Patents by Inventor Steven D. Oliver

Steven D. Oliver has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200108528
    Abstract: Methods and structures are provided for wafer-level packaging of light-emitting diodes (LEDs). An array of LED die are mounted on a packaging substrate. The substrate may include an array of patterned metal contacts on a front side. The metal contacts may be in electrical communication with control logic formed in the substrate. The LEDs mounted on the packaging substrate may also be encapsulated individually or in groups and then singulated, or the LEDs mounted on the packaging substrate may be integrated with a micro-mirror array or an array of lenses.
    Type: Application
    Filed: December 9, 2019
    Publication date: April 9, 2020
    Inventor: Steven D. Oliver
  • Patent number: 10500770
    Abstract: Methods and structures are provided for wafer-level packaging of light-emitting diodes (LEDs). An array of LED die are mounted on a packaging substrate. The substrate may include an array of patterned metal contacts on a front side. The metal contacts may be in electrical communication with control logic formed in the substrate. The LEDs mounted on the packaging substrate may also be encapsulated individually or in groups and then singulated, or the LEDs mounted on the packaging substrate may be integrated with a micro-mirror array or an array of lenses.
    Type: Grant
    Filed: March 1, 2011
    Date of Patent: December 10, 2019
    Assignee: SO-SEMI TECHNOLOGIES, LLC
    Inventor: Steven D. Oliver
  • Patent number: 8669179
    Abstract: A through-wafer interconnect for imager, memory and other integrated circuit applications is disclosed, thereby eliminating the need for wire bonding, making devices incorporating such interconnects stackable and enabling wafer level packaging for imager devices. Further, a smaller and more reliable die package is achieved and circuit parasitics (e.g., L and R) are reduced due to the reduced signal path lengths.
    Type: Grant
    Filed: July 11, 2013
    Date of Patent: March 11, 2014
    Assignee: Micron Technology, Inc.
    Inventors: Salman Akram, Charles M. Watkins, William M. Hiatt, David R. Hembree, James M. Wark, Warren M. Farnworth, Mark E. Tuttle, Sidney B. Rigg, Steven D. Oliver, Kyle K. Kirby, Alan G. Wood, Lu Velicky
  • Publication number: 20130295766
    Abstract: A through-wafer interconnect for imager, memory and other integrated circuit applications is disclosed, thereby eliminating the need for wire bonding, making devices incorporating such interconnects stackable and enabling wafer level packaging for imager devices. Further, a smaller and more reliable die package is achieved and circuit parasitics (e.g., L and R) are reduced due to the reduced signal path lengths.
    Type: Application
    Filed: July 11, 2013
    Publication date: November 7, 2013
    Inventors: Salman Akram, Charles M. Watkins, William M. Hiatt, David R. Hembree, James M. Wark, Warren M. Farnworth, Mark E. Tuttle, Sidney B. Rigg, Steven D. Oliver, Kyle K. Kirby, Alan G. Wood, Lu Velicky
  • Patent number: 8502353
    Abstract: A through-wafer interconnect for imager, memory and other integrated circuit applications is disclosed, thereby eliminating the need for wire bonding, making devices incorporating such interconnects stackable and enabling wafer level packaging for imager devices. Further, a smaller and more reliable die package is achieved and circuit parasitics (e.g., L and R) are reduced due to the reduced signal path lengths.
    Type: Grant
    Filed: June 7, 2011
    Date of Patent: August 6, 2013
    Assignee: Micron Technology, Inc.
    Inventors: Salman Akram, Charles M. Watkins, William M. Hiatt, David R. Hembree, James M. Wark, Warren M. Farnworth, Mark E. Tuttle, Sidney B. Rigg, Steven D. Oliver, Kyle K. Kirby, Alan G. Wood, Lu Velicky
  • Publication number: 20110215342
    Abstract: Methods and structures are provided for wafer-level packaging of light-emitting diodes (LEDs). An array of LED die are mounted on a packaging substrate. The substrate may include an array of patterned metal contacts on a front side. The metal contacts may be in electrical communication with control logic formed in the substrate. The LEDs mounted on the packaging substrate may also be encapsulated individually or in groups and then singulated, or the LEDs mounted on the packaging substrate may be integrated with a micro-mirror array or an array of lenses.
    Type: Application
    Filed: March 1, 2011
    Publication date: September 8, 2011
    Inventor: Steven D. Oliver
  • Patent number: 7993944
    Abstract: Microelectronic imager assemblies with optical devices having integral reference features and methods for assembling such microelectronic imagers is disclosed herein. In one embodiment, the imager assembly can include a workpiece with a substrate having a front side, a back side, and a plurality of imaging dies on and/or in the substrate. The imaging dies include image sensors, integrated circuitry operatively coupled to the image sensors, and external contacts electrically coupled to the integrated circuitry. The assembly also includes optics supports on the workpiece. The optics supports have openings aligned with corresponding image sensors and first interface features at reference locations relative to corresponding image sensors. The assembly further includes optical devices having optics elements and second interface features seated with corresponding first interface features to position the optics elements at a desired location relative to corresponding image sensors.
