Patents by Inventor Steven E. Minich

Steven E. Minich has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240006822
    Abstract: Electrical connectors for very high speed signals, including signals at or above 112 Gbps. Effectiveness of shielding along the signal paths through the mating electrical connectors may be enhanced through the use of one or more techniques, including enabling two-sided shielding, connections between shield members and between shield members and grounded structures of printed circuit boards to which the connectors are mounted, and selective positioning of lossy material. Such techniques may be simply and reliably implemented in high density connector using one or more techniques. An electrical connector may include core members held by a housing together with leadframe assemblies attached to the core members. The core members may include features that would be difficult to mold in a housing and may include both shields and lossy materials in locations that would be difficult to incorporate in a leadframe assembly.
    Type: Application
    Filed: September 12, 2023
    Publication date: January 4, 2024
    Applicant: FCI USA LLC
    Inventors: Douglas M. Johnescu, Gregory A. Hull, Mark E. Lauermann, Scott Martin, Jason John Ellison, Jan De Geest, Charles Cooper, Mark R. Gray, William Tanis, Steven E. Minich
  • Patent number: 11817657
    Abstract: A direct mate orthogonal connector for a high density of high speed signals. The connector may include right angle leadframe assemblies with signal conductive elements and ground shields held by a leadframe housing. High frequency performance may be achieved with members on the leadframe that transfer force between a connector housing, holding the leadframe assemblies, and a portion of the leadframe housing holding the signal conductive elements and the shields near their mounting ends. Core members may be inserted into the housing and mating ends of the conductive elements of ground shields may be adjacent the core members, enabling electrical and mechanical performance of the mating interface to be defined by the core members. The core members may incorporate insulative and lossy features that may be complex to form as part of the connector housing but may be readily formed as part of a separate core member.
    Type: Grant
    Filed: August 24, 2022
    Date of Patent: November 14, 2023
    Assignee: FCI USA LLC
    Inventors: Jason John Ellison, Douglas M. Johnescu, Gregory A. Hull, Mark E. Lauermann, Scott Martin, Jan De Geest, Scott Carbaugh, Steven E. Minich, Mark R. Gray, Charles Copper, William Tanis
  • Patent number: 11799246
    Abstract: Electrical connectors for very high speed signals, including signals at or above 112 Gbps. Effectiveness of shielding along the signal paths through the mating electrical connectors may be enhanced through the use of one or more techniques, including enabling two-sided shielding, connections between shield members and between shield members and grounded structures of printed circuit boards to which the connectors are mounted, and selective positioning of lossy material. Such techniques may be simply and reliably implemented in high density connector using one or more techniques. An electrical connector may include core members held by a housing together with leadframe assemblies attached to the core members. The core members may include features that would be difficult to mold in a housing and may include both shields and lossy materials in locations that would be difficult to incorporate in a leadframe assembly.
    Type: Grant
    Filed: September 2, 2022
    Date of Patent: October 24, 2023
    Assignee: FCI USA LLC
    Inventors: Douglas M. Johnescu, Gregory A. Hull, Mark E. Lauermann, Scott Martin, Jason John Ellison, Jan De Geest, Charles Copper, Mark R. Gray, William Tanis, Steven E. Minich
  • Patent number: 11791585
    Abstract: Electrical connectors for very high speed signals, including signals at frequencies at or above 112 GHz, with high density. Such connectors may be formed with fine features molded into portions of the connector housing to support closely spaced signal conductors. The signal conducts may nonetheless be accurately positioned, which leads to uniform impedance and other electrical characteristics that enable high frequency operation through the use of skeletal members that restrain bowing and twisting of housing components that position, directly or indirectly, the signal conductors. The skeletal members may be simply incorporated into the housing components by stamping a metal skeleton from a metal sheet in conjunction with one or more carrier strips. The housing component may be overmolded around the skeleton and then severed from the carrier strips.
