Patents by Inventor Steven Goza

Steven Goza has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220259725
    Abstract: A method for reducing effluent buildup in a pumping exhaust system of a substrate processing system includes, during a substrate treatment process, arranging a substrate on a substrate support in a processing chamber; supplying one or more process gases to the processing chamber; supplying an inert dilution gas at a first flow rate to the pumping exhaust system; performing the substrate treatment process on the substrate in the processing chamber; evacuating reactants from the processing chamber using the pumping exhaust system. The method includes, after the substrate treatment process, supplying cleaning plasma including cleaning gas in the processing chamber during a cleaning process; and supplying the inert dilution gas at a second flow rate that is less than the first flow rate to the pumping exhaust system during the cleaning process.
    Type: Application
    Filed: May 5, 2022
    Publication date: August 18, 2022
    Inventors: Antonio XAVIER, Steven GOZA, Ramesh CHANDRASEKHARAN, Adrien LAVOIE, Joseph NESMITH
  • Patent number: 11332824
    Abstract: A method for reducing effluent buildup in a pumping exhaust system of a substrate processing system includes, during a substrate treatment process, arranging a substrate on a substrate support in a processing chamber; supplying one or more process gases to the processing chamber; supplying an inert dilution gas at a first flow rate to the pumping exhaust system; performing the substrate treatment process on the substrate in the processing chamber; evacuating reactants from the processing chamber using the pumping exhaust system. The method includes, after the substrate treatment process, supplying cleaning plasma including cleaning gas in the processing chamber during a cleaning process; and supplying the inert dilution gas at a second flow rate that is less than the first flow rate to the pumping exhaust system during the cleaning process.
    Type: Grant
    Filed: September 13, 2016
    Date of Patent: May 17, 2022
    Assignee: LAM RESEARCH CORPORATION
    Inventors: Antonio Xavier, Steven Goza, Ramesh Chandrasekharan, Adrien LaVoie, Joseph Nesmith
  • Publication number: 20180073137
    Abstract: A method for reducing effluent buildup in a pumping exhaust system of a substrate processing system includes, during a substrate treatment process, arranging a substrate on a substrate support in a processing chamber; supplying one or more process gases to the processing chamber; supplying an inert dilution gas at a first flow rate to the pumping exhaust system; performing substrate treatment on the substrate in the processing chamber; evacuating reactants from the processing chamber using a pumping exhaust system. The method includes, after the substrate treatment process, supplying cleaning plasma including cleaning gas in the processing chamber during a cleaning process; and supplying the inert dilution gas at a second flow rate that is less than the first flow rate to the pumping exhaust system during the cleaning process.
    Type: Application
    Filed: September 13, 2016
    Publication date: March 15, 2018
    Inventors: Antonio Xavier, Steven Goza, Ramesh Chandrasekharan, Adrien LaVoie, Joseph Nesmith