    Type: Grant
    Filed: August 22, 2008
    Date of Patent: August 9, 2011
    Assignee: Micron Technology, Inc.
    Inventors: Steven D. Oliver, James M. Wark, Kyle K. Kirby
  • Patent number: 7956443
    Abstract: A through-wafer interconnect for imager, memory and other integrated circuit applications is disclosed, thereby eliminating the need for wire bonding, making devices incorporating such interconnects stackable and enabling wafer level packaging for imager devices. Further, a smaller and more reliable die package is achieved and circuit parasitics (e.g., L and R) are reduced due to the reduced signal path lengths.
    Type: Grant
    Filed: March 17, 2010
    Date of Patent: June 7, 2011
    Assignee: Micron Technology, Inc.
    Inventors: Salman Akram, Charles M. Watkins, Mark Hiatt, David R. Hembree, James M. Wark, Warren M. Farnworth, Mark E. Tuttle, Sidney B. Rigg, Steven D. Oliver, Kyle K. Kirby, Alan G. Wood, Lu Velicky
  • Patent number: 7920339
    Abstract: Methods and apparatus to correct a curved Petzval focusing surface to a plane using a convex lens, a concave lens, and a space arranged between the curved side of the convex lens and the curved side of the concave lens. The method and apparatus may also include a Fresnel lens arranged between the concave lens and a pixel array.
    Type: Grant
    Filed: July 2, 2008
    Date of Patent: April 5, 2011
    Assignee: Aptina Imaging Corporation
    Inventors: Jacques Duparre, Steven D. Oliver
  • Patent number: 7864457
    Abstract: Lens structures, imaging devices, and methods of making the same that include a lens and a transparent material having different dispersions and used to correct chromatic and spherical aberrations. The transparent material may be a curable polymer used to join the lens to other elements of the lens structure.
    Type: Grant
    Filed: April 28, 2009
    Date of Patent: January 4, 2011
    Assignee: Micron Technology, Inc.
    Inventors: Jacques Duparre, Steven D. Oliver
  • Patent number: 7833601
    Abstract: Methods for releasably attaching support members to microfeature workpieces and microfeature assemblies formed using such methods are disclosed herein. A method for processing a microfeature workpiece in accordance with one embodiment includes applying adhesive material to a non-active portion on a first side of a workpiece. The workpiece can include a first active portion and a second active portion separated from each other at least in part by the non-active portion. The method continues by adhesively attaching the first side of the workpiece to a first support member, and releasably attaching the second side of the workpiece to a second support member. The method further includes separating the first active portion from the second active portion while the workpiece is attached to the second support member by cutting through the first support member and the non-active portion of the workpiece.
    Type: Grant
    Filed: October 24, 2006
    Date of Patent: November 16, 2010
    Assignee: Micron Technology, Inc.
    Inventors: Kyle K. Kirby, Steven D. Oliver
  • Publication number: 20100271714
    Abstract: Lens structures, imaging devices, and methods of making the same that include a lens and a transparent material having different dispersions and used to correct chromatic and spherical aberrations. The transparent material may be a curable polymer used to join the lens to other elements of the lens structure.
    Type: Application
    Filed: April 28, 2009
    Publication date: October 28, 2010
    Inventors: Jacques Duparre, Steven D. Oliver
  • Patent number: 7749899
    Abstract: Methods and systems for forming electrical interconnects through microelectronic workpieces are disclosed herein. One aspect of the invention is directed to a method of manufacturing an electrical interconnect in a microelectronic workpiece having a plurality of dies. Each die can include at least one terminal electrically coupled to an integrated circuit. The method can include forming a blind hole in a first side of the workpiece, and forming a vent in a second side of the workpiece in fluid communication with the blind hole. The method can further include moving, e.g., by sucking and/or wetting, electrically conductive material into at least a portion of the blind hole by drawing at least a partial vacuum in the vent. In one embodiment, the blind hole can extend through one of the terminals on the workpiece. In this embodiment, the electrically conductive material forms an interconnect that extends through the workpiece and is electrically coupled to the terminal.
    Type: Grant
    Filed: June 1, 2006
    Date of Patent: July 6, 2010
    Assignee: Micron Technology, Inc.
    Inventors: Douglas Clark, Steven D. Oliver, Kyle K. Kirby, Ross S. Dando
  • Patent number: 7696588
    Abstract: Microelectronic imagers with shaped image sensors and methods for manufacturing curved image sensors. In one embodiment, a microelectronic imager device comprises an imaging die having a substrate, a curved microelectronic image sensor having a face with a convex and/or concave portion at one side of the substrate, and integrated circuitry in the substrate operatively coupled to the image sensor. The imaging die can further include external contacts electrically coupled to the integrated circuitry and a cover over the curved image sensor.
