Patents by Inventor Steven E. Levy

Steven E. Levy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat dissipating member for mounting a semiconductor device and electrical circuit unit incorporating the member
    Patent number: 4811166
    Abstract: A heat dissipating pad or support member for mounting a semiconductor device in an electrical circuit has a metal core with a relatively low coefficient of thermal expansion preferably lower than that of the semiconductor device and has a thermally conducting, corrosion resistant metal coating with relatively greater thermal conductivity than the core. The thermally conducting coating is metallurgically bonded to top, bottom and two lateral surfaces of the core with a selected thickness to cooperate with the core in providing an outer surface portion of the member over the top of the core having an effective coefficient of thermal expansion substantially corresponding to the semiconductor device to reliably mount the semiconductor device thereon.
    Type: Grant
    Filed: July 2, 1986
    Date of Patent: March 7, 1989
    Assignee: Texas Instruments Incorporated
    Inventors: Juan M. Alvarez, Henry F. Breit, Steven E. Levy, Premkumar R. Hingorany