Patents by Inventor Steven G. Thummel
Steven G. Thummel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7951646Abstract: A method and apparatus for improving the laminate performance of the solder balls in a BGA package. Specifically, the ball pads on the substrate are configured to increase the shear force necessary to cause delamination of the solder balls. Conductive traces extending planarly from the pads and arranged in specified configurations will increase the shear strength of the pad.Type: GrantFiled: April 23, 2003Date of Patent: May 31, 2011Assignee: Round Rock Research, LLCInventors: Brad D. Rumsey, Patrick W. Tandy, Willam J. Reeder, Stephen F. Moxham, Steven G. Thummel, Dana A. Stoddard, Joseph C. Young
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Patent number: 7268013Abstract: A ball grid array (BGA) package that includes a central cavity for receiving a semiconductor die therein is disclosed. The die rests on a base laminate, the die side of which includes traces therein extending into the cavity, which is framed at least by an anisotropically conductive adhesive layer. Bond pads on the die are electrically connected, as by wire bonds or, in the case of a flip-chip configured die, solder balls or conductive adhesive elements, to the traces. The traces are, in turn, electrically connected through conductive vias to conductive element sites on the opposite side of the base laminate through a dielectric layer, the conductive element sites carrying solder balls or other discrete conductive bonding elements for connection to higher-level packaging.Type: GrantFiled: November 2, 2005Date of Patent: September 11, 2007Assignee: Micron Technology, Inc.Inventors: Jerry M. Brooks, Steven G. Thummel
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Patent number: 6989121Abstract: The upper and lower mold plates of a transfer molding machine are configured for one-side encapsulation of a pair of substrate mounted electronic devices having an opposite conductor-grid-array and/or bare heat sink/dissipater. A buffer member, optionally with cut-outs or apertures, may be placed between the two back-to-back substrates for protecting the grid-arrays and enabling encapsulation of devices with varying thicknesses without adjustment of the molding machine. Alternately, the upper and lower plates are configured for one-side encasement using covers of a pair of substrate mounted electronic devices having an opposite conductor-grid-array and/or bare heat sink/dissipater.Type: GrantFiled: August 4, 2003Date of Patent: January 24, 2006Assignee: Micron Technology, Inc.Inventor: Steven G. Thummel
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Patent number: 6982486Abstract: A ball grid array (BGA) package that includes a central cavity for receiving a semiconductor die therein is disclosed. The die rests on a base laminate, the die side of which includes traces therein extending into the cavity, which is framed at least by an anisotropically conductive adhesive layer. Bond pads on the die are electrically connected, as by wire bonds or, in the case of a flip-chip configured die, solder balls or conductive adhesive elements, to the traces. The traces are, in turn, electrically connected through conductive vias to conductive element sites on the opposite side of the base laminate through a dielectric layer, the conductive element sites carrying solder balls or other discrete conductive bonding elements for connection to higher-level packaging.Type: GrantFiled: May 17, 2004Date of Patent: January 3, 2006Assignee: Micron Technology, Inc.Inventors: Jerry M. Brooks, Steven G. Thummel
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Patent number: 6914326Abstract: A method and apparatus for improving the laminate performance of the solder balls in a BGA package. Specifically, the ball pads on the substrate are configured to increase the shear force necessary to cause delamination of the solder balls. Conductive traces extending planarly from the pads and arranged in specified configurations will increase the shear strength of the pad.Type: GrantFiled: April 23, 2003Date of Patent: July 5, 2005Assignee: Micron Technology, Inc.Inventors: Brad D. Rumsey, Patrick W. Tandy, Willam J. Reeder, Stephen F. Moxham, Steven G. Thummel, Dana A. Stoddard, Joseph C. Young
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Patent number: 6893244Abstract: The upper and lower mold plates of a transfer molding machine are configured for one-side encapsulation of a pair of substrate mounted electronic devices having an opposite conductor-grid-array and/or bare heat sink/dissipator. The pair of devices is positioned back-to-back within a single mold cavity for simultaneous encapsulation. A buffer member, optionally with cut-outs or apertures, may be placed between the two back-to-back substrates for protecting the grid-arrays and enabling encapsulation of devices with varying thicknesses without adjustment of the molding machine. Alternately, the upper and lower plates are configured for one-side encasement using covers of a pair of substrate mounted electronic devices having an opposite conductor-grid-array and/or bare heat sink/dissipator.Type: GrantFiled: August 11, 2003Date of Patent: May 17, 2005Assignee: Micron Technology, Inc.Inventor: Steven G. Thummel
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Publication number: 20040207064Abstract: A ball grid array (BGA) package that includes a central cavity for receiving a semiconductor die therein is disclosed. The die rests on a base laminate, the die side of which includes traces therein extending into the cavity, which is framed at least by an anisotropically conductive adhesive layer. Bond pads on the die are electrically connected, as by wire bonds or, in the case of a flip-chip configured die, solder balls or conductive adhesive elements, to the traces. The traces are, in turn, electrically connected through conductive vias to conductive element sites on the opposite side of the base laminate through a dielectric layer, the conductive element sites carrying solder balls or other discrete conductive bonding elements for connection to higher-level packaging.Type: ApplicationFiled: May 17, 2004Publication date: October 21, 2004Inventors: Jerry M. Brooks, Steven G. Thummel