    Type: Grant
    Filed: January 29, 2007
    Date of Patent: April 13, 2010
    Assignee: Aptina Imaging Corporation
    Inventors: Ulrich C. Boettiger, Jin Li, Steven D. Oliver
  • Patent number: 7683458
    Abstract: A through-wafer interconnect for imager, memory and other integrated circuit applications is disclosed, thereby eliminating the need for wire bonding, making devices incorporating such interconnects stackable and enabling wafer level packaging for imager devices. Further, a smaller and more reliable die package is achieved and circuit parasitics (e.g., L and R) are reduced due to the reduced signal path lengths.
    Type: Grant
    Filed: October 26, 2007
    Date of Patent: March 23, 2010
    Assignee: Micron Technology, Inc.
    Inventors: Salman Akram, Charles M. Watkins, William M. Hiatt, David R. Hembree, James M. Wark, Warren M. Farnworth, Mark E. Tuttle, Sidney B. Rigg, Steven D. Oliver, Kyle K. Kirby, Alan G. Wood, Lu Velicky
  • Publication number: 20100002313
    Abstract: Methods and apparatus to correct a curved Petzval focusing surface to a plane using a convex lens, a concave lens, and a space arranged between the curved side of the convex lens and the curved side of the concave lens. The method and apparatus may also include a Fresnel lens arranged between the concave lens and a pixel array.
    Type: Application
    Filed: July 2, 2008
    Publication date: January 7, 2010
    Inventors: Jacques Duparre, Steven D. Oliver
  • Publication number: 20090321861
    Abstract: Microelectronic imagers including stacked lens assemblies and process for wafer-level packaging of microelectronic imagers. One embodiment of a method for manufacturing stacked lens assemblies for integrated imagers comprises attaching a first lens substrate to a base spacer, fixing an intermediate spacer to the first lens substrate, and mounting a second lens substrate to the intermediate spacer. In a specific embodiment, the first lens substrate can be a component of a first lens unit and the second lens substrate can be a component of a second lens unit. Additionally, the first and second lens substrates can have one or more lens elements, aperture layers and/or filters on the substrates as described above or in other combinations.
    Type: Application
    Filed: June 26, 2008
    Publication date: December 31, 2009
    Applicant: MICRON TECHNOLOGY, INC.
    Inventors: Steven D. Oliver, Rick C. Lake, Ulrich C. Boettiger
  • Publication number: 20080318353
    Abstract: Microelectronic imager assemblies with optical devices having integral reference features and methods for assembling such microelectronic imagers is disclosed herein. In one embodiment, the imager assembly can include a workpiece with a substrate having a front side, a back side, and a plurality of imaging dies on and/or in the substrate. The imaging dies include image sensors, integrated circuitry operatively coupled to the image sensors, and external contacts electrically coupled to the integrated circuitry. The assembly also includes optics supports on the workpiece. The optics supports have openings aligned with corresponding image sensors and first interface features at reference locations relative to corresponding image sensors. The assembly further includes optical devices having optics elements and second interface features seated with corresponding first interface features to position the optics elements at a desired location relative to corresponding image sensors.
    Type: Application
    Filed: August 22, 2008
    Publication date: December 25, 2008
    Inventors: Steven D. Oliver, James M. Wark, Kyle K. Kirby
  • Patent number: 7452743
    Abstract: Microelectronic imaging units and methods for manufacturing a plurality of imaging units at the wafer level are disclosed herein. In one embodiment, a method for manufacturing a plurality of imaging units includes providing an imager workpiece having a plurality of imaging dies including integrated circuits, external contacts electrically coupled to the integrated circuits, and image sensors operably coupled to the integrated circuits. The individual image sensors include at least one dark current pixel at a perimeter portion of the image sensor. The method includes depositing a cover layer onto the workpiece and over the image sensors. The method further includes patterning and selectively developing the cover layer to form discrete volumes of cover layer material over corresponding image sensors. The discrete volumes of cover layer material have sidewalls aligned with an inboard edge of the individual dark current pixels such that the dark current pixels are not covered by the discrete volumes.
    Type: Grant
    Filed: September 1, 2005
    Date of Patent: November 18, 2008
    Assignee: Aptina Imaging Corporation
    Inventors: Steven D. Oliver, Lu Velicky, William Mark Hiatt, David R. Hembree, Mark E. Tuttle, Sidney B. Rigg, James M. Wark, Warren M. Farnworth, Kyle K. Kirby
  • Publication number: 20080237443
    Abstract: Microelectronic imagers with curved image sensors and methods for manufacturing curved image sensors. In one embodiment, a microelectronic imager device comprises an imager die having a substrate, a curved microelectronic image sensor having a face with a convex and/or concave portion at one side of the substrate, and integrated circuitry in the substrate operatively coupled to the image sensor. The imager die can further include external contacts electrically coupled to the integrated circuitry and a cover over the curved image sensor.
    Type: Application
    Filed: June 6, 2008
    Publication date: October 2, 2008
    Inventors: Steven D. Oliver, Jin Li, Ulrich C. Boettiger