Patents by Inventor Steven F. Frederick

Steven F. Frederick has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Return data path in an HFC network
    Patent number: 8978085
    Abstract: Described herein are devices and methods for facilitating the transmission of an upstream data signal from at least one subscriber in a communications network. The device is operable to receive a radio frequency (RF) signal from one or more subscribers. The RF signal includes at least one upstream data signal. The RF signal is demodulated into the upstream data signal by a RF demodulator in the device, which is then converted into an optical signal by an optical transducer in the device for transmission over a fiber optic link in the network.
    Type: Grant
    Filed: December 28, 2006
    Date of Patent: March 10, 2015
    Assignee: General Instrument Corporation
    Inventors: Dean A. Stoneback, Steven F. Frederick, Gary A. Picard
  • Return Data Path in an HFC Network
    Publication number: 20120198510
    Abstract: Described herein are devices and methods for facilitating the transmission of an upstream data signal from at least one subscriber in a communications network. The device is operable to receive a radio frequency (RF) signal from one or more subscribers. The RF signal includes at least one upstream data signal. The RF signal is demodulated into the upstream data signal by a RF demodulator in the device, which is then converted into an optical signal by an optical transducer in the device for transmission over a fiber optic link in the network.
    Type: Application
    Filed: December 28, 2006
    Publication date: August 2, 2012
    Applicant: GENERAL INSTRUMENT CORPORATION
    Inventors: Dean A. Stoneback, Steven F. Frederick, Gary A. Picard
  • Nested plug-in modules
    Patent number: 6711022
    Abstract: A modular electronic chassis system with nested electronic plug-in modules including at least one circuit board providing a first-module-receiving-location and a second-module-receiving-location such that the system is capable of supporting modules in a nested configuration having increased packaging density. A first plug-in module detachably engaged with the first-module-receiving-location. A second plug-in module detachably engaged with the second-module-receiving-location so that the first plug-in module and the second plug-in module are nested.
    Type: Grant
    Filed: May 13, 2002
    Date of Patent: March 23, 2004
    Assignee: General Instrument Corporation
    Inventors: Steven F. Frederick, Kimberly A. Smedley, Ronald L. Gebhardt, Jr., Douglas A. Tenney
  • Nested plug-in modules
    Patent number: 6700797
    Abstract: A modular electronic chassis system with nested electronic plug-in modules including at least one circuit board providing a first-module-receiving-location and a second-module-receiving-location such that the system is capable of supporting modules in a nested configuration having increased packaging density. A first plug-in module detachably engaged with the first-module-receiving-location. A second plug-in module detachably engaged with the second-module-receiving-location so that the first plug-in module and the second plug-in module are nested.
    Type: Grant
    Filed: October 17, 2001
    Date of Patent: March 2, 2004
    Assignee: General Instrument Corporation
    Inventors: Steven F. Frederick, Kimberley A. Smedley, Ronald L. Gebhardt, Jr., Douglas A. Tenney
  • Nested plug-in modules
    Publication number: 20020131249
    Abstract: A modular electronic chassis system with nested electronic plug-in modules including at least one circuit board providing a first-module-receiving-location and a second-module-receiving-location such that the system is capable of supporting modules in a nested configuration having increased packaging density. A first plug-in module detachably engaged with the first-module-receiving-location. A second plug-in module detachably engaged with the second-module-receiving-location so that the first plug-in module and the second plug-in module are nested.
    Type: Application
    Filed: May 13, 2002
    Publication date: September 19, 2002
    Applicant: General Instrument Corporation
    Inventors: Steven F. Frederick, Kimberley A. Smedley, Ronald L. Gebhardt, Douglas A. Tenney
  • Nested plug-in modules
    Publication number: 20020064034
    Abstract: A modular electronic chassis system with nested electronic plug-in modules including at least one circuit board providing a first-module-receiving-location and a second-module-receiving-location such that the system is capable of supporting modules in a nested configuration having increased packaging density. A first plug-in module detachably engaged with the first-module-receiving-location. A second plug-in module detachably engaged with the second-module-receiving-location so that the first plug-in module and the second plug-in module are nested.
    Type: Application
    Filed: October 17, 2001
    Publication date: May 30, 2002
    Applicant: General Instrument Corporation
    Inventors: Steven F. Frederick, Kimberley A. Smedley, Ronald L. Gebhardt, Douglas A. Tenney