Patents by Inventor Steven Chi-Shin Hung

Steven Chi-Shin Hung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7023231
    Abstract: In a method of measuring at least one electrical property of a semiconductor wafer, an elastically deformable conductive contact formed from an electrically conductive coating overlaying an electrically conductive base material is provided. The base material has a first work function and the coating has a second work function. A first electrical contact is formed between the conductive contact and a top surface of a semiconductor wafer. A second electrical contact is formed with the semiconductor wafer. An electrical stimulus is applied between the first and second electrical contacts and a response of the semiconductor wafer to the electrical stimulus is measured. At least one electrical property of the semiconductor wafer is determined from the response.
    Type: Grant
    Filed: May 14, 2004
    Date of Patent: April 4, 2006
    Assignee: Solid State Measurements, Inc.
    Inventors: William H. Howland, Jr., Robert J. Hillard, Steven Chi-Shin Hung