Abstract: A circuit layer is formed by drilling vias and forming channels in a circuit layer which has catalytic particles exposed on the surfaces, channels, and vias. A first flash electroless deposition is followed by application of dry film, followed by selective laser ablation of the dry film channels and vias. A second electroless solution is applied which provides additional deposition over the first flash electroless deposition but only on the vias and trace channel areas. An electrodeposition follows, using the first deposition as a cathode. The dry film is stripped and the first electroless layer is etched, leaving only depositions in the channels and vias.

Abstract: A method and apparatus for producing high layer count, multi-layer circuits which includes fabricating a fixture having an opening therein for placement within a press. A material stack, particularly a material stack having multiple layers of liquid crystalline polymer, is placed within the opening of the fixture before activating the press to laminate the material stack positioned within the fixture.

Abstract: A method and apparatus for producing high layer count, multi-layer circuits which includes fabricating a fixture having an opening therein for placement within a press. A material stack, particularly a material stack having multiple layers of liquid crystalline polymer, is placed within the opening of the fixture before activating the press to laminate the material stack positioned within the fixture.

Abstract: A method and apparatus for producing high layer count, multi-layer circuits which includes fabricating a fixture having an opening therein for placement within a press. A material stack, particularly a material stack having multiple layers of liquid crystalline polymer, is placed within the opening of the fixture before activating the press to laminate the material stack positioned within the fixture.

Abstract: A method and apparatus for producing high layer count, multi-layer circuits which includes fabricating a fixture having an opening therein for placement within a press. A material stack, particularly a material stack having multiple layers of liquid crystalline polymer, is placed within the opening of the fixture before activating the press to laminate the material stack positioned within the fixture.

Abstract: The present invention provides methods and apparatus for constructing an acoustic absorbing structure, such as a wall or enclosure, with removable and serviceable acoustic absorbing panels.

Abstract: The present invention provides methods and apparatus for constructing an acoustic absorbing structure, such as a wall or enclosure, with removable and serviceable acoustic absorbing panels.

Abstract: The invention provides a method for acoustic closure of an installation of a row of sound isolation modules within a host building encompassing the modules. One or more acoustic absorbing closure panels are mounted to form a partition in front of the row of modules, thus forming two acoustically separate regions. The absorbing panels are comprised of one or more sound absorbing materials between a front and rear surface. The front surface faces the region exterior to the installation within the host building. The rear surface faces the installation.

Abstract: The invention provides a method for acoustic closure of an installation of a row of sound isolation modules within a host building encompassing the modules. One or more acoustic absorbing closure panels are mounted to form a partition in front of the row of modules, thus forming two acoustically separate regions. The absorbing panels are comprised of one or more sound absorbing materials between a front and rear surface. The front surface faces the region exterior to the installation within the host building. The rear surface faces the installation.