Patents by Inventor Steven Hsieh

Steven Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9559036
    Abstract: An integrated circuit package may include an integrated circuit die with lower and upper surfaces. The integrated circuit die is mounted on a package substrate. An underfill material is deposited between the integrated circuit die and the package substrate. A molding compound may be injected to surround the integrated circuit die while leaving the upper surface of the integrated circuit die exposed. The integrated circuit package further includes a metal layer that contacts the exposed upper surface of the integrated circuit die. The metal layer may also cover the molding compound. If desired, an additional metal layer may be formed on the layer of metal as a heat spreader. Such a configuration may also be applicable for wire bond packages, in which the metal layers are formed on an overmold that is disposed over a wire-bonded integrated circuit die on a package substrate.
    Type: Grant
    Filed: August 1, 2014
    Date of Patent: January 31, 2017
    Assignee: Altera Corporation
    Inventors: Steven Hsieh, Yuanlin Xie
  • Publication number: 20040213155
    Abstract: A data switching engine is provided. The data switching engine includes a switching processor used for data traffic forwarding and an traffic management processor used for data traffic management. The switching processor retains all functionality of currently deployed data switching equipment as it relates to data switching and forwarding. The traffic management processor performs data traffic characterization, statistics extraction, service level agreement enforcement, etc. The use of the traffic management processor reduces computational loads otherwise imposed on the switching processor while maintaining or surpassing levels of service provided by currently deployed data switching equipment.
    Type: Application
    Filed: March 29, 2001
    Publication date: October 28, 2004
    Applicant: Mitel Semiconductor V.N. Inc.
    Inventors: Li Xu, Steven Hsieh, Eric Lin
  • Publication number: 20030026246
    Abstract: Architecture for processing routing information in a data network. A set of routing information entries is provided in a routing database of a first storage location. A subset of the routing information entries is created in a second storage location, which subset of the routing information entries are in the structure of an IP tree. Packet routing information of an incoming packet is extracted, which packet routing information includes multiple byte parts. The second storage location is accessed to compare the multiple byte parts of the packet routing information sequentially with respective entries of the subset of routing information entries to determine forwarding information. The subset of routing information in the second location is adjusted dynamically in response to the availability of the packet routing information in the subset of routing information entries.
    Type: Application
    Filed: June 5, 2002
    Publication date: February 6, 2003
    Applicant: Zarlink Semiconductor V.N. Inc.
    Inventors: James Huang, Eric Lin, Steven Hsieh, James Yik, Ilya Dorfman, George Cravens