    Type: Grant
    Filed: January 27, 2021
    Date of Patent: October 17, 2023
    Assignee: FCI USA LLC
    Inventors: James J. Muha, Scott Martin, Douglas M. Johnescu, Gregory A. Hull, Mark E. Lauermann, Jason John Ellison, Jan De Geest, Charles Copper, Mark R. Gray, William Tanis, Steven E. Minich
  • Publication number: 20230107361
    Abstract: Electrical connectors for very high speed signals, including signals at frequencies at or above 112 GHz, with high density. Such connectors may be formed with fine features molded into portions of the connector housing to support closely spaced signal conductors. The signal conducts may nonetheless be accurately positioned, which leads to uniform impedance and other electrical characteristics that enable high frequency operation through the use of skeletal members that restrain bowing and twisting of housing components that position, directly or indirectly, the signal conductors. The skeletal members may be simply incorporated into the housing components by stamping a metal skeleton from a metal sheet in conjunction with one or more carrier strips. The housing component may be overmolded around the skeleton and then severed from the carrier strips.
    Type: Application
    Filed: January 27, 2021
    Publication date: April 6, 2023
    Applicant: FCI USA LLC
    Inventors: James J. Muha, Scott Martin, Douglas M. Johnescu, Gregory A. Hull, Mark E. Lauermann, Jason John Ellison, Jan De Geest, Charles Copper, Mark R. Gray, William Tanis, Steven E. Minich
  • Publication number: 20230062661
    Abstract: Electrical connectors for very high speed signals, including signals at or above 112 Gbps. Effectiveness of shielding along the signal paths through the mating electrical connectors may be enhanced through the use of one or more techniques, including enabling two-sided shielding, connections between shield members and between shield members and grounded structures of printed circuit boards to which the connectors are mounted, and selective positioning of lossy material. Such techniques may be simply and reliably implemented in high density connector using one or more techniques. An electrical connector may include core members held by a housing together with leadframe assemblies attached to the core members. The core members may include features that would be difficult to mold in a housing and may include both shields and lossy materials in locations that would be difficult to incorporate in a leadframe assembly.
    Type: Application
    Filed: September 2, 2022
    Publication date: March 2, 2023
    Applicant: FCI USA LLC
    Inventors: Douglas M. Johnescu, Gregory A. Hull, Mark Lauermann, Scott Martin, Jason John Ellison, Jan De Geest, Charles Copper, Mark R. Gray, William Tanis, Steven E. Minich
  • Publication number: 20220407269
    Abstract: A direct mate orthogonal connector for a high density of high speed signals. The connector may include right angle leadframe assemblies with signal conductive elements and ground shields held by a leadframe housing. High frequency performance may be achieved with members on the leadframe that transfer force between a connector housing, holding the leadframe assemblies, and a portion of the leadframe housing holding the signal conductive elements and the shields near their mounting ends. Core members may be inserted into the housing and mating ends of the conductive elements of ground shields may be adjacent the core members, enabling electrical and mechanical performance of the mating interface to be defined by the core members. The core members may incorporate insulative and lossy features that may be complex to form as part of the connector housing but may be readily formed as part of a separate core member.
    Type: Application
    Filed: August 24, 2022
    Publication date: December 22, 2022
    Applicant: FCI USA LLC
    Inventors: Jason John Ellison, Douglas M. Johnescu, Gregory A. Hull, Mark E. Lauermann, Scott Martin, Jan De Geest, Scott Carbaugh, Steven E. Minich, Mark R. Gray, Charles Copper, William Tanis
  • Patent number: 11469553
    Abstract: Electrical connectors for very high speed signals, including signals at or above 112 Gbps. Effectiveness of shielding along the signal paths through the mating electrical connectors may be enhanced through the use of one or more techniques, including enabling two-sided shielding, connections between shield members and between shield members and grounded structures of printed circuit boards to which the connectors are mounted, and selective positioning of lossy material. Such techniques may be simply and reliably implemented in high density connector using one or more techniques. An electrical connector may include core members held by a housing together with leadframe assemblies attached to the core members. The core members may include features that would be difficult to mold in a housing and may include both shields and lossy materials in locations that would be difficult to incorporate in a leadframe assembly.
