Patents by Inventor Steven David Leith

Steven David Leith has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate and method of forming substrate for fluid ejection device
    Patent number: 6910758
    Abstract: A method of forming an opening through a substrate having a first side and a second side opposite the first side includes forming spaced stops in the first side of the substrate, partially forming a first portion of the opening in the substrate from the second side by a first process, further forming the first portion of the opening in the substrate from the second side by a second process, including forming the first portion of the opening to the spaced stops, and forming a second portion of the opening in the substrate from the first side, including forming the second portion of the opening between the spaced stops.
    Type: Grant
    Filed: July 15, 2003
    Date of Patent: June 28, 2005
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Martha A. Truninger, Steven David Leith, Jeffery S. Hess