Abstract: Large size multi-chip module packages are fitted with a new lid (1) formed of a Kovar™ (5) framed sheet of Alumina (3) no less than 0.04 inches thick to form a new “postless” MCM package 2 (FIG. 4 and FIG. 6) that is tolerant of differential pressures of at least one atmosphere and is reworkable. The rigidity of the Alumina sheet avoids the problem of excess deflection found in the prior lids for the package. It also permits elimination of internal lid support posts, freeing internal area within the MCM package that may be used to seat additional electronic circuitry and/or components.

Abstract: A reworkable multi-chip module contains a large multi-chip module package (2) with an opening at the top to permit access to an internal region for semiconductor devices, the opening being at least four square inches area with the length or width dimension being at least two inches. The opening is sealed with a stiff closure (1) of sufficient rigidity to withstand at least one atmosphere of differential pressure without significant deflection, is removable in a single piece and may be reinstalled. The closure includes a panel of electrically non-conductive material (3) and a metal flange (5) borders the periphery of the panel to support the panel on the top of the module package.

Abstract: A multi-chip module or other electronic semiconductor component (1) contains a multi-layer substrate (9) whose bottom surface, the bottom of the bottom layer (15) of that substrate, serves as the bonding surface for bonding the multi-chip module or component to a printed wiring board (8) using a thermally sensitive adhesive, such as a thermally sensitive adhesive or solder. The bottom layer (15) of that multi-layer substrate integrally includes a plurality of electrical heaters (16-28), arranged side by side. When energized with appropriate current, the heater generates sufficient heat to weaken the adhesive bond, allowing the MCM to be pulled away from the printed wiring board and removed, without weakening the bonding of the multiple layers of the laminate substrate or weakening the MCM component's bond to that substrate.