The network can further include a second port for coupling to a second tansistor differential pair. The network can further incluede a matching network connected to the port and the second port, the matching network comprised of a pair of coupled lines. Other aspects are described.Type: ApplicationFiled: December 23, 2021Publication date: June 29, 2023Inventors: Ritesh Bhat, Steven Callender
-
Publication number: 20220196821Abstract: A radar device may include a digital to analog converter (DAC) stage. The DAC stage may generate a plurality of analog signals. The DAC stage may generate a different analog signal for each transmitter chain of a plurality of transmitter chains. Each analog signal of the plurality of analog signals may represent a single digital signal. Each transmitter chain of the plurality of transmitter chains may include a transmit chain portion and switched analog beamforming network (BFN). The transmit chain portion may generate a plurality of intermediate analog signals representative of the corresponding analog signal. The switched analog BFN may generate a plurality of analog transmit signals for an intermediate analog signal of the plurality of intermediate analog signals. The plurality of analog transmit signals may include a beam formed in accordance with a state of the switched analog BFN.Type: ApplicationFiled: July 8, 2021Publication date: June 23, 2022Inventors: Arnaud AMADJIKPE, Timo Sakari HUUSARI, Tae Young YANG, Hossein ALAVI, Steven CALLENDER, Bradley JACKSON, Ofer MARKISH, Woorim SHIN, Shengbo XU, Zhen ZHOU, Wei QIAN, Mengyuan HUANG
-
Publication number: 20220200642Abstract: Various aspects provide a transceiver and a communication device including the transceiver. In an example, the transceiver includes an amplifier circuit including an amplifier stage with an adjustable degeneration component, the amplifier stage configured to amplify a received input signal with an adjustable gain, an adjustable feedback component coupled to the amplifier stage; and a controller coupled to the amplifier stage and to the adjustable feedback component and configured to adjust the adjustable feedback component based on an adjustment of the adjustable degeneration component.Type: ApplicationFiled: December 23, 2020Publication date: June 23, 2022Inventors: Abhishek AGRAWAL, Ritesh A. BHAT, Steven CALLENDER, Brent R. CARLTON, Christopher D. HULL, Stefano PELLERANO, Mustafijur RAHMAN, Peter SAGAZIO, Woorim SHIN
-
Patent number: 11218183Abstract: A transmit receive switch (TRSW) system is disclosed. The system has a transmission line, a transformer based matching network, a shunt switch, an amplifier and circuitry. The transmission line is connected to an antenna port. The transformer based matching network is connected to the transmission line and has a first coil and a second coil, wherein the second coil is connected to the transmission line. The amplifier can be configured as a shunt switch when inactive. The shunt switch, including the amplifier configured as the shunt switch, can be connected to the first coil of the transformer based matching network. The circuitry is configured to cause the shunt switch to be ON during an inactive mode and create a short across the first coil. Combined, the length of transmission line needed to complete the impedance transformation is reduced, thereby lowering the overall insertion loss of the transmit/receive switch.Type: GrantFiled: July 17, 2020Date of Patent: January 4, 2022Assignee: Intel CorporationInventors: Steven Callender, Christopher Hull, Stefano Pellerano, Woorim Shin, Ka Chun Kwok
-
Publication number: 20210044318Abstract: A transmit receive switch (TRSW) system is disclosed. The system has a transmission line, a transformer based matching network, a shunt switch, an amplifier and circuitry. The transmission line is connected to an antenna port. The transformer based matching network is connected to the transmission line and has a first coil and a second coil, wherein the second coil is connected to the transmission line. The amplifier can be configured as a shunt switch when inactive. The shunt switch, including the amplifier configured as the shunt switch, can be connected to the first coil of the transformer based matching network. The circuitry is configured to cause the shunt switch to be ON during an inactive mode and create a short across the first coil. Combined, the length of transmission line needed to complete the impedance transformation is reduced, thereby lowering the overall insertion loss of the transmit/receive switch.Type: ApplicationFiled: July 17, 2020Publication date: February 11, 2021Inventors: Steven CALLENDER, Christopher HULL, Stefano PELLERANO, Woorim SHIN, Ka Chun KWOK
-
Patent number: 10720956Abstract: A transmit receive switch (TRSW) system is disclosed. The system has a transmission line, a transformer based matching network, a shunt switch, an amplifier and circuitry. The transmission line is connected to an antenna port. The transformer based matching network is connected to the transmission line and has a first coil and a second coil, wherein the second coil is connected to the transmission line. The amplifier can be configured as a shunt switch when inactive. The shunt switch, including the amplifier configured as the shunt switch, can be connected to the first coil of the transformer based matching network. The circuitry is configured to cause the shunt switch to be ON during an inactive mode and create a short across the first coil. Combined, the length of transmission line needed to complete the impedance transformation is reduced, thereby lowering the overall insertion loss of the transmit/receive switch.Type: GrantFiled: September 6, 2018Date of Patent: July 21, 2020Assignee: Intel CorporationInventors: Steven Callender, Christopher Hull, Stefano Pellerano, Woorim Shin, Ka Chun Kwok
-
Publication number: 20200083924Abstract: A transmit receive switch (TRSW) system is disclosed. The system has a transmission line, a transformer based matching network, a shunt switch, an amplifier and circuitry. The transmission line is connected to an antenna port. The transformer based matching network is connected to the transmission line and has a first coil and a second coil, wherein the second coil is connected to the transmission line. The amplifier can be configured as a shunt switch when inactive. The shunt switch, including the amplifier configured as the shunt switch, can be connected to the first coil of the transformer based matching network. The circuitry is configured to cause the shunt switch to be ON during an inactive mode and create a short across the first coil. Combined, the length of transmission line needed to complete the impedance transformation is reduced, thereby lowering the overall insertion loss of the transmit/receive switch.Type: ApplicationFiled: September 6, 2018Publication date: March 12, 2020Inventors: Steven Callender, Christopher Hull, Stefano Pellerano, Woorim Shin, Ka Chun Kwok
-
Patent number: 10541717Abstract: Systems, methods, and circuitries are provided for a local oscillator (LO) signal distribution. An exemplary LO distribution network includes a common LO buffer configured to buffer an LO signal, a receive (RX) LO buffer, and a transmit (TX) mixer in a cascaded arrangement. The RX LO buffer is configured to receive the LO signal and buffer the LO signal and to provide the LO signal to an RX mixer. A first LO signal line and a second LO signal line are configured to conduct the LO signal from the common LO buffer to the RX LO buffer. The RX LO buffer is coupled to the first LO signal line and the second LO signal line. The TX mixer is also coupled to the first LO signal line and the second LO signal line.Type: GrantFiled: September 7, 2018Date of Patent: January 21, 2020Assignee: Intel CorporationInventors: Woorim Shin, Christopher Hull, Steven Callender