Patents by Inventor Steven English
Steven English has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250089996Abstract: A method of manufacturing an elevator of a medical device comprises using an additive manufacturing method, forming a pivot portion at a proximal end of the elevator. The pivot portion tapers proximally such that a proximalmost end of the elevator is thinner than more distal portions of the pivot portion. The method further comprises using the additive manufacturing method, forming a body of the elevator that is distal to the pivot portion. The elevator body includes a surface configured to contact an instrument inserted in a working channel of the medical device.Type: ApplicationFiled: December 4, 2024Publication date: March 20, 2025Applicant: Boston Scientific Scimed, Inc.Inventors: James ENGLISH, Liam RYAN, Robert HANNON, Mark MIRIGIAN, Adam LAROUCHE, Steven DELFOSSE, Stephen HALE
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Patent number: 10211093Abstract: An interconnect structure and a method to form an interconnect structure utilizes a high-aspect ratio single-damascene line and a non-damascene via. The interconnect includes a first single-damascene interconnect line disposed in a first interlayer dielectric layer, and a non-damascene via on the first single-damascene interconnect line that may be formed from cobalt, titanium and/or tungsten. A first SiCN layer may be formed on one or more sidewalls of the non-damascene via. A second single-damascene layer may be formed on the non-damascene via in which the second single-damascene layer may be disposed in a second interlayer dielectric layer. A second SiCN layer may be formed on at least part of an upper surface of the first single-damascene layer, and a third SiCN layer may be formed on at least part of an upper surface of the second single-damascene layer.Type: GrantFiled: September 9, 2016Date of Patent: February 19, 2019Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Ki-Don Lee, Daniel Sawyer, Steven English
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Publication number: 20180012796Abstract: An interconnect structure and a method to form an interconnect structure utilizes a high-aspect ratio single-damascene line and a non-damascene via. The interconnect includes a first single-damascene interconnect line disposed in a first interlayer dielectric layer, and a non-damascene via on the first single-damascene interconnect line that may be formed from cobalt, titanium and/or tungsten. A first SiCN layer may be formed on one or more sidewalls of the non-damascene via. A second single-damascene layer may be formed on the non-damascene via in which the second single-damascene layer may be disposed in a second interlayer dielectric layer. A second SiCN layer may be formed on at least part of an upper surface of the first single-damascene layer, and a third SiCN layer may be formed on at least part of an upper surface of the second single-damascene layer.Type: ApplicationFiled: September 9, 2016Publication date: January 11, 2018Inventors: Ki-Don LEE, Daniel SAWYER, Steven ENGLISH
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Patent number: 8847088Abstract: A busplug enclosure includes a body member includes a plurality of wall members that collectively define an interior chamber having an opening. The body member includes a line portion and a load portion. A cover assembly is mounted to the body member across the opening. The cover assembly includes a first cover member spanning the load portion and a second cover member spanning the line portion. A handle operating mechanism is mounted to the cover assembly. The handle operating mechanism includes a handle member configured to rotate about an axis extending through the cover assembly, a cam member and a slider member. The handle member is operatively coupled to the cam member and the slider member and configured and disposed to move between a first position and a second position.Type: GrantFiled: September 22, 2011Date of Patent: September 30, 2014Assignee: General Electric CompanyInventors: Kuldeep Kumar Bhathija, Jeffrey Lynn Cox, Shravan Purohit, Steven English Richard, Clarence Wilson Walker
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Patent number: 8785776Abstract: An electrical power distribution system is described. The system includes a ground busbar including a first opening defined therein and a busway housing including a second opening defined therein. The system also includes a fastener sealing system that includes a fastener and at least one seal. The fastener is configured to extend through the first opening and the second opening and to couple the ground busbar to the busway housing. The ground busbar contacts the busway housing, forming a ground connection therebetween.Type: GrantFiled: December 6, 2010Date of Patent: July 22, 2014Assignee: General Electric CompanyInventors: Steven English Richard, Mariusz Duda
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Publication number: 20130327570Abstract: A reducer joint for interconnecting different size busway sections is described. The reducer joint includes a stack of a plurality of rectangular conductive plates, and a cover coupled to the stack. The stack has a first end for coupling to a first plurality of busbars of a first busway section and a second end opposite the first end for coupling to a second plurality of busbars of a second busway section. The cover defines a first opening adjacent the first end of the stack, the first opening having a first size and configured to receive the first plurality of busbars. The cover defines a second opening adjacent the second end of the stack, the second opening having a second size and configured to receive the second plurality of busbars. The first size and the second size are not identical.Type: ApplicationFiled: June 6, 2012Publication date: December 12, 2013Inventors: Kuldeep Kumar Bhathija, Steven English Richard, Michael Richard Wood, Jeffery Lynn Cox
