Patents by Inventor Steven E. Monahan

Steven E. Monahan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Slurry containment device for polishing semiconductor wafers
    Patent number: 5299393
    Abstract: Liquid abrasive slurry for chemical-mechanical polishing of semiconductor wafers is held on a rotating polish table by a containment device having two continuous circular bonded strips of differing flexibilities. A releasable clamp seals the entire length of the more flexible strip to the table periphery.
    Type: Grant
    Filed: July 21, 1992
    Date of Patent: April 5, 1994
    Assignee: International Business Machines Corporation
    Inventors: Willard F. Chandler, LaVerne B. Jacobson, Robert D. Johnson, Steven E. Monahan
  • Method and apparatus for removing vapor from a pressurized sprayed liquid in the manufacture of semiconductor integrated circuits
    Patent number: 5279926
    Abstract: Pressurized liquid solvent is dispensed on specific areas of a semiconductor wafer. A vented accumulator removes bubbles introduced by an upstream needle valve. The accumulator outlet leads directly to a dispensing tip, without further pressure drop.
    Type: Grant
    Filed: May 6, 1992
    Date of Patent: January 18, 1994
    Assignee: International Business Machines Corporation
    Inventors: Willard F. Chandler, Robert D. Johnson, Steven E. Monahan, Ronald W. Olson
  • Anode plate for a parallel-plate reactive ion etching reactor
    Patent number: 4810322
    Abstract: An anode for a reactive ion etching (RIE) system has a plurality of holes formed therethrough. The holes produce a plasma glow about each hole which results in an increase in the etch rate of wafers to be etched on a cathode opposite the holes. The holes are arranged in the anode to provide a uniform etch rate on one wafer or a batch of wafers to be etched. By varying the pressure in the system, the presence of plasma glow and hence the etch rate uniformity is controlled.
    Type: Grant
    Filed: November 3, 1986
    Date of Patent: March 7, 1989
    Assignee: International Business Machines Corporation
    Inventors: George M. Gut, Steven E. Monahan