Abstract: A computer-implemented method for predicting electric vehicle (EV) charging behavior of a driver. The method includes predicting when an EV needs to be charged, where the EV needs to be charged, and for how long the EV needs to be charged based on individualized characteristics of the driver or one or more passengers, weather conditions, and geospatial characteristics. The method further includes evaluating an availability of one or more EV charging stations located within a given radius of the EV and comparing a location of the one or more available EV charging stations, located within the given radius of the EV, to one or more desired locations of the driver of the EV. The method further includes determining an estimated waiting time at the one or more EV charging stations and scheduling an EV charging time at the one or more EV charging stations, based on the location and duration.

Abstract: A method includes storing as communications data at least a portion of received electronic communications, such as emails, that are of interest to user; processing the stored communications data to identify at least one action item that pertains to the user; storing results of the processing including text descriptive of the at least one identified action item in a results repository; and outputting stored results in the results repository to a user device for review by the user. Also disclosed is a computer program product and a system that are configured to implement the method.

Abstract: A method includes storing as communications data at least a portion of received electronic communications, such as emails, that are of interest to user; processing the stored communications data to identify at least one action item that pertains to the user; storing results of the processing including text descriptive of the at least one identified action item in a results repository; and outputting stored results in the results repository to a user device for review by the user. Also disclosed is a computer program product and a system that are configured to implement the method.

Abstract: A method for fabricating a solder transfer mold includes masking a substrate with a masking agent. A pattern is transferred to the substrate mask. The masked substrate is etched until cavities of a first volume are formed. The cavities of the first volume are selectively coated. The masked substrate is etched until cavities of a second volume are formed.

Abstract: A solder mold includes a substrate and a plurality of cavities for holding solder to be transferred to an integrated circuit. The plurality of cavities comprises cavities of at least two different volumes.

Abstract: A probe structure for an electronic device is provided. In one aspect, the probe structure includes an electrically insulating carrier having one or more contact structures traversing a plane thereof. Each contact structure includes an elastomeric material having an electrically conductive layer running along at least one surface thereof continuously through the plane of the carrier. The probe structure includes one or more other contact structures adapted for connection to a test apparatus.

Abstract: Flexible and rigid interposers for use in the semiconductor industry and methods for manufacturing the same are described, Auto-catalytic processes are used to minimize the costs associated with the production of flexible interposers, while increasing the yield and lifetime. Electrical contact regions are easily isolated and the risk of corrosion is reduced because all portions of the interposer are plated at once. Leads projecting from the flexible portion of the interposers accommodate a greater variety of components to be tested. Rigid interposers include a pin projecting from a probe pad affixed to a substrate. The rigidity of the pin penetrates oxides on a contact pad to be tested. Readily available semiconductor materials and processes are used to manufacture the flexible and rigid interposers according to the invention. The flexible and rigid interposers can accommodate pitches down to 25 ?m.

Abstract: Techniques for forming enhanced electrical connections are provided. In one aspect, an electrical connecting device comprises an electrically insulating carrier having one or more contact structures traversing a plane thereof. Each contact structure comprises an elastomeric material having an electrically conductive layer running along at least one surface thereof continuously through the plane of the carrier.

Abstract: A system, method, and apparatus for injection molding conductive bonding material into a plurality of cavities in a surface are disclosed. The method comprises aligning a fill head with a surface. The mold includes a plurality of cavities. The method further includes placing the fill head in substantial contact with the surface. At least a first gas is channeled about a first region of the fill head. The at least first gas has a temperature above a melting point of conductive bonding material residing in a reservoir thereby maintaining the conductive bonding material in a molten state. The conductive bonding material is forced out of the fill head toward the surface. The conductive bonding material is provided into at least one cavity of the plurality of cavities contemporaneous with the at least one cavity being in proximity to the fill head.

Abstract: A system and method are provided for injection molding conductive bonding material into a plurality of cavities in a mold within a vacuum chamber. A mold and a fill head are located within a vacuum chamber, wherein the mold includes a plurality of cavities. A vacuum is created within the vacuum chamber, thereby removing air from the chamber and from the cavities. Optionally, rotational motion is provided to at least one of the mold and the fill head while the fill head is in substantial contact with the mold. Conductive bonding material is forced out of the fill head toward the mold, and into at least one of the cavities, while a vacuum is maintained in the vacuum chamber.

