Abstract: A silicon nitride layer is formed on at least a back side of a silicon wafer substrate of a semiconductor device. An oxide layer is formed on at least the silicon nitride layer on the back side of the substrate. The oxide layer protects the silicon nitride layer during processing of the device. The oxide layer is removed prior to packaging the device. After components have been formed on a front side of the substrate opposite the back side, packaging is attached to the silicon nitride layer. The components provide a functionality of the device. The silicon nitride layer completely remains on the back side of the substrate after fabrication of the device has been completed. The silicon nitride layer is adapted to minimize and does minimize bowing of the device.

Abstract: Embodiments of a semiconductor device are disclosed.

Abstract: An apparatus for use in processing a workpiece to fabricate a microelectronic component is set forth. The apparatus comprises a process container having a process fluid therein for processing the workpiece and a workpiece holder configured to hold the workpiece. A position sensor is employed to provide position information indicative of the spacing between a surface of the workpiece and a surface of the process fluid. A drive system provides relative movement between the surface of the workpiece and the surface of the process fluid in response to the position information. Preferably, the relative movement provided by the drive system comprises a first motion that causes the surface of the workpiece to contact the surface of the process fluid, and a second motion opposite the direction all of and following the first to generate and maintain a column of process fluid between the surface of the process fluid and the surface of the workpiece.

Abstract: The present invention provides semiconductor workpiece processors and methods of wetting and processing a semiconductor workpiece. One method of wetting and processing a semiconductor workpiece with process fluid comprises providing a semiconductor workpiece having a surface; providing a process fluid; contacting the surface of the semiconductor workpiece with the process fluid; and raising the semiconductor workpiece relative to the process fluid following the contacting.