    Type: Grant
    Filed: January 26, 2021
    Date of Patent: October 11, 2022
    Assignee: FCI USA LLC
    Inventors: Douglas M. Johnescu, Gregory A. Hull, Mark E. Lauermann, Scott Martin, Jason John Ellison, Jan De Geest, Charles Copper, Mark R. Gray, William Tanis, Steven E. Minich
  • Patent number: 11469554
    Abstract: A direct mate orthogonal connector for a high density of high speed signals. The connector may include right angle leadframe assemblies with signal conductive elements and ground shields held by a leadframe housing. High frequency performance may be achieved with members on the leadframe that transfer force between a connector housing, holding the leadframe assemblies, and a portion of the leadframe housing holding the signal conductive elements and the shields near their mounting ends. Core members may be inserted into the housing and mating ends of the conductive elements of ground shields may be adjacent the core members, enabling electrical and mechanical performance of the mating interface to be defined by the core members. The core members may incorporate insulative and lossy features that may be complex to form as part of the connector housing but may be readily formed as part of a separate core member.
    Type: Grant
    Filed: January 26, 2021
    Date of Patent: October 11, 2022
    Assignee: FCI USA LLC
    Inventors: Jason John Ellison, Douglas M. Johnescu, Gregory A. Hull, Mark E. Lauermann, Scott Martin, Jan De Geest, Scott Carbaugh, Steven E. Minich, Mark R. Gray, Charles Copper, William Tanis
  • Publication number: 20210234315
    Abstract: A direct mate orthogonal connector for a high density of high speed signals. The connector may include right angle leadframe assemblies with signal conductive elements and ground shields held by a leadframe housing. High frequency performance may be achieved with members on the leadframe that transfer force between a connector housing, holding the leadframe assemblies, and a portion of the leadframe housing holding the signal conductive elements and the shields near their mounting ends. Core members may be inserted into the housing and mating ends of the conductive elements of ground shields may be adjacent the core members, enabling electrical and mechanical performance of the mating interface to be defined by the core members. The core members may incorporate insulative and lossy features that may be complex to form as part of the connector housing but may be readily formed as part of a separate core member.
    Type: Application
    Filed: January 26, 2021
    Publication date: July 29, 2021
    Applicant: FCI USA LLC
    Inventors: Jason John Ellison, Douglas M. Johnescu, Gregory A. Hull, Mark E. Lauermann, Scott Martin, Jan De Geest, Scott Carbaugh, Steven E. Minich, Mark R. Gray, Charles Copper, William Tanis
  • Publication number: 20210234314
    Abstract: Electrical connectors for very high speed signals, including signals at or above 112 Gbps. Effectiveness of shielding along the signal paths through the mating electrical connectors may be enhanced through the use of one or more techniques, including enabling two-sided shielding, connections between shield members and between shield members and grounded structures of printed circuit boards to which the connectors are mounted, and selective positioning of lossy material. Such techniques may be simply and reliably implemented in high density connector using one or more techniques. An electrical connector may include core members held by a housing together with leadframe assemblies attached to the core members. The core members may include features that would be difficult to mold in a housing and may include both shields and lossy materials in locations that would be difficult to incorporate in a leadframe assembly.
    Type: Application
    Filed: January 26, 2021
    Publication date: July 29, 2021
    Applicant: FCI USA LLC
    Inventors: Douglas M. Johnescu, Gregory A. Hull, Mark E. Lauermann, Scott Martin, Jason John Ellison, Jan De Geest, Charles Copper, Mark R. Gray, William Tanis, Steven E. Minich
  • Patent number: 10958001
    Abstract: A connector with contact tails configured to provide a connector footprint enabling a low cost printed circuit board. The contact tails are positioned to leave routing channels, parallel to an edge of a printed circuit board, within the connector footprint. The routing channels may enable routing of high speed signal traces out of the connector footprint on a small number of routing layers. In a connector with 16 columns, each with 8 pairs of signal traces, two routing layers may be adequate to route traces connecting all of the signal vias in the connector footprint to components at the interior of the printed circuit board.
