Abstract: A heat sink having a support base which supports a base plate is used to mount one or more device packages on a circuit board or the like. The support base is adapted to be secured to the circuit board. The base plate has opposed major faces adapted for mating with device packages. Tongues or clips secure individual device packages on the major faces of the base plate independently to that device packages may be removeably attached to either or both sides of the base plate.

Abstract: A heat spreader formed of copper or copper alloys is direct bonded to an electronic device package which includes a multilayer substrate formed of alternating layers of ceramic and metallic plating.

Abstract: Disclosed is a unitary heat sink apparatus in the form of a U-shaped body of thermally conductive material adapted for use in connection with semiconductor device packages having a thermally conductive transfer plate adjacent one major face of the device package. Typical of such device packages is the TO-220 plastic power package. One leg of the U-shaped clip urges the thermal transfer plate into intimate contact with a flat portion of the opposite leg by the spring action provided by the base of the U. An aperture in the base of the U allows the leads to extend from the heat sink. Fins are included on one leg of the heat sink and means for attaching the heat sink apparatus to printed circuit boards are also disclosed.

Abstract: Disclosed is a unitary heat sink apparatus for dissipating thermal energy generated by semiconductor devices encapsulated in an encapsulation device of the JEDEC TO-202 or Motorola Case 152 device case style. The heat sink is a unitary sheet metal device folded to form two opposed end plates joined by a central barrel portion which acts as a spring to urge the opposed faces of the end plates together. The thermal conductor tab extending from the encapsulation device is held between the opposed faces of the end plates.