Abstract: Means to increase the UPH of TAB bonding on an HSA manufacturing line to allow a higher UPH to keep cost down and also allow the use of one or more grounds to be add to an HSA to help control ESD without lowering the UPH or redesigning the lines through the use of a multi-head contact TAB bonding tool as described herein A bonding tool for use in tape automated bonding (TAB) is provided that is for multi-contact. The multi-contact TAB bonding tool is ESD safe so as not to damage a device being bonded.

Abstract: A flip chip bonding tool tip comprising a dissipative material with a resistance low enough to prevent a discharge of a charge to a device being bonded and high enough to avoid current flow large enough to damage the device being bonded is disclosed. Methods for manufacturing a dissipative material for use in a flip chip bonding tool tip are further disclosed.

Abstract: A flip chip bonding tool and ball placement capillary system comprising a dissipative material with a resistance low enough to prevent a discharge of a charge to a device being bonded and high enough to avoid current flow to the device being bonded is disclosed.

Abstract: A resistive bonding tool tip comprising a resistive material with a resistance low enough to prevent a discharge of a charge to a device being bonded and high enough to avoid current flow large enough to damage the device being bonded is disclosed.