Abstract: The laminate of the invention is provided with an etch stop to protect the laminate's adhesive layer. The etch stop also circumvents any etching interference due to degradation products which would arise from breakdown of the adhesive layer. The etch stop is a protective thin film in the form of a metal oxide, metal nitride, metal oxynitride, metal carbide or metal oxycarbide coating deposited on the back side of the metal sheet prior to lamination onto the substrate by means of an organic adhesive. The thin etch stop film is in the form of a blanket coating to assure adhesion to the metal surface and to the adhesive. It may be deposited onto the metal sheet by standard vacuum deposition techniques such as DC and magnetron sputtering, thermal and E-beam evaporation, chemical vapor deposition, and plasma enhanced chemical vapor deposition methods. The thin film thickness is flexible, and can range in thickness from tenths of angstroms to microns.

Abstract: A tubular housing is arranged for mounting to a forward bumper of an associated automobile for the storage of a jack structure therewithin for ease of transport and removal of the jack structure relative to the housing. A lock pin is directed through the housing and through the associated jack for the securement of the jack relative to the housing.

Abstract: A technique for defining the gap depth of a magnetic head utilizes side-by-side knife edges which point in generally opposite directions, and define thereby a reference gap depth. The resistance of a conductive layer beneath the structure which defines one knife edge is the analog of the gap depth.

Abstract: A magnetic bubble device is provided comprising a substrate, a device chip and interconnecting conductors for connecting the device chip to the substrate and for supporting the device chip on the substrate so that by providing a hole in the substrate and turning over the device chip, the active surface of the device chip is arranged substantially co-planar with the top surface of the substrate, thereby enabling a reduced height device to be obtained.