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Patent number: 8550830Abstract: A connector for interconnecting three busway sections is described. The connector includes a stack of substantially âTâ shaped plate conductors. At least two of the plate conductors are separated from one another by an insulator plate. The stack has a first end configured to couple to a first busway section, a second end configured to couple to a second busway section, and a third end configured to couple to a third busway section. The connector includes a top cover plate, a bottom cover plate, a top insulator plate, and a bottom insulator plate. The top insulator plate couples the top cover plate to the stack and the bottom insulator plate couples the bottom cover plate to the stack.Type: GrantFiled: June 1, 2012Date of Patent: October 8, 2013Assignee: General Electric CompanyInventors: Kuldeep Kumar Bhathija, Steven English Richard, Michael Richard Wood, Jeffery Lynn Cox, Shravan Purohit
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Publication number: 20130075239Abstract: A busplug enclosure includes a body member includes a plurality of wall members that collectively define an interior chamber having an opening. The body member includes a line portion and a load portion. A cover assembly is mounted to the body member across the opening. The cover assembly includes a first cover member spanning the load portion and a second cover member spanning the line portion. A handle operating mechanism is mounted to the cover assembly. The handle operating mechanism includes a handle member configured to rotate about an axis extending through the cover assembly, a cam member and a slider member.Type: ApplicationFiled: September 22, 2011Publication date: March 28, 2013Applicant: GENERAL ELECTRIC COMPANYInventors: Kuldeep Kumar Bhathija, Jeffrey Lynn Cox, Shravan Purohit, Steven English Richard, Clarence Wilson Walker
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Publication number: 20120138331Abstract: An electrical power distribution system is described. The system includes a ground busbar including a first opening defined therein and a busway housing including a second opening defined therein. The system also includes a fastener sealing system that includes a fastener and at least one seal. The fastener is configured to extend through the first opening and the second opening and to couple the ground busbar to the busway housing. The ground busbar contacts the busway housing, forming a ground connection therebetween.Type: ApplicationFiled: December 6, 2010Publication date: June 7, 2012Inventors: Steven English Richard, Mariusz Duda
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Patent number: 8163998Abstract: A flange end stub for an electrical busway system is provided. The flange end stub includes a flange plate having a first and second tab extending perpendicular to a first surface. A pair of joint side plates is coupled to the first and second tab with one or more conductors extending through the flange plate in between the joint side plates. A first and second bracket is coupled in between the joint side plates on either side of the conductors. Covers are mounted to the first and second brackets and extend over the conductors and any joint assembly that is attached. The covers and brackets cooperate to provide ingress protection.Type: GrantFiled: September 11, 2008Date of Patent: April 24, 2012Assignee: General Electric CompanyInventors: Kuldeep Kumar Bhathija, Jeffery Lynn Cox, Steven English Richard
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Publication number: 20100059276Abstract: A flange end stub for an electrical busway system is provided. The flange end stub includes a flange plate having a first and second tab extending perpendicular to a first surface. A pair of joint side plates is coupled to the first and second tab with one or more conductors extending through the flange plate in between the joint side plates. A first and second bracket is coupled in between the joint side plates on either side of the conductors. Covers are mounted to the first and second brackets and extend over the conductors and any joint assembly that is attached. The covers and brackets cooperate to provide ingress protection.Type: ApplicationFiled: September 11, 2008Publication date: March 11, 2010Applicant: GENERAL ELECTRIC COMPANYInventors: Kuldeep Kumar Bhathija, Jeffery Lynn Cox, Steven English Richard
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Patent number: 6787078Abstract: A process for producing a multi-layered article having a soft, leather-like feel comprising first introducing into a suitable mold a first liquid formulation designed to produce the top elastomeric layer on the finished article. A release agent is then applied on the elastomeric layer in the area where it is desired not to have adherence of the elastomer to the foam. Before the elastomeric layer is completely cured, a second liquid foam producing formulation, designed to produce a soft foam, is poured into the open mold. The elastomeric layer of the resulting article is integrally attached to the foam in the areas not containing the release agent.Type: GrantFiled: June 14, 2002Date of Patent: September 7, 2004Assignee: Dow Global Technologies Inc.Inventors: Steven English, Katherine J. Bladon, Jose Godoy, Alfredo B. Larre, Andrew M. Hogg
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Publication number: 20030098598Abstract: A process for producing a multi-layered article having a soft, leather-like feel comprising first introducing into a suitable mold a first liquid formulation designed to produce the top elastomeric layer on the finished article. A release agent is then applied on the elastomeric layer in the area where it is desired not to have adherence of the elastomer to the foam. Before the elastomeric layer is completely cured, a second liquid foam producing formulation, designed to produce a soft foam, is poured into the open mold. The elastomeric layer of the resulting article is integrally attached to the foam in the areas not containing the release agent.Type: ApplicationFiled: June 14, 2002Publication date: May 29, 2003Applicant: Dow Global Technologies Inc.Inventors: Steven English, Katherine J. Bladon, Jose Godoy, Alfredo B. Larre, Andrew M. Hogg