Abstract: A furniture product with a leg supported frame has transversely spaced apart tubular side rails with slotted openings in wall faces thereof for receiving the sling edge loops of a web sling which spans the rails to support the weight of a furniture occupant. The side rails have rod-like members, of a cross-sectional configuration larger than the slotted openings, extending through the loops, to retain the loops within the rails. The sling loops include a synthetic plastic fabric core sheet provided with synthetic thermoplastic coats on each side, the core sheet edges forming the loops extending into the slotted openings and around the rod-like members, and then back out the slotted openings to positions terminating in heat welded seam folds of double core sheet thickness lying upon and braced by the rail wall faces.

Abstract: An optical communication arrangement is disclosed which utilizes a combination of leadframe and package molding technology to reduce the complexity of the arrangement. In general, a leadframe is utilized for the placement and connection of the required electronic circuitry. A first molding operation is then performed to encapsulate the electronics. If necessary, a metallic plate may then be attached to the housed electronics to provide EMI shielding. An optical device is then coupled to the leadframe, where a separate subassembly may be used to house the optical device. The encapsulated electronics and optics are then simultaneously covered during a second molding operation to form the final package. In one embodiment, an optical subassembly incorporating a connector receptacle may be utilized, where the second molding operation is performed such that the connector receptacle remains exposed. Alternatively, the molded outer package may be configured to include the connector receptacle.

Abstract: Advanced packaging techniques are utilized to provide updated packaging for optical transmitters and receivers. In particular, the hybrid integrated circuit (HIC) used to form either the transmitter or receiver circuitry in the prior art has been replaced by a plastic dual-in-line package (DIP). The DIP includes specialized leads (prongs) formed through the short end of the DIP to provide direct connection to the optical device. These end-prong leads thus significantly decrease the parasitic capacitance associated with conventional DIP connections. A capacitor may be molded into the DIP across the power supply leads to provide filtering for the package. Thermal dissipation is provided by two separate means in this package.