Abstract: A system, method, and device for applying conductive bonding material to a substrate are disclosed. The method includes providing conductive bonding material in a plurality of cavities of a mold. A total number of cavities in the plurality of cavities being greater than a total number of at least one conductive pad of a circuit supporting substrate corresponding to the mold. The conductive bonding material in the mold is heated to a reflow temperature of the conductive bonding material. At least one wettable surface is placed in substantial contact with the heated conductive bonding material in at least one cavity. The mold and the corresponding circuit supporting substrate are brought in close proximity to each other such that the heated conductive bonding material in at least one cavity comes in contact with at least one conductive pad of the corresponding circuit supporting substrate.

Abstract: A system, method, and apparatus of providing conductive bonding material into a plurality of cavities in a circuit supporting substrate is disclosed. The method comprises placing a fill head in substantial contact with a circuit supporting substrate. The circuit supporting substrate includes at least one cavity. A linear motion or a rotational motion is provided to at least one of the circuit supporting substrate and the fill head while the fill head is in substantial contact with the circuit supporting substrate. Conductive bonding material is forced out of the fill head toward the circuit supporting substrate. The conductive bonding material is provided into the at least one cavity contemporaneous with the at least one cavity being in proximity to the fill head.

Abstract: A system and method for injection molding conductive bonding material into a plurality of cavities in a non-rectangular mold is disclosed. The method comprises aligning a fill head with a non-rectangular mold. The non-rectangular mold includes a plurality of cavities. The fill head is placed in substantial contact with the non-rectangular mold. Rotational motion is provided to at least one of the non-rectangular mold and the fill head while the fill head is in substantial contact with the non-rectangular mold. Conductive bonding material is forced out of the fill head toward the non-rectangular mold. The conductive bonding material is provided into at least one cavity of the plurality of cavities contemporaneous with the at least one cavity being in proximity to the fill head.

Abstract: An apparatus for testing integrated circuit devices includes a probe device having a plurality of probes, a first substrate comprising a product substrate having a first surface and an array of electrical contacts disposed on the first surface thereof, and a second substrate disposed between the probes and the first substrate for electrically coupling the probes to corresponding electrical contacts disposed on the first surface of the product substrate.

Abstract: A flexible capacitive coupler assembly includes a flexible dielectric substrate assembly having a front surface and a rear surface, the front surface having thereon a macroscopic metal capacitive pad. A package supports the flexible dielectric substrate. An electrical connection is made to package wiring or leads on the flexible dielectric substrate to establish electrical contact with a computer subsystem.

Abstract: Systems and method for making flexible and rigid interposers for use in the semiconductor industry. Electroless plating processes are used to minimize the costs associated with the production of flexible interposers while increasing the yield and life-cycle of the interposers. Electrical contact regions are more easily isolated using the electroless processes and risk of corrosion is reduced because all portions of the interposer are plated at once. Leads projecting from the flexible portion of the interposers accommodate a greater variety of components to be tested. The rigid interposers include a pin projecting from a probe pad affixed to a substrate. The pin is aligned with conductive vias in the underlying wafer. The rigidity of the pin penetrates oxides on a contact pad to be tested. Readily available semiconductor materials and processes are used to manufacture the flexible and rigid interposers according to the invention. The flexible and rigid interposers can accommodate pitches of as little as 25 ?m.

Abstract: A process for overcoming extreme topographies by first planarizing a cavity in a semiconductor substrate in order to create a planar surface for subsequent lithography processing. As a result of the planarizing process for extreme topographies, subsequent lithography processing is enabled including the deposition of features in close proximity to extreme topographic surfaces (e.g., deep cavities or channels) and, including the deposition of features within a cavity. In a first embodiment, the process for planarizing a cavity in a semiconductor substrate includes the application of dry film resists having high chemical resistance. In a second embodiment, the process for planarizing a cavity includes the filling of cavity using materials such as polymers, spin on glasses, and metallurgy.