Abstract: The present invention provides a yield monitoring system for a slicing and packaging apparatus. In accordance with one embodiment of the system, the system includes at least one product input scale, a slicing mechanism for slicing the product after the product has been weighed on the at least one product input scale, and at least one product output scale capable of weighing the product after slicing by the slicing mechanism to determine a post-processing weight. A yield monitor is connected to electronically receive weight information corresponding to the weight of product weighed by the at least one product input scale and the at least one product output scale. The yield monitor uses the received weight information to provide system yield data to a user via a screen, print-out, electronic data, etc.. Preferably, the system also includes a makeweight scale that is disposed at a makeweight station. The makeweight scale is connected to electronically communicate makeweight data to the yield monitor.