Abstract: A substrate assembly for use in a lamp has a main printed wiring board and a standoff board. The main printed wiring board has a main surface with one or more LED packages disposed on the main surface and electrically connected thereto. The standoff board is disposed on the main surface of the main printed wiring board. The standoff board has an LED package disposed thereon and conductors to provide an electrical connection between the LED package disposed on the standoff board and the main printed wiring board.

Abstract: A method of manufacturing an article having a substructure with a wall having first and second wall surfaces and a molded layer along the first wall surface. The substructure is supported in a tool having first and second die surfaces on either side of the wall. The first die surface is spaced apart from the first wall surface and the second die surface is spaced apart from the second wall surface. A moldable material is injected between the first die surface and the first wall surface under conditions causing said material to exert a force on the wall. The second wall surface is contacted with a fluid under sufficient pressure to create a force on the wall that offsets the force exerted by the material whereby the wall is supported against deformation.