Patents by Inventor Steven D Leith
Steven D Leith has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230381735Abstract: A solar thermochemical processing system is disclosed. The system includes a first unit operation for receiving concentrated solar energy. Heat from the solar energy is used to drive the first unit operation. The first unit operation also receives a first set of reactants and produces a first set of products. A second unit operation receives the first set of products from the first unit operation and produces a second set of products. A third unit operation receives heat from the second unit operation to produce a portion of the first set of reactants.Type: ApplicationFiled: March 28, 2023Publication date: November 30, 2023Inventors: Robert Wegeng, Paul H. Humble, Shankar Krishnan, Steven D. Leith, Daniel R. Palo, Robert A. Dagle
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Patent number: 11623199Abstract: A solar thermochemical processing system is disclosed. The system includes a first unit operation for receiving concentrated solar energy. Heat from the solar energy is used to drive the first unit operation. The first unit operation also receives a first set of reactants and produces a first set of products. A second unit operation receives the first set of products from the first unit operation and produces a second set of products. A third unit operation receives heat from the second unit operation to produce a portion of the first set of reactants.Type: GrantFiled: June 28, 2021Date of Patent: April 11, 2023Assignee: Battelle Memorial InstituteInventors: Robert S. Wegeng, Paul H. Humble, Shankar Krishnan, Steven D. Leith, Daniel R. Palo, Robert A. Dagle
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Publication number: 20210322946Abstract: A solar thermochemical processing system is disclosed. The system includes a first unit operation for receiving concentrated solar energy. Heat from the solar energy is used to drive the first unit operation. The first unit operation also receives a first set of reactants and produces a first set of products. A second unit operation receives the first set of products from the first unit operation and produces a second set of products. A third unit operation receives heat from the second unit operation to produce a portion of the first set of reactants.Type: ApplicationFiled: June 28, 2021Publication date: October 21, 2021Inventors: Robert S. Wegeng, Paul H. Humble, Shankar Krishnan, Steven D. Leith, Daniel R. Palo, Robert A. Dagle
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Patent number: 11077418Abstract: A solar thermochemical processing system is disclosed. The system includes a first unit operation for receiving concentrated solar energy. Heat from the solar energy is used to drive the first unit operation. The first unit operation also receives a first set of reactants and produces a first set of products. A second unit operation receives the first set of products from the first unit operation and produces a second set of products. A third unit operation receives heat from the second unit operation to produce a portion of the first set of reactants.Type: GrantFiled: April 10, 2018Date of Patent: August 3, 2021Assignee: Battelle Memorial InstituteInventors: Robert S. Wegeng, Paul H. Humble, Shankar Krishnan, Steven D. Leith, Daniel R. Palo, Robert A. Dagle
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Publication number: 20180339283Abstract: A solar thermochemical processing system is disclosed. The system includes a first unit operation for receiving concentrated solar energy. Heat from the solar energy is used to drive the first unit operation. The first unit operation also receives a first set of reactants and produces a first set of products. A second unit operation receives the first set of products from the first unit operation and produces a second set of products. A third unit operation receives heat from the second unit operation to produce a portion of the first set of reactants.Type: ApplicationFiled: April 10, 2018Publication date: November 29, 2018Applicant: Battelle Memorial InstituteInventors: Robert S. Wegeng, Paul H. Humble, Shankar Krishnan, Steven D. Leith, Daniel R. Palo, Robert A. Dagle
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Patent number: 9950305Abstract: A solar thermochemical processing system is disclosed. The system includes a first unit operation for receiving concentrated solar energy. Heat from the solar energy is used to drive the first unit operation. The first unit operation also receives a first set of reactants and produces a first set of products. A second unit operation receives the first set of products from the first unit operation and produces a second set of products. A third unit operation receives heat from the second unit operation to produce a portion of the first set of reactants.Type: GrantFiled: July 26, 2012Date of Patent: April 24, 2018Assignee: Battelle Memorial InstituteInventors: Robert S. Wegeng, Paul H. Humble, Shankar Krishnan, Steven D. Leith, Daniel R. Palo, Robert A. Dagle
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Publication number: 20130025192Abstract: A solar thermochemical processing system is disclosed. The system includes a first unit operation for receiving concentrated solar energy. Heat from the solar energy is used to drive the first unit operation. The first unit operation also receives a first set of reactants and produces a first set of products. A second unit operation receives the first set of products from the first unit operation and produces a second set of products. A third unit operation receives heat from the second unit operation to produce a portion of the first set of reactants.Type: ApplicationFiled: July 26, 2012Publication date: January 31, 2013Applicant: BATTELLE MEMORIAL INSTITUTEInventors: Robert S. Wegeng, Paul H. Humble, Shankar Krishnan, Steven D. Leith, Daniel R. Palo
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Patent number: 7473649Abstract: A method of forming a slot in a substrate comprises growing an oxide layer on a first side of a substrate, patterning and etching the oxide layer to form an opening, forming a material overlying the opening and the oxide layer, removing substrate material through a second side to a first distance from the first side, and anisotropic etching the substrate to create a substrate opening at the first side which is aligned with the opening in the oxide layer during anisotropic etching. The material overlying the opening and the oxide layer is selected so that an anisotropic etch rate of the substrate at an interface of the material and the substrate is greater than an anisotropic etch rate of the substrate at an interface of the oxide layer and the substrate.Type: GrantFiled: July 24, 2006Date of Patent: January 6, 2009Inventors: Steven D Leith, Jeffrey S Obert, Eric L. Nikkel, Kenneth M Kramer
