Abstract: A system for moving an object against a working surface of a finishing machine. A mounting platform is provided that is supported by a stationary frame. The mounting platform can only move reciprocally relative to the stationary frame along a linear line of motion. An articulating arm is mounted on the mounting platform and moves with the mounting platform. A linear actuator is provided having a first end coupled to the mounting platform and an opposite end mounted to the stationary frame. The linear actuator has a midline that is parallel to, and aligned with, the linear line of motion. A finishing machine is provided that has a working surface. The articulating arm touches objects to the working surface at a point of contact that is coplanar with the linear line of motion. This directs forces along the linear line of motion and into the linear actuator.

Abstract: A system and method for moving an object against a working surface of a finishing machine that is set in a fixed position. The object is moved in a precise movement pattern while following a precise contact pressure pattern. The object is moved against the working surface of the finishing machine using a robot with an articulating arm. Other movement is provided by a dynamic platform upon which the robot rests. The dynamic platform includes a linear slide that enables the robot to reciprocally move. The dynamic platform also includes an active contact flange that acts upon the linear slide. The active contact flange is programmable and imparts the contact pressure pattern to the object through the linear slide and the robot. A rotary table can also be provided that selectively rotates the robot, the linear slide and the active contact flange.

Abstract: A system and method for moving an object against a working surface of a finishing machine that is set in a fixed position. The object is moved in a precise movement pattern while following a precise contact pressure pattern. The object is moved against the working surface of the finishing machine using a robot with an articulating arm. Other movement is provided by a dynamic platform upon which the robot rests. The dynamic platform includes a linear slide that enables the robot to reciprocally move. The dynamic platform also includes an active contact flange that acts upon the linear slide. The active contact flange is programmable and imparts the contact pressure pattern to the object through the linear slide and the robot. A rotary table can also be provided that selectively rotates the robot, the linear slide and the active contact flange.

Abstract: A method of fabricating a semiconductor uses chemical vapor deposition, or plasma-enhanced chemical vapor deposition, to deposit an amorphous silicon film on an exposed surface of a substrate, such as ASIC wafer. The amorphous silicon film is doped with nitrogen to reduce the conductivity of the film and/or to augment the breakdown voltage of the film. Nitrogen gas, N2, is activated or ionized in a reactor before it is deposited on the substrate.

Abstract: A method of fabricating a semiconductor uses chemical vapor deposition, or plasma-enhanced chemical vapor deposition, to deposit an amorphous silicon film on an exposed surface of a substrate, such as ASIC wafer. The amorphous silicon film is doped with nitrogen to reduce the conductivity of the film and/or to augment the breakdown voltage of the film. Nitrogen gas, N2, is activated or ionized in a reactor before it is deposited on the substrate.