Abstract: A method for evaluating a weld in a formed object includes performing a contact mechanics test of a first region that includes the weld and storing one or more corresponding weld surface mechanical property measurements, performing a contact mechanics test of a second region that excludes the weld and storing one or more corresponding base material surface mechanical property measurements, determining a relative difference in the weld surface mechanical property measurements and the base material surface mechanical property measurements, determining one or more weld width measurements on the exterior surface of the formed object, and evaluating the weld based on the determined relative difference in the weld surface mechanical property measurements and the base material surface mechanical property measurements in relation to the determined weld width measurements in order to provide an index of weld quality that is traditionally measured through a destructive test or examination.

Abstract: An apparatus for performing a contact mechanics test in a substrate includes a stylus having at least two contact elements. Each contact element has a contact profile, and the contact elements are disposed in the stylus to define a stretch passage therebetween. The stylus is configured to deform the substrate so as to cause the substrate to flow between the contact elements and induce tension in the substrate in order to generate and preserve micromodifications in the substrate. Methods of performing a contact mechanics test using the apparatus are also provided.

Abstract: An apparatus for performing a contact mechanics test in a substrate includes a stylus having at least two contact elements. Each contact element has a contact profile, and the contact elements are disposed in the stylus to define a stretch passage therebetween. The stylus is configured to deform the substrate so as to cause the substrate to flow between the contact elements and induce tension in the substrate in order to generate and preserve micromodifications in the substrate. Methods of performing a contact mechanics test using the apparatus are also provided.

Abstract: An apparatus for performing a contact mechanics test on a substrate includes a stylus, a core configured to engage the stylus against the substrate, a stylus engagement mechanism configured to induce a contact load or a penetration depth to the stylus, a core engagement mechanism configured to maintain contact of the core and to move the core along the substrate surface, a frame configured to be fixed with respect to the apparatus or to be moved together with the core engagement mechanism as an assembly, a frame engagement mechanism configured to engage the frame with the substrate surface; and a substrate monitoring device configured to measure characteristics of substrate contact response and/or collect material machined from the substrate. Methods of performing a contact mechanics test are also provided.

Abstract: An apparatus for performing a contact mechanics test on a substrate includes a stylus, a core configured to engage the stylus against the substrate, a stylus engagement mechanism configured to induce a contact load or a penetration depth to the stylus, a core engagement mechanism configured to maintain contact of the core and to move the core along the substrate surface, a frame configured to be fixed with respect to the apparatus or to be moved together with the core engagement mechanism as an assembly, a frame engagement mechanism configured to engage the frame with the substrate surface; and a substrate monitoring device configured to measure characteristics of substrate contact response and/or collect material machined from the substrate. Methods of performing a contact mechanics test are also provided.

Abstract: Provide in one embodiment is an apparatus, comprising an indentor wherein a tip thereof is configured to engage a sample surface, a surface-referencing device configured to establish the position of the indentor relative to the sample surface, a drive mechanism configured to move the indentor along the sample surface to form a scratch, and a measurement device configured to measure at least one of (i) a pile-up height of sample material removed from the scratch and (ii) a width of the scratch.

Abstract: An apparatus for performing a contact mechanics test on a substrate includes a stylus, a core configured to engage the stylus against the substrate, a stylus engagement mechanism configured to induce a contact load or a penetration depth to the stylus, a core engagement mechanism configured to maintain contact of the core and to move the core along the substrate surface, a frame configured to be fixed with respect to the apparatus or to be moved together with the core engagement mechanism as an assembly, a frame engagement mechanism configured to engage the frame with the substrate surface; and a substrate monitoring device configured to measure characteristics of substrate contact response and/or collect material machined from the substrate. Methods of performing a contact mechanics test are also provided.

Abstract: An apparatus for performing a contact mechanics test on a substrate includes a stylus, a core configured to engage the stylus against the substrate, a stylus engagement mechanism configured to induce a contact load or a penetration depth to the stylus, a core engagement mechanism configured to maintain contact of the core and to move the core along the substrate surface, a frame configured to be fixed with respect to the apparatus or to be moved together with the core engagement mechanism as an assembly, a frame engagement mechanism configured to engage the frame with the substrate surface; and a substrate monitoring device configured to measure characteristics of substrate contact response and/or collect material machined from the substrate. Methods of performing a contact mechanics test are also provided.

Abstract: Provide in one embodiment is an apparatus, comprising an indentor wherein a tip thereof is configured to engage a sample surface, a surface-referencing device configured to establish the position of the indentor relative to the sample surface, a drive mechanism configured to move the indentor along the sample surface to form a scratch, and a measurement device configured to measure at least one of (i) a pile-up height of sample material removed from the scratch and (ii) a width of the scratch.