Patents by Inventor Steven DeNies

Steven DeNies has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060221581
    Abstract: A folding latching mechanism and related structure. An embodiment of the folding latching mechanism includes a latch member having a claw-shaped clasp disposed proximate to a pivot member that enables a pivotal coupling about a first pivot axis. A lever arm is pivotally-coupled to the latch member about a second pivot (fold) axis that is perpendicular to the first pivot axis of the latch member. During use, the latch member is rotated about its first pivot axis via the lever arm in an extended position, whereby the latching member is securely coupled to a frame member via its clasp. The lever arm is then rotated about its fold axis and secured in place. The folding latching mechanism may be employed on an Advanced Telecom Computing Architecture (ATCA) board hosting one or more Advanced Mezzanine Card (AdvancedMC) modules, wherein the mechanism does not interfere with the I/O port interfaces for the modules.
    Type: Application
    Filed: March 31, 2005
    Publication date: October 5, 2006
    Inventors: Steven DeNies, William Handley, Mark Summers
  • Publication number: 20060223343
    Abstract: A stacked multiple connection module that provides multiple times the input/output (I/O) signal capacity of a single connection module. In one embodiment, a stacked dual connection module includes first and second circuit boards with respective edge connectors maintained at a parallel offset and configured to couple to a mating two slotted stacked edge connector. A connection means is provided to couple signals between the first and second circuit boards, such that components mounted on the first and/or second circuit board are enabled to access I/O signals via both of the edge connectors, thus doubling I/O signal capacity. In one embodiment, the stacked dual connection module comprises an Advanced Mezzanine Card (AdvancedMC) module having edge connectors configured to mate with an AdvancedMC connector.
    Type: Application
    Filed: March 31, 2005
    Publication date: October 5, 2006
    Inventors: Edoardo Campini, Douglas Stahl, Steven DeNies, Jay Gilbert, Jacek Budny, Gerard Wisniewski
  • Publication number: 20060218329
    Abstract: A method and apparatus to couple a rear transition module to a carrier board includes detecting a rear transition module (RTM) coupled to an interface resident on a carrier board, the carrier board coupled to a backplane. The method further includes logically coupling the RTM to a management controller resident on the carrier board and managing the RTM in a same manner as a front accessible module coupled to another interface resident on the carrier board.
    Type: Application
    Filed: March 23, 2005
    Publication date: September 28, 2006
    Inventors: Steven DeNies, Mark Summers, Edoardo Campini, Lawson Guthrie
  • Publication number: 20060140179
    Abstract: Embodiments are generally directed to a method and apparatus to couple a module to a management controller on an interconnect. In one embodiment, a method includes detecting that a module has coupled to an interconnect, the interconnect coupled to a modular platform backplane. The method further includes logically coupling the module to one of a plurality of management controllers resident on the interconnect, each management controller logically appears as a management controller for different interconnects coupled to the modular platform backplane.
    Type: Application
    Filed: December 29, 2004
    Publication date: June 29, 2006
    Inventors: Edoardo Campini, Steven DeNies, Mark Summers, Lawson Guthrie