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Patent number: 7334871Abstract: The described embodiments relate to fluid-ejection devices and methods of forming same. One exemplary embodiment includes a plurality of fluid drop generators and associated electrically conductive paths, and at least one electron beam generation assembly configured to selectively direct at least one electron beam at individual electrically conductive paths sufficiently to cause fluid to be ejected from an associated fluid drop generator.Type: GrantFiled: March 26, 2004Date of Patent: February 26, 2008Assignee: Hewlett-Packard Development Company, L.P.Inventors: George Z. Radominski, Steven D. Leith, Timothy R. Emery, Thomas H. Ottenheimer
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Patent number: 7105456Abstract: A method of forming a slot in a substrate comprises growing an oxide layer on a first side of a substrate, patterning and etching the oxide layer to form an opening, forming a material overlying the opening and the oxide layer, removing substrate material through a second side to a first distance from the first side, and anisotropic etching the substrate to create a substrate opening at the first side which is aligned with the opening in the oxide layer during anisotropic etching. The material overlying the opening and the oxide layer is selected so that an anisotropic etch rate of the substrate at an interface of the material and the substrate is greater than an anisotropic etch rate of the substrate at an interface of the oxide layer and the substrate.Type: GrantFiled: October 29, 2004Date of Patent: September 12, 2006Assignee: Hewlett-Packard Development Company, LP.Inventors: Steven D. Leith, Jeffrey S. Obert, Eric L. Nikkel, Kenneth M. Kramer
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Patent number: 6922353Abstract: A memory apparatus has a plurality of first electrodes and at least one second electrode separated by an electrolyte solution. Information may be recorded by causing an electrical current to flow between a selected of the first electrodes and the second electrode to deposit an electrochemically active material on one of the selected first or the second electrodes. A method for recording and reading information has steps of writing the information by causing a current to flow between a first and a second electrode through an electrolyte solution to cause an electrochemically active material to electrodeposit, and reading the information by sensing the deposited material with a sensor.Type: GrantFiled: July 29, 2002Date of Patent: July 26, 2005Assignee: Hewlett-Packard Development Company, L.P.Inventors: George Radominski, Timothy L Weber, Steven D Leith
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Patent number: 6818138Abstract: A method of manufacturing a slotted substrate includes forming a masking layer over a first surface of a substrate, and patterning and etching the masking layer to form a hole therethrough. The first layer is deposited over the masking layer and in the hole. The first layer is patterned and etched to form a plug in the hole. A second surface of the substrate that is opposite the first surface is continuously etched until a bottom surface of the plug is substantially exposed and a slot in the substrate is substantially formed.Type: GrantFiled: June 22, 2001Date of Patent: November 16, 2004Assignee: Hewlett-Packard Development Company, L.P.Inventors: Jeffrey Scott Obert, Eric L. Nikkel, Kenneth M. Kramer, Steven D Leith
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Publication number: 20040017694Abstract: A memory apparatus has a plurality of first electrodes and at least one second electrode separated by an electrolyte solution. Information may be recorded by causing an electrical current to flow between a selected of the first electrodes and the second electrode to deposit an electrochemically active material on one of the selected first or the second electrodes. A method for recording and reading information has steps of writing the information by causing a current to flow between a first and a second electrode through an electrolyte solution to cause an electrochemically active material to electrodeposit, and reading the information by sensing the deposited material with a sensor.Type: ApplicationFiled: July 29, 2002Publication date: January 29, 2004Inventors: George Radominski, Timothy L. Weber, Steven D. Leith
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Patent number: 6599761Abstract: A through-substrate etching process is monitored by providing a sacrificial electrode in proximity to a desired etch window on the substrate. An etch process is performed on the substrate. The etch process is monitored by measuring an electrical property of either the substrate or the sacrificial electrode or both.Type: GrantFiled: July 26, 2001Date of Patent: July 29, 2003Assignee: Hewlett-Packard Development CompanyInventors: Jeffery S. Hess, Steven D. Leith, Donald W. Schulte, William Edwards, Jeffrey S. Obert, Timothy R. Emery
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Publication number: 20030022397Abstract: A through-substrate etching process is monitored by providing a sacrificial electrode in proximity to a desired etch window on the substrate. An etch process is performed on the substrate. The etch process is monitored by measuring an electrical property of either the substrate or the sacrificial electrode or both.Type: ApplicationFiled: July 26, 2001Publication date: January 30, 2003Inventors: Jeffery S. Hess, Steven D. Leith, Donald W. Schulte, William Edwards, Jeffrey S. Obert, Timothy R. Emery
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Publication number: 20020195420Abstract: A method of manufacturing a slotted substrate includes forming a masking layer over a first surface of a substrate, and patterning and etching the masking layer to form a hole therethrough. The first layer is deposited over the masking layer and in the hole. The first layer is patterned and etched to form a plug in the hole. A second surface of the substrate that is opposite the first surface is continuously etched until a bottom surface of the plug is substantially exposed and a slot in the substrate is substantially formed.Type: ApplicationFiled: June 22, 2001Publication date: December 26, 2002Inventors: Jeffrey Scott Obert, Eric L. Nikkel, Kenneth M. Kramer, Steven D. Leith