Patents by Inventor Steven D Leith

Steven D Leith has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7473649
    Abstract: A method of forming a slot in a substrate comprises growing an oxide layer on a first side of a substrate, patterning and etching the oxide layer to form an opening, forming a material overlying the opening and the oxide layer, removing substrate material through a second side to a first distance from the first side, and anisotropic etching the substrate to create a substrate opening at the first side which is aligned with the opening in the oxide layer during anisotropic etching. The material overlying the opening and the oxide layer is selected so that an anisotropic etch rate of the substrate at an interface of the material and the substrate is greater than an anisotropic etch rate of the substrate at an interface of the oxide layer and the substrate.
    Type: Grant
    Filed: July 24, 2006
    Date of Patent: January 6, 2009
    Inventors: Steven D Leith, Jeffrey S Obert, Eric L. Nikkel, Kenneth M Kramer
  • Patent number: 6922353
    Abstract: A memory apparatus has a plurality of first electrodes and at least one second electrode separated by an electrolyte solution. Information may be recorded by causing an electrical current to flow between a selected of the first electrodes and the second electrode to deposit an electrochemically active material on one of the selected first or the second electrodes. A method for recording and reading information has steps of writing the information by causing a current to flow between a first and a second electrode through an electrolyte solution to cause an electrochemically active material to electrodeposit, and reading the information by sensing the deposited material with a sensor.
    Type: Grant
    Filed: July 29, 2002
    Date of Patent: July 26, 2005
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: George Radominski, Timothy L Weber, Steven D Leith
  • Patent number: 6818138
    Abstract: A method of manufacturing a slotted substrate includes forming a masking layer over a first surface of a substrate, and patterning and etching the masking layer to form a hole therethrough. The first layer is deposited over the masking layer and in the hole. The first layer is patterned and etched to form a plug in the hole. A second surface of the substrate that is opposite the first surface is continuously etched until a bottom surface of the plug is substantially exposed and a slot in the substrate is substantially formed.
    Type: Grant
    Filed: June 22, 2001
    Date of Patent: November 16, 2004
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Jeffrey Scott Obert, Eric L. Nikkel, Kenneth M. Kramer, Steven D Leith