Patents by Inventor Steven(Chi Tse) Wu

Steven(Chi Tse) Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Manufacturing design and processing methods and apparatus for sputtering targets
    Patent number: 9279178
    Abstract: Sputtering targets having a reduced burn-in time are disclosed that comprise: a) a heat-modified surface material having a substantially uniform crystallographic orientation, wherein at least part of the surface material was melted during heat-treatment, and b) a core material having an average grain size. Sputtering targets are also disclosed that include a heat-modified surface material having network of shallow trenches, alternating rounded peaks and valleys in the surface of the target or a combination thereof, wherein at least part of the surface material was melted during heat-treatment, and a core material having an average grain size. Methods of producing sputtering targets having reduced burn-in times comprises: a) providing a sputtering target comprising a sputtering surface having a sputter material and a crystal lattice, and b) heat-modifying the sputtering surface in order to melt at least part of the surface material and modify the crystal lattice.
    Type: Grant
    Filed: April 25, 2008
    Date of Patent: March 8, 2016
    Assignee: Honeywell International Inc.
    Inventors: Janine K. Kardokus, Michael Pinter, Michael D. Payton, Steven (Chi Tse) Wu, Jared Akins, Werner Hort
  • Novel Manufacturing Design and Processing Methods and Apparatus for Sputtering Targets
    Publication number: 20080289958
    Abstract: Sputtering targets having a reduced burn-in time are disclosed that comprise: a) a heat-modified surface material having a substantially uniform crystallographic orientation, wherein at least part of the surface material was melted during heat-treatment, and b) a core material having an average grain size. Sputtering targets are also disclosed that include a heat-modified surface material having network of shallow trenches, alternating rounded peaks and valleys in the surface of the target or a combination thereof, wherein at least part of the surface material was melted during heat-treatment, and a core material having an average grain size. Methods of producing sputtering targets having reduced burn-in times comprises: a) providing a sputtering target comprising a sputtering surface having a sputter material and a crystal lattice, and b) heat-modifying the sputtering surface in order to melt at least part of the surface material and modify the crystal lattice.
    Type: Application
    Filed: April 25, 2008
    Publication date: November 27, 2008
    Inventors: Janine Kardokus, Michael Pinter, Michael Payton, Steven(Chi Tse) Wu, Jared Akins, Werner Hort