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Patent number: 6740971Abstract: A ball grid array (BGA) package includes a central cavity for receiving a semiconductor die therein. The die rests on a base laminate, the die side of which includes traces therein extending into the cavity, which is framed at least by an anisotropically-conductive adhesive layer. Bond pads on the die are electrically connected, as by wire bonds or, in the case of a flip-chip configured die, solder balls or conductive adhesive elements, to the traces. The traces are, in turn, electrically connected through conductive vias to conductive element sites on the opposite side of the base laminate through a dielectric layer, the conductive element sites carrying solder balls or other discrete conductive bonding elements for connection to higher-level packaging.Type: GrantFiled: November 5, 2001Date of Patent: May 25, 2004Assignee: Micron Technology, Inc.Inventors: Jerry M. Brooks, Steven G. Thummel
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Publication number: 20040033283Abstract: The upper and lower mold plates of a transfer molding machine are configured for one-side encapsulation of a pair of substrate mounted electronic devices having an opposite conductor-grid-array and/or bare heat sink/dissipator. The pair of devices is positioned back-to-back within a single mold cavity for simultaneous encapsulation. A buffer member, optionally with cut-outs or apertures, may be placed between the two back-to-back substrates for protecting the grid-arrays and enabling encapsulation of devices with varying thicknesses without adjustment of the molding machine. Alternately, the upper and lower plates are configured for one-side encasement using covers of a pair of substrate mounted electronic devices having an opposite conductor-grid-array and/or bare heat sink/dissipator.Type: ApplicationFiled: August 11, 2003Publication date: February 19, 2004Inventor: Steven G. Thummel
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Publication number: 20040026823Abstract: The upper and lower mold plates of a transfer molding machine are configured for one-side encapsulation of a pair of substrate mounted electronic devices having an opposite conductor-grid-array and/or bare heat sink/dissipater. A buffer member, optionally with cut-outs or apertures, may be placed between the two back-to-back substrates for protecting the grid-arrays and enabling encapsulation of devices with varying thicknesses without adjustment of the molding machine. Alternately, the upper and lower plates are configured for one-side encasement using covers of a pair of substrate mounted electronic devices having an opposite conductor-grid-array and/or bare heat sink/dissipater.Type: ApplicationFiled: August 4, 2003Publication date: February 12, 2004Inventor: Steven G. Thummel
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Publication number: 20030205807Abstract: A method and apparatus for improving the laminate performance of the solder balls in a BGA package. Specifically, the ball pads on the substrate are configured to increase the shear force necessary to cause delamination of the solder balls. Conductive traces extending planarly from the pads and arranged in specified configurations will increase the shear strength of the pad.Type: ApplicationFiled: April 23, 2003Publication date: November 6, 2003Inventors: Brad D. Rumsey, Patrick W. Tandy, Willam J. Reeder, Stephen F. Moxham, Steven G. Thummel, Dana A. Stoddard, Joseph C. Young
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Publication number: 20030193089Abstract: A method and apparatus for improving the laminate performance of the solder balls in a BGA package. Specifically, the ball pads on the substrate are configured to increase the shear force necessary to cause delamination of the solder balls. Conductive traces extending planarly from the pads and arranged in specified configurations will increase the shear strength of the pad.Type: ApplicationFiled: April 23, 2003Publication date: October 16, 2003Inventors: Brad D. Rumsey, Patrick W. Tandy, Willam J. Reeder, Stephen F. Moxham, Steven G. Thummel, Dana A. Stoddard, Joseph C. Young
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Patent number: 6626656Abstract: The upper and lower mold plates of a transfer molding machine are configured for one-side encapsulation of a pair of substrate mounted electronic devices having an opposite conductor-grid-array and/or bare heat sink/dissipator. The pair of devices is positioned back-to-back within a single mold cavity for simultaneous encapsulation. A buffer member, optionally with cut-outs or apertures, may be placed between the two back-to-back substrates for protecting the grid-arrays and enabling encapsulation of devices with varying thicknesses without adjustment of the molding machine. Alternately, the upper and lower plates are configured for one-side encasement using covers of a pair of substrate mounted electronic devices having an opposite conductor-grid-array and/or bare heat sink/dissipator.Type: GrantFiled: November 13, 2001Date of Patent: September 30, 2003Assignee: Micron Technology, Inc.Inventor: Steven G. Thummel