    Type: Grant
    Filed: September 6, 2019
    Date of Patent: March 23, 2021
    Assignee: FCI USA LLC
    Inventor: Steven E. Minich
  • Patent number: 10770814
    Abstract: A direct mate orthogonal electrical connector assembly includes first and second electrical connectors configured to be mated to respective first and second substrates such that the second substrate is perpendicular to the first substrate.
    Type: Grant
    Filed: August 5, 2016
    Date of Patent: September 8, 2020
    Assignee: FCI USA LLC
    Inventors: Wilfred J. Swain, Steven E. Minich, Mark R. Gray
  • Patent number: 10714850
    Abstract: In accordance with one embodiment, first and second electrical connectors are configured as vertical electrical connectors that are configured to mate to each other so as to define a right angle electrical connector assembly. Ground shields and electrical contacts of various embodiments are also disclosed.
    Type: Grant
    Filed: July 27, 2016
    Date of Patent: July 14, 2020
    Assignee: FCI USA LLC
    Inventors: Steven E. Minich, Charles Copper
  • Publication number: 20200083625
    Abstract: A connector with contact tails configured to provide a connector footprint enabling a low cost printed circuit board. The contact tails are positioned to leave routing channels, parallel to an edge of a printed circuit board, within the connector footprint. The routing channels may enable routing of high speed signal traces out of the connector footprint on a small number of routing layers. In a connector with 16 columns, each with 8 pairs of signal traces, two routing layers may be adequate to route traces connecting all of the signal vias in the connector footprint to components at the interior of the printed circuit board.
    Type: Application
    Filed: September 6, 2019
    Publication date: March 12, 2020
    Applicant: FCI USA LLC
    Inventor: Steven E. Minich
  • Patent number: 10164361
    Abstract: A separator is configured to separate first and second printed circuit boards that are in electrical communication with each other through first and second pluralities of electrical connectors that are mounted to the first and second substrates, respectively, and mated to each other.
    Type: Grant
    Filed: January 13, 2016
    Date of Patent: December 25, 2018
    Assignee: FCI USA LLC
    Inventor: Steven E. Minich
  • Publication number: 20180342822
    Abstract: In accordance with one embodiment, first and second electrical connectors are configured as vertical electrical connectors that are configured to mate to each other so as to define a right angle electrical connector assembly. Ground shields and electrical contacts of various embodiments are also disclosed.
    Type: Application
    Filed: July 27, 2016
    Publication date: November 29, 2018
    Applicant: FCI USA LLC
    Inventors: Steven E. Minich, Charles Copper
  • Publication number: 20180269608
    Abstract: A separator is configured to separate first and second printed circuit boards that are in electrical communication with each other through first and second pluralities of electrical connectors that are mounted to the first and second substrates, respectively, and mated to each other.
    Type: Application
    Filed: January 13, 2016
    Publication date: September 20, 2018
    Applicant: FCI USA LLC
    Inventor: Steven E. Minich
  • Publication number: 20180219314
    Abstract: A direct mate orthogonal electrical connector assembly includes first and second electrical connectors configured to be mated to respective first and second substrates such that the second substrate is perpendicular to the first substrate.
    Type: Application
    Filed: August 5, 2016
    Publication date: August 2, 2018
    Applicant: FCI USA LLC
    Inventors: Wilfred J. Swain, Steven E. Minich, Mark R. Gray
  • Patent number: D817892
    Type: Grant
    Filed: February 1, 2016
    Date of Patent: May 15, 2018
    Assignee: FCI Americas Technology LLC
    Inventors: Jonathan E. Buck, Stuart C. Stoner, Steven E. Minich, Douglas M. Johnescu, Stephen B. Smith