Abstract: A circuit layer is formed by drilling vias and forming channels in a circuit layer which has catalytic particles exposed on the surfaces, channels, and vias. A first flash electroless deposition is followed by application of dry film, followed by selective laser ablation of the dry film channels and vias. A second electroless solution is applied which provides additional deposition over the first flash electroless deposition but only on the vias and trace channel areas. An electrodeposition follows, using the first deposition as a cathode. The dry film is stripped and the first electroless layer is etched, leaving only depositions in the channels and vias.