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Patent number: 6616880Abstract: The upper and lower mold plates of a transfer molding machine are configured for one-side encapsulation of a pair of substrate mounted electronic devices having an opposite conductor-grid-array and/or bare heat sink/dissipator. A buffer member, optionally with cut-outs or apertures, may be placed between the two back-to-back substrates for protecting the grid-arrays and enabling encapsulation of devices with varying thicknesses without adjustment of the molding machine. Alternately, the upper and lower plates are configured for one-side encasement using covers of a pair of substrate mounted electronic devices having an opposite conductor-grid-array and/or bare heat sink/dissipator.Type: GrantFiled: August 1, 2001Date of Patent: September 9, 2003Assignee: Micron Technology, Inc.Inventor: Steven G. Thummel
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Patent number: 6577004Abstract: A method and apparatus for improving the laminate performance of the solder balls in a BGA package. Specifically, the ball pads on the substrate are configured to increase the shear force necessary to cause delamination of the solder balls. Conductive traces extending planarly from the pads and arranged in specified configurations will increase the shear strength of the pad.Type: GrantFiled: August 31, 2000Date of Patent: June 10, 2003Assignee: Micron Technology, Inc.Inventors: Brad D. Rumsey, Patrick W. Tandy, William J. Reeder, Stephen F. Moxham, Steven G. Thummel, Dana A. Stoddard, Joseph C. Young
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Publication number: 20020051831Abstract: The upper and lower mold plates of a transfer molding machine are configured for one-side encapsulation of a pair of substrate mounted electronic devices having an opposite conductor-grid-array and/or bare heat sink/dissipator. The pair of devices is positioned back-to-back within a single mold cavity for simultaneous encapsulation. A buffer member, optionally with cut-outs or apertures, may be placed between the two back-to-back substrates for protecting the grid-arrays and enabling encapsulation of devices with varying thicknesses without adjustment of the molding machine. Alternately, the upper and lower plates are configured for one-side encasement using covers of a pair of substrate mounted electronic devices having an opposite conductor-grid-array and/or bare heat sink/dissipator.Type: ApplicationFiled: November 13, 2001Publication date: May 2, 2002Inventor: Steven G. Thummel
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Publication number: 20020042160Abstract: A ball grid array (BGA) package includes a central cavity for receiving a semiconductor die therein. The die rests on a base laminate, the die side of which includes traces therein extending into the cavity, which is framed at least by an anisotropically-conductive adhesive layer. Bond pads on the die are electrically connected, as by wire bonds or, in the case of a flip-chip configured die, solder balls or conductive adhesive elements, to the traces. The traces are, in turn, electrically connected through conductive vias to conductive element sites on the opposite side of the base laminate through a dielectric layer, the conductive element sites carrying solder balls or other discrete conductive bonding elements for connection to higher-level packaging.Type: ApplicationFiled: November 5, 2001Publication date: April 11, 2002Inventors: Jerry M. Brooks, Steven G. Thummel
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Patent number: 6332766Abstract: The upper and lower mold plates of a transfer molding machine are configured for one-side encapsulation of a pair of substrate mounted electronic devices having an opposite conductor-grid-array and/or bare heat sink/dissipator. The pair of devices is positioned back-to-back within a single mold cavity for simultaneous encapsulation. A buffer member, optionally with cut-outs or apertures, may be placed between the two back-to-back substrates for protecting the grid-arrays and enabling encapsulation of devices with varying thicknesses without adjustment of the molding machine. Alternately, the upper and lower plates are configured for one-side encasement using covers of a pair of substrate mounted electronic devices having an opposite conductor-grid-array and/or bare heat sink/dissipator.Type: GrantFiled: July 29, 1999Date of Patent: December 25, 2001Assignee: Micron Technology, Inc.Inventor: Steven G. Thummel
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Patent number: 6326244Abstract: A ball grid array (BGA) package includes a central cavity for receiving a semiconductor die therein. The die rests on a base laminate, the die side of which includes traces therein extending into the cavity, which is framed at least by an anisotropically-conductive adhesive layer. Bond pads on the die are electrically connected, as by wire bonds or, in the case of a flip-chip configured die, solder balls or conductive adhesive elements, to the traces. The traces are in turn, electrically connected through conductive vias to conductive element sites on the opposite side of the base laminate through a dielectric layer, the conductive element sites carrying solder balls or other discrete conductive bonding elements for connection to higher-level packaging.Type: GrantFiled: May 9, 2000Date of Patent: December 4, 2001Assignee: Micron Technology, Inc.Inventors: Jerry M. Brooks, Steven G. Thummel
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Publication number: 20010045686Abstract: The upper and lower mold plates of a transfer molding machine are configured for one-side encapsulation of a pair of substrate mounted electronic devices having an opposite conductor-grid-array and/or bare heat sink/dissipator. A buffer member, optionally with cut-outs or apertures, may be placed between the two back-to-back substrates for protecting the grid-arrays and enabling encapsulation of devices with varying thicknesses without adjustment of the molding machine. Alternately, the upper and lower plates are configured for one-side encasement using covers of a pair of substrate mounted electronic devices having an opposite conductor-grid-array and/or bare heat sink/dissipator.Type: ApplicationFiled: August 1, 2001Publication date: November 29, 2001Inventor: Steven G. Thummel